TWI266058B - Probe head, its assembly method and probe card - Google Patents
Probe head, its assembly method and probe cardInfo
- Publication number
- TWI266058B TWI266058B TW093103968A TW93103968A TWI266058B TW I266058 B TWI266058 B TW I266058B TW 093103968 A TW093103968 A TW 093103968A TW 93103968 A TW93103968 A TW 93103968A TW I266058 B TWI266058 B TW I266058B
- Authority
- TW
- Taiwan
- Prior art keywords
- slide
- along
- plane
- flat
- probe
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
-
- A—HUMAN NECESSITIES
- A23—FOODS OR FOODSTUFFS; TREATMENT THEREOF, NOT COVERED BY OTHER CLASSES
- A23L—FOODS, FOODSTUFFS, OR NON-ALCOHOLIC BEVERAGES, NOT COVERED BY SUBCLASSES A21D OR A23B-A23J; THEIR PREPARATION OR TREATMENT, e.g. COOKING, MODIFICATION OF NUTRITIVE QUALITIES, PHYSICAL TREATMENT; PRESERVATION OF FOODS OR FOODSTUFFS, IN GENERAL
- A23L11/00—Pulses, i.e. fruits of leguminous plants, for production of food; Products from legumes; Preparation or treatment thereof
- A23L11/05—Mashed or comminuted pulses or legumes; Products made therefrom
- A23L11/07—Soya beans, e.g. oil-extracted soya bean flakes
-
- A—HUMAN NECESSITIES
- A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
- A47J—KITCHEN EQUIPMENT; COFFEE MILLS; SPICE MILLS; APPARATUS FOR MAKING BEVERAGES
- A47J27/00—Cooking-vessels
-
- A—HUMAN NECESSITIES
- A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
- A47J—KITCHEN EQUIPMENT; COFFEE MILLS; SPICE MILLS; APPARATUS FOR MAKING BEVERAGES
- A47J36/00—Parts, details or accessories of cooking-vessels
-
- A—HUMAN NECESSITIES
- A23—FOODS OR FOODSTUFFS; TREATMENT THEREOF, NOT COVERED BY OTHER CLASSES
- A23C—DAIRY PRODUCTS, e.g. MILK, BUTTER OR CHEESE; MILK OR CHEESE SUBSTITUTES; MAKING THEREOF
- A23C11/00—Milk substitutes, e.g. coffee whitener compositions
- A23C11/02—Milk substitutes, e.g. coffee whitener compositions containing at least one non-milk component as source of fats or proteins
- A23C11/10—Milk substitutes, e.g. coffee whitener compositions containing at least one non-milk component as source of fats or proteins containing or not lactose but no other milk components as source of fats, carbohydrates or proteins
- A23C11/103—Milk substitutes, e.g. coffee whitener compositions containing at least one non-milk component as source of fats or proteins containing or not lactose but no other milk components as source of fats, carbohydrates or proteins containing only proteins from pulses, oilseeds or nuts, e.g. nut milk
-
- A—HUMAN NECESSITIES
- A23—FOODS OR FOODSTUFFS; TREATMENT THEREOF, NOT COVERED BY OTHER CLASSES
- A23C—DAIRY PRODUCTS, e.g. MILK, BUTTER OR CHEESE; MILK OR CHEESE SUBSTITUTES; MAKING THEREOF
- A23C20/00—Cheese substitutes
- A23C20/02—Cheese substitutes containing neither milk components, nor caseinate, nor lactose, as sources of fats, proteins or carbohydrates
- A23C20/025—Cheese substitutes containing neither milk components, nor caseinate, nor lactose, as sources of fats, proteins or carbohydrates mainly containing proteins from pulses or oilseeds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Engineering & Computer Science (AREA)
- Food Science & Technology (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Nutrition Science (AREA)
- Polymers & Plastics (AREA)
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Botany (AREA)
- Agronomy & Crop Science (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Tests Of Electronic Circuits (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003039710 | 2003-02-18 | ||
JP2003114391A JP2004309441A (ja) | 2003-02-18 | 2003-04-18 | プローブヘッド及びその組立方法並びにプローブカード |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200427989A TW200427989A (en) | 2004-12-16 |
TWI266058B true TWI266058B (en) | 2006-11-11 |
Family
ID=33455401
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW093103968A TWI266058B (en) | 2003-02-18 | 2004-02-18 | Probe head, its assembly method and probe card |
Country Status (5)
Country | Link |
---|---|
US (1) | US6998858B2 (zh) |
JP (1) | JP2004309441A (zh) |
KR (1) | KR100588026B1 (zh) |
CN (1) | CN100392409C (zh) |
TW (1) | TWI266058B (zh) |
Families Citing this family (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4721725B2 (ja) * | 2005-02-25 | 2011-07-13 | 山一電機株式会社 | プローブアッセンブリ |
JP4927391B2 (ja) * | 2005-11-25 | 2012-05-09 | 東京エレクトロン株式会社 | 接合方法 |
JP2007248064A (ja) * | 2006-03-13 | 2007-09-27 | Japan Electronic Materials Corp | 半導体素子検査装置 |
JP2007248322A (ja) * | 2006-03-17 | 2007-09-27 | Japan Electronic Materials Corp | プローブカード |
JP2007292469A (ja) * | 2006-04-20 | 2007-11-08 | Japan Electronic Materials Corp | カンチレバー型プローブカード |
JP4845031B2 (ja) * | 2006-11-10 | 2011-12-28 | 株式会社ヨコオ | 中継コネクター |
FI121100B (fi) * | 2006-11-10 | 2010-06-30 | Yokowo Seisakusho Kk | Releliitin |
DE102007054187B4 (de) * | 2006-11-27 | 2018-08-02 | Feinmetall Gmbh | Kontaktiervorrichtung zum Kontaktieren eines zu prüfenden elektrischen Prüflings sowie entsprechendes Kontaktierverfahren |
KR100844889B1 (ko) * | 2007-06-15 | 2008-07-09 | 주식회사 엔아이씨테크 | 프로브 카드용 프로브 조립체 |
KR100996924B1 (ko) * | 2008-04-21 | 2010-11-26 | 윌테크놀러지(주) | 프로브 기판 및 이를 포함하는 프로브 카드 |
KR20100069300A (ko) * | 2008-12-16 | 2010-06-24 | 삼성전자주식회사 | 프로브 카드와, 이를 이용한 반도체 디바이스 테스트 장치 및 방법 |
KR101003078B1 (ko) * | 2009-03-12 | 2010-12-21 | 주식회사 프로이천 | 필름형 패키지를 테스트하기 위한 프로브 카드 |
EP2237052A1 (en) * | 2009-03-31 | 2010-10-06 | Capres A/S | Automated multi-point probe manipulation |
WO2010125605A1 (ja) * | 2009-04-28 | 2010-11-04 | 株式会社アドバンテスト | 配線基板ユニットおよび試験装置 |
US8664969B2 (en) * | 2009-09-11 | 2014-03-04 | Probelogic, Inc. | Methods and apparatus for implementing electrical connectivity for electronic circuit testing |
TWI613453B (zh) | 2011-07-06 | 2018-02-01 | 色拉頓系統公司 | 具有一探針裝置之測試系統及轉位機構 |
US9364925B2 (en) * | 2012-04-30 | 2016-06-14 | Globalfoundries Inc. | Assembly of electronic and optical devices |
CN103176001B (zh) * | 2013-03-01 | 2016-03-02 | 苏州工业园区职业技术学院 | 一种检测探头及电压测量装置 |
CN104122446B (zh) * | 2013-04-26 | 2017-04-12 | 技嘉科技股份有限公司 | 电路板测试*** |
JP6255914B2 (ja) * | 2013-11-07 | 2018-01-10 | 日本電産リード株式会社 | 検査治具 |
TWI580970B (zh) * | 2015-07-06 | 2017-05-01 | Mpi Corp | Probe module (1) |
JP6961351B2 (ja) * | 2017-02-07 | 2021-11-05 | 株式会社日本マイクロニクス | 治具 |
CN111492254A (zh) * | 2017-12-26 | 2020-08-04 | 日本电产理德股份有限公司 | 基板检查装置 |
CN108387839A (zh) * | 2018-03-15 | 2018-08-10 | 昆山翰辉电子科技有限公司 | 线路板自动电测设备 |
TWI700503B (zh) * | 2019-11-20 | 2020-08-01 | 尹鑽科技有限公司 | 檢測模組及使用該檢測模組之檢測裝置 |
TWI700502B (zh) * | 2019-11-20 | 2020-08-01 | 尹鑽科技有限公司 | 檢測模組及使用該檢測模組之檢測裝置 |
CN111146124A (zh) * | 2019-12-27 | 2020-05-12 | 上海华岭集成电路技术股份有限公司 | 一种扩大芯片自动筛选及测试接触面的优化装置 |
CN114167094B (zh) * | 2021-11-29 | 2023-03-24 | 强一半导体(苏州)有限公司 | 一种薄膜探针卡及其探针头 |
TWI788149B (zh) * | 2021-12-20 | 2022-12-21 | 漢民測試系統股份有限公司 | 探針卡 |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS554573U (zh) * | 1978-06-23 | 1980-01-12 | ||
US4719417A (en) * | 1983-05-03 | 1988-01-12 | Wentworth Laboratories, Inc. | Multi-level test probe assembly for IC chips |
JPH05113460A (ja) * | 1991-10-22 | 1993-05-07 | Tokyo Electron Yamanashi Kk | 液晶デイスプレイ基板の検査装置 |
US5416429A (en) | 1994-05-23 | 1995-05-16 | Wentworth Laboratories, Inc. | Probe assembly for testing integrated circuits |
JPH0823013A (ja) * | 1994-07-05 | 1996-01-23 | Aging Tesuta Kaihatsu Kyodo Kumiai | ウエハー用プローバ |
US5912555A (en) * | 1995-04-10 | 1999-06-15 | Tokyo Electron Limited | Probe apparatus |
SG55211A1 (en) * | 1995-07-05 | 1998-12-21 | Tokyo Electron Ltd | Testing apparatus |
US6551844B1 (en) * | 1997-01-15 | 2003-04-22 | Formfactor, Inc. | Test assembly including a test die for testing a semiconductor product die |
JPH10300784A (ja) | 1997-04-28 | 1998-11-13 | Mitsubishi Materials Corp | コンタクトプローブ組立用装置 |
JPH10339740A (ja) * | 1997-06-09 | 1998-12-22 | Mitsubishi Materials Corp | プローブ装置 |
JP2000046869A (ja) | 1998-07-28 | 2000-02-18 | Mitsubishi Materials Corp | コンタクトプローブの組立方法および組立用装置 |
JP3538696B2 (ja) | 1998-08-20 | 2004-06-14 | ジェネシス・テクノロジー株式会社 | プローブ装置の組立方法 |
US6100707A (en) * | 1998-09-25 | 2000-08-08 | Electro Scientific Industries, Inc. | Apparatus for testing multi-terminal electronic components |
TW434407B (en) * | 1999-04-07 | 2001-05-16 | Nihon Micronics Kk | Probe card |
JP2000329788A (ja) | 1999-05-21 | 2000-11-30 | Advantest Corp | プローブカード及び試験装置 |
JP2001296313A (ja) * | 2000-04-12 | 2001-10-26 | Micronics Japan Co Ltd | プローブ装置 |
JP2001356134A (ja) * | 2000-04-13 | 2001-12-26 | Innotech Corp | プローブカード装置およびそれに用いられるプローブ |
JP4504541B2 (ja) * | 2000-09-08 | 2010-07-14 | 株式会社ヨコオ | プローブ装置 |
JP2002286756A (ja) * | 2001-03-27 | 2002-10-03 | Mitsubishi Materials Corp | プローブ装置 |
JP2002323538A (ja) * | 2001-04-25 | 2002-11-08 | Mitsubishi Materials Corp | プローブ装置 |
-
2003
- 2003-04-18 JP JP2003114391A patent/JP2004309441A/ja active Pending
-
2004
- 2004-02-17 KR KR1020040010228A patent/KR100588026B1/ko not_active IP Right Cessation
- 2004-02-18 US US10/779,882 patent/US6998858B2/en not_active Expired - Fee Related
- 2004-02-18 TW TW093103968A patent/TWI266058B/zh not_active IP Right Cessation
- 2004-02-18 CN CNB2004100054328A patent/CN100392409C/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US20040239351A1 (en) | 2004-12-02 |
KR20040074945A (ko) | 2004-08-26 |
KR100588026B1 (ko) | 2006-06-12 |
JP2004309441A (ja) | 2004-11-04 |
TW200427989A (en) | 2004-12-16 |
US6998858B2 (en) | 2006-02-14 |
CN1523361A (zh) | 2004-08-25 |
CN100392409C (zh) | 2008-06-04 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |