JP4845031B2 - 中継コネクター - Google Patents
中継コネクター Download PDFInfo
- Publication number
- JP4845031B2 JP4845031B2 JP2006305364A JP2006305364A JP4845031B2 JP 4845031 B2 JP4845031 B2 JP 4845031B2 JP 2006305364 A JP2006305364 A JP 2006305364A JP 2006305364 A JP2006305364 A JP 2006305364A JP 4845031 B2 JP4845031 B2 JP 4845031B2
- Authority
- JP
- Japan
- Prior art keywords
- pin block
- connector
- inspected
- pin
- block
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000523 sample Substances 0.000 claims description 57
- 238000003780 insertion Methods 0.000 claims description 30
- 230000037431 insertion Effects 0.000 claims description 30
- 239000000758 substrate Substances 0.000 claims description 24
- 125000006850 spacer group Chemical group 0.000 claims description 21
- 239000011810 insulating material Substances 0.000 claims description 8
- 238000013459 approach Methods 0.000 claims description 7
- 238000000926 separation method Methods 0.000 claims description 7
- 238000003825 pressing Methods 0.000 description 39
- 238000007689 inspection Methods 0.000 description 12
- 238000005259 measurement Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 230000010355 oscillation Effects 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R29/00—Coupling parts for selective co-operation with a counterpart in different ways to establish different circuits, e.g. for voltage selection, for series-parallel selection, programmable connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R31/00—Coupling parts supported only by co-operation with counterpart
- H01R31/06—Intermediate parts for linking two coupling parts, e.g. adapter
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0416—Connectors, terminals
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
- G01R31/66—Testing of connections, e.g. of plugs or non-disconnectable joints
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
- Measuring Leads Or Probes (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Tests Of Electronic Circuits (AREA)
Description
12 ヒンジ部材
12a リブ
14 押圧操作部材
14a 係合突起
14b 斜めの面
14d 調整用孔
16 揺動軸
18 押圧バネ
20 第2の揺動バネ
22 押圧ブロック
24 ピンブロック
26 フローティングガイド
26a 基板搭載面
26b ガイド孔
26c 凹部
28 配線基板
28a ネジ
28b 端子パターン
30 リニアガイド
30a リニアシャフト
30b リニア筒部材
32 フローティングピン
32a 調整ネジ
34 フロートバネ
36 被検査基板
38 被検査側コネクタ
38a 端子
40 下ピンブロック
42 上ピンブロック
42a 凸部
46、52 プローブ孔
48a 下位置調整ブロック
48b 上位置調整ブロック
50 挿入孔
54 プローブ
56 位置だしピン
58 CCDカメラ素子
60 検査装置
62 レンズ
64 スペーサ
Claims (3)
- 被検査基板に配設された被検査側コネクタに2列で配列された端子にプローブを当接させて測定器に電気的接続させるための中継コネクターであって、絶縁材からなる第1のピンブロックに前記被検査側コネクタの一方の1列に配列された端子に当接するようにプローブを配設し、絶縁材からなる第2のピンブロックに前記被検査側コネクタの他方の1列に配列された端子に当接するようにプローブを配設し、前記第1と第2のピンブロックを相対的に接近分離可能に形成し、前記第1と第2のピンブロックに配設した前記プローブが、前記被検査側コネクタの2列に配列された端子にそれぞれ当接するように、前記第1と第2のピンブロックの間の距離を調整して固定するように構成したことを特徴とする中継コネクター。
- 請求項1記載の中継コネクターにおいて、前記第1のピンブロックに前記第2のピンブロックを挿入して前記接近分離方向にのみ移動できる挿入孔を穿設し、前記挿入孔に挿入した状態で前記第2のピンブロックの位置を調整し、前記接近分離方向と直交する位置だしピンを前記挿入孔の外側から前記挿入孔の壁を貫通して前記第2のピンブロックに挿入して、前記第1のピンブロックに前記第2のピンブロックを固定するように構成したことを特徴とする中継コネクター。
- 請求項1記載の中継コネクターにおいて、前記第1のピンブロックに前記第2のピンブロックを挿入して前記接近分離方向にのみ移動できる挿入孔を穿設し、前記挿入孔の前記接近分離方向の接近方向の内壁と前記第2のピンブロックの間にスペーサを介装し、前記第2のピンブロックを前記スペーサの方向に押し付けて固定し、前記スペーサの厚さを調整することで前記第2のピンブロックの位置を調整するように構成したことを特徴とする中継コネクター。
Priority Applications (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006305364A JP4845031B2 (ja) | 2006-11-10 | 2006-11-10 | 中継コネクター |
US11/979,733 US7568957B2 (en) | 2006-11-10 | 2007-11-07 | Relay connector |
FI20070847A FI121693B (fi) | 2006-11-10 | 2007-11-08 | Releliitin |
TW096142362A TWI376852B (en) | 2006-11-10 | 2007-11-09 | Relay connector |
SE0702467A SE532151C2 (sv) | 2006-11-10 | 2007-11-09 | Reläkontakt för elektrisk anslutning av ett kontaktdon som skall inspekteras |
KR1020070114326A KR101059177B1 (ko) | 2006-11-10 | 2007-11-09 | 중계 커넥터 |
SE0702468A SE532247C8 (sv) | 2006-11-10 | 2007-11-09 | Reläkontakt för elektrisk anslutning av ett kontaktdon som skall inspekteras |
CN2007101863554A CN101178427B (zh) | 2006-11-10 | 2007-11-12 | 中继连接器 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006305364A JP4845031B2 (ja) | 2006-11-10 | 2006-11-10 | 中継コネクター |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008123795A JP2008123795A (ja) | 2008-05-29 |
JP4845031B2 true JP4845031B2 (ja) | 2011-12-28 |
Family
ID=38786634
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006305364A Active JP4845031B2 (ja) | 2006-11-10 | 2006-11-10 | 中継コネクター |
Country Status (7)
Country | Link |
---|---|
US (1) | US7568957B2 (ja) |
JP (1) | JP4845031B2 (ja) |
KR (1) | KR101059177B1 (ja) |
CN (1) | CN101178427B (ja) |
FI (1) | FI121693B (ja) |
SE (2) | SE532247C8 (ja) |
TW (1) | TWI376852B (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4783825B2 (ja) * | 2008-11-01 | 2011-09-28 | 株式会社ヨコオ | クリップ式中継コネクタ |
JP5579547B2 (ja) | 2010-09-07 | 2014-08-27 | 株式会社ヨコオ | コネクタ接続用検査治具 |
JP6627655B2 (ja) * | 2016-06-17 | 2020-01-08 | オムロン株式会社 | ソケット |
CN106153988A (zh) * | 2016-06-24 | 2016-11-23 | 段超毅 | 接触导通结构、接触导通装置和板对板测试器 |
KR20200133084A (ko) | 2019-05-16 | 2020-11-26 | 삼성디스플레이 주식회사 | 커넥터 |
JP7136362B2 (ja) * | 2019-10-04 | 2022-09-13 | 株式会社村田製作所 | プローブ |
KR102576071B1 (ko) * | 2021-07-16 | 2023-09-08 | 주식회사 센서뷰 | 소형 커넥터 테스트용 연결지그 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4225819A (en) * | 1978-10-12 | 1980-09-30 | Bell Telephone Laboratories, Incorporated | Circuit board contact contamination probe |
US4471298A (en) * | 1981-12-11 | 1984-09-11 | Cirdyne, Inc. | Apparatus for automatically electrically testing printed circuit boards |
US5484295A (en) * | 1994-04-01 | 1996-01-16 | Teledyne Electronic Technologies | Low profile compression electrical connector |
US5642054A (en) * | 1995-08-08 | 1997-06-24 | Hughes Aircraft Company | Active circuit multi-port membrane probe for full wafer testing |
US5764069A (en) * | 1995-10-30 | 1998-06-09 | International Faster Corporation | High density grid for testing circuit boards |
JPH1183521A (ja) | 1997-09-02 | 1999-03-26 | Nissan Motor Co Ltd | 車両用経路誘導装置 |
JP3214415B2 (ja) | 1997-10-30 | 2001-10-02 | 日本電産リード株式会社 | 基板検査装置および基板検査方法 |
JPH11183521A (ja) | 1997-12-22 | 1999-07-09 | Yokowo Co Ltd | クリップ式中継コネクタ |
US7257465B2 (en) * | 2002-10-15 | 2007-08-14 | Rain Bird Corporation | Open architecture modularity for irrigation controllers |
JP4251855B2 (ja) * | 2002-11-19 | 2009-04-08 | 株式会社ヨコオ | 高周波・高速用デバイスの検査治具の製法 |
DE10260238B4 (de) | 2002-12-20 | 2007-04-05 | Atg Test Systems Gmbh & Co.Kg | Adapter zum Testen einer oder mehrerer Leiteranordnungen und Verfahren |
JP2004309441A (ja) * | 2003-02-18 | 2004-11-04 | Yamaha Corp | プローブヘッド及びその組立方法並びにプローブカード |
JP2004273192A (ja) | 2003-03-06 | 2004-09-30 | Yokowo Co Ltd | コネクタ検査用治具 |
JP4011530B2 (ja) * | 2003-08-22 | 2007-11-21 | 日本航空電子工業株式会社 | コネクタ |
WO2005106512A1 (ja) * | 2004-04-30 | 2005-11-10 | Advantest Corporation | マニュアル試験用器具 |
JP2007294146A (ja) | 2006-04-21 | 2007-11-08 | Yamaichi Electronics Co Ltd | 位置決め治具 |
-
2006
- 2006-11-10 JP JP2006305364A patent/JP4845031B2/ja active Active
-
2007
- 2007-11-07 US US11/979,733 patent/US7568957B2/en active Active
- 2007-11-08 FI FI20070847A patent/FI121693B/fi active IP Right Grant
- 2007-11-09 SE SE0702468A patent/SE532247C8/sv unknown
- 2007-11-09 KR KR1020070114326A patent/KR101059177B1/ko active IP Right Grant
- 2007-11-09 SE SE0702467A patent/SE532151C2/sv unknown
- 2007-11-09 TW TW096142362A patent/TWI376852B/zh active
- 2007-11-12 CN CN2007101863554A patent/CN101178427B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
KR101059177B1 (ko) | 2011-08-25 |
TWI376852B (en) | 2012-11-11 |
KR20080042746A (ko) | 2008-05-15 |
JP2008123795A (ja) | 2008-05-29 |
SE0702468L (sv) | 2008-05-11 |
FI121693B (fi) | 2011-02-28 |
US20080113527A1 (en) | 2008-05-15 |
CN101178427B (zh) | 2011-06-15 |
TW200836433A (en) | 2008-09-01 |
SE0702467L (sv) | 2008-05-11 |
FI20070847A0 (fi) | 2007-11-08 |
SE532151C2 (sv) | 2009-11-03 |
US7568957B2 (en) | 2009-08-04 |
FI20070847A (fi) | 2008-05-11 |
SE532247C8 (sv) | 2010-01-19 |
CN101178427A (zh) | 2008-05-14 |
SE532247C2 (sv) | 2009-11-24 |
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