TWI788149B - 探針卡 - Google Patents

探針卡 Download PDF

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Publication number
TWI788149B
TWI788149B TW110147649A TW110147649A TWI788149B TW I788149 B TWI788149 B TW I788149B TW 110147649 A TW110147649 A TW 110147649A TW 110147649 A TW110147649 A TW 110147649A TW I788149 B TWI788149 B TW I788149B
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Taiwan
Prior art keywords
probe
cover
card
head
substrate
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TW110147649A
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English (en)
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TW202326143A (zh
Inventor
王子建
徐文元
陳銘賢
呂佳霖
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漢民測試系統股份有限公司
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Priority to TW110147649A priority Critical patent/TWI788149B/zh
Priority to US18/084,256 priority patent/US20230194571A1/en
Priority to CN202211663816.3A priority patent/CN116298433A/zh
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Publication of TWI788149B publication Critical patent/TWI788149B/zh
Publication of TW202326143A publication Critical patent/TW202326143A/zh

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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/06705Apparatus for holding or moving single probes
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/073Multiple probes
    • G01R1/07307Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/06711Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716Elastic
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/073Multiple probes
    • G01R1/07307Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/073Multiple probes
    • G01R1/07307Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)
  • Polishing Bodies And Polishing Tools (AREA)

Abstract

本發明提供一種探針卡,其利用探針蓋的滑槽,以可拆卸的方式安裝探針模組,再將探針蓋固定於探針卡的固定座上。此設計可簡化更換探針模組的操作以及降低人為誤差。

Description

探針卡
本發明涉及一種探針卡,特別是具易於拆裝結構之探針卡。
探針卡乘載探針,用以與晶圓上半導體的電極相接觸,裝置在針測機中,以掃描方式逐區(檢測區)檢測,以檢查晶圓上元件的電性品質。請參閱圖1A及圖1B,探針卡是將一探針模組固定在一基板上。基板上具有通孔,探針模組的探針頭能通過通孔與半導體待測物接觸。
更換探針模組時,定位及水平面極為重要,需仰賴操作者精準度,難度較高,容易產生誤差。
本發明所提供的探針卡結構,可簡化更換探針模組的操作,降低人為誤差,並提高精準度。
本發明提供一種探針卡,包含:一基板,具有一通孔;一固定座,設置於該基板的表面上;以及一探針蓋,連接於該固定座,其中該探針蓋具有至少一滑槽,使一探針模組可拆卸地安裝至該探針蓋,以及當該探針蓋蓋合於該基板,該探針模組通過該通孔。
10:探針卡
11:基板
12:通孔
21:固定座
22:探針蓋
23:鎖固件
24:滑槽
25:卡榫結構
30:探針模組
31:探針頭基座
32:導電連接器
33:探針頭
34:護蓋
圖1A及圖1B分別為先前技術探針卡之上下視圖。
圖2A及圖2B分別為本發明探針模組之上下視圖。
圖3A~3E為本發明探針卡之設置流程結構圖。
以下各實施例配合圖式,用以說明本發明之精神,讓本技術領域之人士能清楚理解本發明之技術,但非用以限制本發明的範圍,本發明之專利權範圍應由請求項界定。特別強調,圖式僅為示意之用,並非代表元件實際之尺寸或數量,部份細節可能也不完全繪出,以求圖式之簡潔。
圖2A及圖2B為本發明探針卡10可拆換的探針模組30之上下視圖。探針模組30包含探針頭基座31、探針頭33以及護蓋34,探針頭基座31用以承載探針頭33,探針頭基座31具有導電連接器32,導電連接器32可為彈簧針、伸縮導電銷或其他可撓性導體等。探針頭33具有至少一探針(圖未示),用以與晶圓表面針測區電性接觸進行檢測。導電連接器32與探針頭33電性連接,並可與基板11上之電路接觸。於一實施例中,探針頭33具有滑槽,使護蓋34可拆卸地安裝固定至探針頭33上,以防止探針頭33的探針受潮及粉塵汙染。
於其他實施例中,探針頭基座31上具有至少一水平調整元件(圖未示),較佳地為三個水平調整元件,平均分配於探針頭基座31的三個邊緣位置,用以確保探針頭在重複更換探針模組的過程中,仍能保持水平。
圖3A~3E為本發明探針模組之安裝流程結構圖,其中圖3A顯示本發明探針卡10在探針蓋22呈開蓋狀態之示意圖。探針卡10包含具通孔12的基板11,設置於基板11表面上的固定座21,以及可蓋合於基板11上之探針蓋22,其中探針蓋22的一側與固定座21樞轉地且可拆卸地連接,探針蓋22與基板11的開合角度為0~90°。
固定座21以及探針蓋22可為金屬材料,固定座21可通過複數個螺栓固定於基板11之上表面。探針蓋22的其他側可選擇地設置鎖固件23,以磁吸、卡扣或螺旋方式固定於設置在基板11上的卡榫結構25。
參閱圖3B、圖3C及圖3D,探針蓋22的下表面相對兩側具有滑槽24,探針模組30的探針頭基座31可***兩側的滑槽24,使探針模組30可拆卸地安裝至探針蓋22。於一實施例中,探針頭基座31與滑槽24可分別設置鎖固件及卡榫結構(圖未示),使探針頭基座31與滑槽24彼此固定,隨後即可將探針模組30的護蓋34拆下露出探針頭33。
於一實施例中,探針頭基座31之形狀為方形,滑槽24則為與之對應之結構,使探針頭基座31可緊密、不晃動的***滑槽24中。操作人員可利用滑槽便利地為探針模組30進行更換以及定位,此方式可避免人為操作造成的位置誤差。
最後參閱圖3E,當探針蓋22蓋合於基板11上時,探針模組30的探針頭33可通過通孔12,並突出於基板11之下表面,可理解的,於檢測時,探針頭33上之探針可與探針卡下方之晶圓表面針測區電性接觸,最後以探針蓋22的鎖固件23與基板11的卡榫結構25鎖固,完成探針卡10的設置,即可進行後續電性檢測。
檢測完成後,相反於安裝步驟,將探針模組30拆卸,並將護蓋34安裝至探針頭33上即可存放備用。
10:探針卡
11:基板
12:通孔
21:固定座
22:探針蓋
23:鎖固件
24:滑槽
25:卡榫結構
30:探針模組
31:探針頭基座
32:導電連接器
33:探針頭
34:護蓋

Claims (7)

  1. 一種探針卡,包含:一基板,具有一通孔;一固定座,設置於該基板的表面上;一探針蓋,連接於該固定座,該探針蓋具有至少一滑槽;以及一探針模組,包含承載一探針頭的一探針頭基座,其中透過該探針頭基座***該至少一滑槽使該探針模組可拆卸地安裝至該探針蓋,以及當該探針蓋蓋合於該基板,該探針頭通過該通孔。
  2. 如請求項1所述之探針卡,其中該探針模組更包含一護蓋,可拆卸地安裝至該探針頭。
  3. 如請求項1所述之探針卡,其中該探針頭基座具有至少一導電連接器,該導電連接器與該探針頭電性連接。
  4. 如請求項1所述之探針卡,其中該探針頭基座具有一鎖固件,用以固定於該滑槽的一卡榫結構。
  5. 如請求項2所述之探針卡,其中該探針頭具有至少一滑槽,使該護蓋可拆卸地安裝至該探針頭。
  6. 如請求項1所述之探針卡,其中該探針蓋樞轉地連接於該固定座,使該探針蓋與該基板的開合角度為0~90°。
  7. 如請求項1所述之探針卡,其中該探針蓋具一鎖固件,當該探針蓋蓋合於該基板,該探針蓋透過該鎖固件固定於該基板上的一卡榫結構。
TW110147649A 2021-12-20 2021-12-20 探針卡 TWI788149B (zh)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW110147649A TWI788149B (zh) 2021-12-20 2021-12-20 探針卡
US18/084,256 US20230194571A1 (en) 2021-12-20 2022-12-19 Probe card
CN202211663816.3A CN116298433A (zh) 2021-12-20 2022-12-20 探针卡

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TW110147649A TWI788149B (zh) 2021-12-20 2021-12-20 探針卡

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TWI788149B true TWI788149B (zh) 2022-12-21
TW202326143A TW202326143A (zh) 2023-07-01

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Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200427989A (en) * 2003-02-18 2004-12-16 Yamaha Corp Probe head, its assembly method and probe card
TW200848749A (en) * 2007-03-14 2008-12-16 Nhk Spring Co Ltd Probe card
TW201105973A (en) * 2009-08-10 2011-02-16 Sv Probe Pte Ltd A modular space transformer for fine pitch vertical probing applications
TWM421505U (en) * 2011-04-26 2012-01-21 Win Way Technology Co Ltd Test probe card
TW201600863A (zh) * 2014-06-27 2016-01-01 旺矽科技股份有限公司 探針卡的定位件與探針卡的探針頭
CN109061238A (zh) * 2018-08-10 2018-12-21 武汉精测电子集团股份有限公司 一种翻盖式垂直压接pogo导通装置
US20210302470A1 (en) * 2020-03-26 2021-09-30 Advantest Corporation Test arrangement for testing high-frequency components, particularly silicon photonics devices under test

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7498825B2 (en) * 2005-07-08 2009-03-03 Formfactor, Inc. Probe card assembly with an interchangeable probe insert
CN205104653U (zh) * 2015-10-16 2016-03-23 富士康(昆山)电脑接插件有限公司 夹持件及电连接器组件
TWI596344B (zh) * 2016-04-27 2017-08-21 Replaceable probe module probe card and its assembly method and probe module replacement side law

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200427989A (en) * 2003-02-18 2004-12-16 Yamaha Corp Probe head, its assembly method and probe card
TW200848749A (en) * 2007-03-14 2008-12-16 Nhk Spring Co Ltd Probe card
TW201105973A (en) * 2009-08-10 2011-02-16 Sv Probe Pte Ltd A modular space transformer for fine pitch vertical probing applications
TWM421505U (en) * 2011-04-26 2012-01-21 Win Way Technology Co Ltd Test probe card
TW201600863A (zh) * 2014-06-27 2016-01-01 旺矽科技股份有限公司 探針卡的定位件與探針卡的探針頭
CN109061238A (zh) * 2018-08-10 2018-12-21 武汉精测电子集团股份有限公司 一种翻盖式垂直压接pogo导通装置
US20210302470A1 (en) * 2020-03-26 2021-09-30 Advantest Corporation Test arrangement for testing high-frequency components, particularly silicon photonics devices under test

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Publication number Publication date
CN116298433A (zh) 2023-06-23
US20230194571A1 (en) 2023-06-22
TW202326143A (zh) 2023-07-01

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