TW460717B - Optical wiring layer, optoelectric wiring substrate mounted substrate, and methods for manufacturing the same - Google Patents
Optical wiring layer, optoelectric wiring substrate mounted substrate, and methods for manufacturing the same Download PDFInfo
- Publication number
- TW460717B TW460717B TW089105687A TW89105687A TW460717B TW 460717 B TW460717 B TW 460717B TW 089105687 A TW089105687 A TW 089105687A TW 89105687 A TW89105687 A TW 89105687A TW 460717 B TW460717 B TW 460717B
- Authority
- TW
- Taiwan
- Prior art keywords
- optical
- substrate
- light
- core
- wiring layer
- Prior art date
Links
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Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/13—Integrated optical circuits characterised by the manufacturing method
- G02B6/138—Integrated optical circuits characterised by the manufacturing method by using polymerisation
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/422—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements
- G02B6/4221—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements involving a visual detection of the position of the elements, e.g. by using a microscope or a camera
- G02B6/4224—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements involving a visual detection of the position of the elements, e.g. by using a microscope or a camera using visual alignment markings, e.g. index methods
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
- G02B6/4232—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using the surface tension of fluid solder to align the elements, e.g. solder bump techniques
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/4238—Soldering
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optical Integrated Circuits (AREA)
- Optical Couplings Of Light Guides (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8856999 | 1999-03-30 | ||
JP9606099 | 1999-04-02 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW460717B true TW460717B (en) | 2001-10-21 |
Family
ID=26429935
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW089105687A TW460717B (en) | 1999-03-30 | 2000-03-28 | Optical wiring layer, optoelectric wiring substrate mounted substrate, and methods for manufacturing the same |
Country Status (6)
Country | Link |
---|---|
US (1) | US6438281B1 (fr) |
EP (1) | EP1041418B1 (fr) |
KR (2) | KR100734787B1 (fr) |
AT (1) | ATE511666T1 (fr) |
CA (1) | CA2302899C (fr) |
TW (1) | TW460717B (fr) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI426306B (zh) * | 2007-05-11 | 2014-02-11 | Shinko Electric Ind Co | 光學導波管及其製造方法,暨光電混 合基板之製造方法 |
TWI426307B (zh) * | 2007-05-14 | 2014-02-11 | Shinko Electric Ind Co | 光/電混合基板 |
Families Citing this family (64)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100467951B1 (ko) * | 1999-02-23 | 2005-01-24 | 페페체 엘렉트로닉 악티엔게젤샤프트 | 전기 및 광 신호용 인쇄배선회로기판 및 이를 제조하는 방법 |
TW460717B (en) * | 1999-03-30 | 2001-10-21 | Toppan Printing Co Ltd | Optical wiring layer, optoelectric wiring substrate mounted substrate, and methods for manufacturing the same |
US6693033B2 (en) | 2000-02-10 | 2004-02-17 | Motorola, Inc. | Method of removing an amorphous oxide from a monocrystalline surface |
JP3762208B2 (ja) * | 2000-09-29 | 2006-04-05 | 株式会社東芝 | 光配線基板の製造方法 |
US6638838B1 (en) | 2000-10-02 | 2003-10-28 | Motorola, Inc. | Semiconductor structure including a partially annealed layer and method of forming the same |
US6699395B1 (en) * | 2000-10-18 | 2004-03-02 | Storage Technology Corporation | Method of forming alignment features for conductive devices |
JP4538949B2 (ja) * | 2000-12-06 | 2010-09-08 | 凸版印刷株式会社 | 光部品搭載用基板製造方法 |
US6731843B2 (en) * | 2000-12-29 | 2004-05-04 | Intel Corporation | Multi-level waveguide |
US6673646B2 (en) | 2001-02-28 | 2004-01-06 | Motorola, Inc. | Growth of compound semiconductor structures on patterned oxide films and process for fabricating same |
US6709989B2 (en) | 2001-06-21 | 2004-03-23 | Motorola, Inc. | Method for fabricating a semiconductor structure including a metal oxide interface with silicon |
KR20040035673A (ko) * | 2001-07-06 | 2004-04-29 | 비아시스템즈 그룹, 인코포레이티드 | 보드간 통신을 위한 pcb에의 광계층 집적 시스템 및집적방법 |
DE10132794A1 (de) * | 2001-07-06 | 2003-01-30 | Siemens Ag | Kopplung an in Leiterplatten eingebettete Lichtleiter |
US6646293B2 (en) | 2001-07-18 | 2003-11-11 | Motorola, Inc. | Structure for fabricating high electron mobility transistors utilizing the formation of complaint substrates |
US6693298B2 (en) | 2001-07-20 | 2004-02-17 | Motorola, Inc. | Structure and method for fabricating epitaxial semiconductor on insulator (SOI) structures and devices utilizing the formation of a compliant substrate for materials used to form same |
US6667196B2 (en) | 2001-07-25 | 2003-12-23 | Motorola, Inc. | Method for real-time monitoring and controlling perovskite oxide film growth and semiconductor structure formed using the method |
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- 2000-03-29 CA CA002302899A patent/CA2302899C/fr not_active Expired - Fee Related
- 2000-03-29 AT AT00106748T patent/ATE511666T1/de not_active IP Right Cessation
- 2000-03-29 KR KR1020000016239A patent/KR100734787B1/ko not_active IP Right Cessation
- 2000-03-29 EP EP00106748A patent/EP1041418B1/fr not_active Expired - Lifetime
- 2000-03-30 US US09/539,860 patent/US6438281B1/en not_active Expired - Lifetime
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TWI426306B (zh) * | 2007-05-11 | 2014-02-11 | Shinko Electric Ind Co | 光學導波管及其製造方法,暨光電混 合基板之製造方法 |
TWI426307B (zh) * | 2007-05-14 | 2014-02-11 | Shinko Electric Ind Co | 光/電混合基板 |
Also Published As
Publication number | Publication date |
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CA2302899A1 (fr) | 2000-09-30 |
KR20070012766A (ko) | 2007-01-29 |
KR100765819B1 (ko) | 2007-10-10 |
US6438281B1 (en) | 2002-08-20 |
EP1041418B1 (fr) | 2011-06-01 |
CA2302899C (fr) | 2008-09-30 |
EP1041418A2 (fr) | 2000-10-04 |
ATE511666T1 (de) | 2011-06-15 |
KR20010006911A (ko) | 2001-01-26 |
EP1041418A3 (fr) | 2003-07-16 |
KR100734787B1 (ko) | 2007-07-04 |
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