ATE511666T1 - Optisch-leitende schicht, optoelektrisch- leitendes substrat, montiertes substrat und deren herstellungsverfahren - Google Patents
Optisch-leitende schicht, optoelektrisch- leitendes substrat, montiertes substrat und deren herstellungsverfahrenInfo
- Publication number
- ATE511666T1 ATE511666T1 AT00106748T AT00106748T ATE511666T1 AT E511666 T1 ATE511666 T1 AT E511666T1 AT 00106748 T AT00106748 T AT 00106748T AT 00106748 T AT00106748 T AT 00106748T AT E511666 T1 ATE511666 T1 AT E511666T1
- Authority
- AT
- Austria
- Prior art keywords
- substrate
- layer
- optoelectrically
- production method
- clad
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title abstract 6
- 238000004519 manufacturing process Methods 0.000 title 1
- 230000003287 optical effect Effects 0.000 abstract 4
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- 230000001902 propagating effect Effects 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/13—Integrated optical circuits characterised by the manufacturing method
- G02B6/138—Integrated optical circuits characterised by the manufacturing method by using polymerisation
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/422—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements
- G02B6/4221—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements involving a visual detection of the position of the elements, e.g. by using a microscope or a camera
- G02B6/4224—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements involving a visual detection of the position of the elements, e.g. by using a microscope or a camera using visual alignment markings, e.g. index methods
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
- G02B6/4232—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using the surface tension of fluid solder to align the elements, e.g. solder bump techniques
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/4238—Soldering
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optical Integrated Circuits (AREA)
- Optical Couplings Of Light Guides (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8856999 | 1999-03-30 | ||
JP9606099 | 1999-04-02 |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE511666T1 true ATE511666T1 (de) | 2011-06-15 |
Family
ID=26429935
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT00106748T ATE511666T1 (de) | 1999-03-30 | 2000-03-29 | Optisch-leitende schicht, optoelektrisch- leitendes substrat, montiertes substrat und deren herstellungsverfahren |
Country Status (6)
Country | Link |
---|---|
US (1) | US6438281B1 (de) |
EP (1) | EP1041418B1 (de) |
KR (2) | KR100734787B1 (de) |
AT (1) | ATE511666T1 (de) |
CA (1) | CA2302899C (de) |
TW (1) | TW460717B (de) |
Families Citing this family (66)
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TW460717B (en) * | 1999-03-30 | 2001-10-21 | Toppan Printing Co Ltd | Optical wiring layer, optoelectric wiring substrate mounted substrate, and methods for manufacturing the same |
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KR100489147B1 (ko) * | 1998-08-05 | 2005-05-17 | 세이코 엡슨 가부시키가이샤 | 광 모듈 |
DE19838519A1 (de) * | 1998-08-25 | 2000-03-02 | Bosch Gmbh Robert | Leiterplatte und Verfahren zur Herstellung |
KR100467951B1 (ko) * | 1999-02-23 | 2005-01-24 | 페페체 엘렉트로닉 악티엔게젤샤프트 | 전기 및 광 신호용 인쇄배선회로기판 및 이를 제조하는 방법 |
TW460717B (en) * | 1999-03-30 | 2001-10-21 | Toppan Printing Co Ltd | Optical wiring layer, optoelectric wiring substrate mounted substrate, and methods for manufacturing the same |
WO2001016630A1 (en) * | 1999-08-27 | 2001-03-08 | Board Of Regents The University Of Texas System | Packaging enhanced board level opto-electronic interconnects |
JP3762208B2 (ja) * | 2000-09-29 | 2006-04-05 | 株式会社東芝 | 光配線基板の製造方法 |
-
2000
- 2000-03-28 TW TW089105687A patent/TW460717B/zh not_active IP Right Cessation
- 2000-03-29 CA CA002302899A patent/CA2302899C/en not_active Expired - Fee Related
- 2000-03-29 AT AT00106748T patent/ATE511666T1/de not_active IP Right Cessation
- 2000-03-29 KR KR1020000016239A patent/KR100734787B1/ko not_active IP Right Cessation
- 2000-03-29 EP EP00106748A patent/EP1041418B1/de not_active Expired - Lifetime
- 2000-03-30 US US09/539,860 patent/US6438281B1/en not_active Expired - Lifetime
-
2006
- 2006-12-26 KR KR1020060133960A patent/KR100765819B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
CA2302899A1 (en) | 2000-09-30 |
KR20070012766A (ko) | 2007-01-29 |
KR100765819B1 (ko) | 2007-10-10 |
US6438281B1 (en) | 2002-08-20 |
EP1041418B1 (de) | 2011-06-01 |
TW460717B (en) | 2001-10-21 |
CA2302899C (en) | 2008-09-30 |
EP1041418A2 (de) | 2000-10-04 |
KR20010006911A (ko) | 2001-01-26 |
EP1041418A3 (de) | 2003-07-16 |
KR100734787B1 (ko) | 2007-07-04 |
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