TWI266058B - Probe head, its assembly method and probe card - Google Patents

Probe head, its assembly method and probe card

Info

Publication number
TWI266058B
TWI266058B TW093103968A TW93103968A TWI266058B TW I266058 B TWI266058 B TW I266058B TW 093103968 A TW093103968 A TW 093103968A TW 93103968 A TW93103968 A TW 93103968A TW I266058 B TWI266058 B TW I266058B
Authority
TW
Taiwan
Prior art keywords
slide
along
plane
flat
probe
Prior art date
Application number
TW093103968A
Other languages
English (en)
Other versions
TW200427989A (en
Inventor
Shuichi Sawada
Masaya Tsuchie
Original Assignee
Yamaichi Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yamaichi Electronics Co Ltd filed Critical Yamaichi Electronics Co Ltd
Publication of TW200427989A publication Critical patent/TW200427989A/zh
Application granted granted Critical
Publication of TWI266058B publication Critical patent/TWI266058B/zh

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2886Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
    • AHUMAN NECESSITIES
    • A23FOODS OR FOODSTUFFS; TREATMENT THEREOF, NOT COVERED BY OTHER CLASSES
    • A23LFOODS, FOODSTUFFS, OR NON-ALCOHOLIC BEVERAGES, NOT COVERED BY SUBCLASSES A21D OR A23B-A23J; THEIR PREPARATION OR TREATMENT, e.g. COOKING, MODIFICATION OF NUTRITIVE QUALITIES, PHYSICAL TREATMENT; PRESERVATION OF FOODS OR FOODSTUFFS, IN GENERAL
    • A23L11/00Pulses, i.e. fruits of leguminous plants, for production of food; Products from legumes; Preparation or treatment thereof
    • A23L11/05Mashed or comminuted pulses or legumes; Products made therefrom
    • A23L11/07Soya beans, e.g. oil-extracted soya bean flakes
    • AHUMAN NECESSITIES
    • A47FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
    • A47JKITCHEN EQUIPMENT; COFFEE MILLS; SPICE MILLS; APPARATUS FOR MAKING BEVERAGES
    • A47J27/00Cooking-vessels
    • AHUMAN NECESSITIES
    • A47FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
    • A47JKITCHEN EQUIPMENT; COFFEE MILLS; SPICE MILLS; APPARATUS FOR MAKING BEVERAGES
    • A47J36/00Parts, details or accessories of cooking-vessels
    • AHUMAN NECESSITIES
    • A23FOODS OR FOODSTUFFS; TREATMENT THEREOF, NOT COVERED BY OTHER CLASSES
    • A23CDAIRY PRODUCTS, e.g. MILK, BUTTER OR CHEESE; MILK OR CHEESE SUBSTITUTES; MAKING THEREOF
    • A23C11/00Milk substitutes, e.g. coffee whitener compositions
    • A23C11/02Milk substitutes, e.g. coffee whitener compositions containing at least one non-milk component as source of fats or proteins
    • A23C11/10Milk substitutes, e.g. coffee whitener compositions containing at least one non-milk component as source of fats or proteins containing or not lactose but no other milk components as source of fats, carbohydrates or proteins
    • A23C11/103Milk substitutes, e.g. coffee whitener compositions containing at least one non-milk component as source of fats or proteins containing or not lactose but no other milk components as source of fats, carbohydrates or proteins containing only proteins from pulses, oilseeds or nuts, e.g. nut milk
    • AHUMAN NECESSITIES
    • A23FOODS OR FOODSTUFFS; TREATMENT THEREOF, NOT COVERED BY OTHER CLASSES
    • A23CDAIRY PRODUCTS, e.g. MILK, BUTTER OR CHEESE; MILK OR CHEESE SUBSTITUTES; MAKING THEREOF
    • A23C20/00Cheese substitutes
    • A23C20/02Cheese substitutes containing neither milk components, nor caseinate, nor lactose, as sources of fats, proteins or carbohydrates
    • A23C20/025Cheese substitutes containing neither milk components, nor caseinate, nor lactose, as sources of fats, proteins or carbohydrates mainly containing proteins from pulses or oilseeds
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched

Landscapes

  • Engineering & Computer Science (AREA)
  • Food Science & Technology (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Nutrition Science (AREA)
  • Polymers & Plastics (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Botany (AREA)
  • Agronomy & Crop Science (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
TW093103968A 2003-02-18 2004-02-18 Probe head, its assembly method and probe card TWI266058B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003039710 2003-02-18
JP2003114391A JP2004309441A (ja) 2003-02-18 2003-04-18 プローブヘッド及びその組立方法並びにプローブカード

Publications (2)

Publication Number Publication Date
TW200427989A TW200427989A (en) 2004-12-16
TWI266058B true TWI266058B (en) 2006-11-11

Family

ID=33455401

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093103968A TWI266058B (en) 2003-02-18 2004-02-18 Probe head, its assembly method and probe card

Country Status (5)

Country Link
US (1) US6998858B2 (zh)
JP (1) JP2004309441A (zh)
KR (1) KR100588026B1 (zh)
CN (1) CN100392409C (zh)
TW (1) TWI266058B (zh)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4721725B2 (ja) * 2005-02-25 2011-07-13 山一電機株式会社 プローブアッセンブリ
JP4927391B2 (ja) * 2005-11-25 2012-05-09 東京エレクトロン株式会社 接合方法
JP2007248064A (ja) * 2006-03-13 2007-09-27 Japan Electronic Materials Corp 半導体素子検査装置
JP2007248322A (ja) * 2006-03-17 2007-09-27 Japan Electronic Materials Corp プローブカード
JP2007292469A (ja) * 2006-04-20 2007-11-08 Japan Electronic Materials Corp カンチレバー型プローブカード
JP4845031B2 (ja) * 2006-11-10 2011-12-28 株式会社ヨコオ 中継コネクター
FI121100B (fi) * 2006-11-10 2010-06-30 Yokowo Seisakusho Kk Releliitin
DE102007054187B4 (de) * 2006-11-27 2018-08-02 Feinmetall Gmbh Kontaktiervorrichtung zum Kontaktieren eines zu prüfenden elektrischen Prüflings sowie entsprechendes Kontaktierverfahren
KR100844889B1 (ko) * 2007-06-15 2008-07-09 주식회사 엔아이씨테크 프로브 카드용 프로브 조립체
KR100996924B1 (ko) * 2008-04-21 2010-11-26 윌테크놀러지(주) 프로브 기판 및 이를 포함하는 프로브 카드
KR20100069300A (ko) * 2008-12-16 2010-06-24 삼성전자주식회사 프로브 카드와, 이를 이용한 반도체 디바이스 테스트 장치 및 방법
KR101003078B1 (ko) * 2009-03-12 2010-12-21 주식회사 프로이천 필름형 패키지를 테스트하기 위한 프로브 카드
EP2237052A1 (en) * 2009-03-31 2010-10-06 Capres A/S Automated multi-point probe manipulation
WO2010125605A1 (ja) * 2009-04-28 2010-11-04 株式会社アドバンテスト 配線基板ユニットおよび試験装置
US8664969B2 (en) * 2009-09-11 2014-03-04 Probelogic, Inc. Methods and apparatus for implementing electrical connectivity for electronic circuit testing
TWI613453B (zh) 2011-07-06 2018-02-01 色拉頓系統公司 具有一探針裝置之測試系統及轉位機構
US9364925B2 (en) * 2012-04-30 2016-06-14 Globalfoundries Inc. Assembly of electronic and optical devices
CN103176001B (zh) * 2013-03-01 2016-03-02 苏州工业园区职业技术学院 一种检测探头及电压测量装置
CN104122446B (zh) * 2013-04-26 2017-04-12 技嘉科技股份有限公司 电路板测试***
JP6255914B2 (ja) * 2013-11-07 2018-01-10 日本電産リード株式会社 検査治具
TWI580970B (zh) * 2015-07-06 2017-05-01 Mpi Corp Probe module (1)
JP6961351B2 (ja) * 2017-02-07 2021-11-05 株式会社日本マイクロニクス 治具
CN111492254A (zh) * 2017-12-26 2020-08-04 日本电产理德股份有限公司 基板检查装置
CN108387839A (zh) * 2018-03-15 2018-08-10 昆山翰辉电子科技有限公司 线路板自动电测设备
TWI700503B (zh) * 2019-11-20 2020-08-01 尹鑽科技有限公司 檢測模組及使用該檢測模組之檢測裝置
TWI700502B (zh) * 2019-11-20 2020-08-01 尹鑽科技有限公司 檢測模組及使用該檢測模組之檢測裝置
CN111146124A (zh) * 2019-12-27 2020-05-12 上海华岭集成电路技术股份有限公司 一种扩大芯片自动筛选及测试接触面的优化装置
CN114167094B (zh) * 2021-11-29 2023-03-24 强一半导体(苏州)有限公司 一种薄膜探针卡及其探针头
TWI788149B (zh) * 2021-12-20 2022-12-21 漢民測試系統股份有限公司 探針卡

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS554573U (zh) * 1978-06-23 1980-01-12
US4719417A (en) * 1983-05-03 1988-01-12 Wentworth Laboratories, Inc. Multi-level test probe assembly for IC chips
JPH05113460A (ja) * 1991-10-22 1993-05-07 Tokyo Electron Yamanashi Kk 液晶デイスプレイ基板の検査装置
US5416429A (en) 1994-05-23 1995-05-16 Wentworth Laboratories, Inc. Probe assembly for testing integrated circuits
JPH0823013A (ja) * 1994-07-05 1996-01-23 Aging Tesuta Kaihatsu Kyodo Kumiai ウエハー用プローバ
US5912555A (en) * 1995-04-10 1999-06-15 Tokyo Electron Limited Probe apparatus
SG55211A1 (en) * 1995-07-05 1998-12-21 Tokyo Electron Ltd Testing apparatus
US6551844B1 (en) * 1997-01-15 2003-04-22 Formfactor, Inc. Test assembly including a test die for testing a semiconductor product die
JPH10300784A (ja) 1997-04-28 1998-11-13 Mitsubishi Materials Corp コンタクトプローブ組立用装置
JPH10339740A (ja) * 1997-06-09 1998-12-22 Mitsubishi Materials Corp プローブ装置
JP2000046869A (ja) 1998-07-28 2000-02-18 Mitsubishi Materials Corp コンタクトプローブの組立方法および組立用装置
JP3538696B2 (ja) 1998-08-20 2004-06-14 ジェネシス・テクノロジー株式会社 プローブ装置の組立方法
US6100707A (en) * 1998-09-25 2000-08-08 Electro Scientific Industries, Inc. Apparatus for testing multi-terminal electronic components
TW434407B (en) * 1999-04-07 2001-05-16 Nihon Micronics Kk Probe card
JP2000329788A (ja) 1999-05-21 2000-11-30 Advantest Corp プローブカード及び試験装置
JP2001296313A (ja) * 2000-04-12 2001-10-26 Micronics Japan Co Ltd プローブ装置
JP2001356134A (ja) * 2000-04-13 2001-12-26 Innotech Corp プローブカード装置およびそれに用いられるプローブ
JP4504541B2 (ja) * 2000-09-08 2010-07-14 株式会社ヨコオ プローブ装置
JP2002286756A (ja) * 2001-03-27 2002-10-03 Mitsubishi Materials Corp プローブ装置
JP2002323538A (ja) * 2001-04-25 2002-11-08 Mitsubishi Materials Corp プローブ装置

Also Published As

Publication number Publication date
US20040239351A1 (en) 2004-12-02
KR20040074945A (ko) 2004-08-26
KR100588026B1 (ko) 2006-06-12
JP2004309441A (ja) 2004-11-04
TW200427989A (en) 2004-12-16
US6998858B2 (en) 2006-02-14
CN1523361A (zh) 2004-08-25
CN100392409C (zh) 2008-06-04

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Legal Events

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MM4A Annulment or lapse of patent due to non-payment of fees