TW340973B - Mono-chip mixed carrier semiconductor and the checking method - Google Patents
Mono-chip mixed carrier semiconductor and the checking methodInfo
- Publication number
- TW340973B TW340973B TW086106990A TW86106990A TW340973B TW 340973 B TW340973 B TW 340973B TW 086106990 A TW086106990 A TW 086106990A TW 86106990 A TW86106990 A TW 86106990A TW 340973 B TW340973 B TW 340973B
- Authority
- TW
- Taiwan
- Prior art keywords
- semiconductor
- mono
- mixed carrier
- checking method
- chip mixed
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title abstract 6
- 238000000926 separation method Methods 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
- G11C29/04—Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals
- G11C29/08—Functional testing, e.g. testing during refresh, power-on self testing [POST] or distributed testing
- G11C29/48—Arrangements in static stores specially adapted for testing by means external to the store, e.g. using direct memory access [DMA] or using auxiliary access paths
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/317—Testing of digital circuits
- G01R31/31721—Power aspects, e.g. power supplies for test circuits, power saving during test
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/317—Testing of digital circuits
- G01R31/3181—Functional testing
- G01R31/3185—Reconfiguring for testing, e.g. LSSD, partitioning
- G01R31/318505—Test of Modular systems, e.g. Wafers, MCM's
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/317—Testing of digital circuits
- G01R31/3181—Functional testing
- G01R31/319—Tester hardware, i.e. output processing circuits
- G01R31/31917—Stimuli generation or application of test patterns to the device under test [DUT]
- G01R31/31924—Voltage or current aspects, e.g. driver, receiver
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/317—Testing of digital circuits
- G01R31/3181—Functional testing
- G01R31/319—Tester hardware, i.e. output processing circuits
- G01R31/31917—Stimuli generation or application of test patterns to the device under test [DUT]
- G01R31/31926—Routing signals to or from the device under test [DUT], e.g. switch matrix, pin multiplexing
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
- G11C29/006—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation at wafer scale level, i.e. wafer scale integration [WSI]
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
- G11C29/04—Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals
- G11C29/08—Functional testing, e.g. testing during refresh, power-on self testing [POST] or distributed testing
- G11C29/12—Built-in arrangements for testing, e.g. built-in self testing [BIST] or interconnection details
- G11C29/12005—Built-in arrangements for testing, e.g. built-in self testing [BIST] or interconnection details comprising voltage or current generators
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
- G11C29/56—External testing equipment for static stores, e.g. automatic test equipment [ATE]; Interfaces therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/10—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration
- H01L27/105—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration including field-effect components
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B99/00—Subject matter not provided for in other groups of this subclass
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/317—Testing of digital circuits
- G01R31/3181—Functional testing
- G01R31/319—Tester hardware, i.e. output processing circuits
- G01R31/31903—Tester hardware, i.e. output processing circuits tester configuration
- G01R31/31907—Modular tester, e.g. controlling and coordinating instruments in a bus based architecture
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
- G11C29/04—Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals
- G11C2029/0401—Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals in embedded memories
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
- G11C29/04—Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals
- G11C29/50—Marginal testing, e.g. race, voltage or current testing
- G11C2029/5002—Characteristic
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Computer Networks & Wireless Communication (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Semiconductor Integrated Circuits (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- For Increasing The Reliability Of Semiconductor Memories (AREA)
- Dram (AREA)
- Tests Of Electronic Circuits (AREA)
- Semiconductor Memories (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13689296 | 1996-05-30 | ||
JP9113900A JPH1070243A (ja) | 1996-05-30 | 1997-05-01 | 半導体集積回路装置およびその検査方法およびその検査装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW340973B true TW340973B (en) | 1998-09-21 |
Family
ID=26452786
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW086106990A TW340973B (en) | 1996-05-30 | 1997-05-23 | Mono-chip mixed carrier semiconductor and the checking method |
Country Status (5)
Country | Link |
---|---|
US (1) | US6055655A (zh) |
JP (1) | JPH1070243A (zh) |
KR (1) | KR100308749B1 (zh) |
CN (1) | CN1118100C (zh) |
TW (1) | TW340973B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6661248B2 (en) | 2001-08-31 | 2003-12-09 | Mitsubishi Denki Kabushiki Kaisha | Tester for semiconductor integrated circuits |
Families Citing this family (67)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1998025304A1 (fr) * | 1996-12-04 | 1998-06-11 | Hitachi, Ltd. | Dispositif a semi-conducteur |
US5880991A (en) * | 1997-04-14 | 1999-03-09 | International Business Machines Corporation | Structure for low cost mixed memory integration, new NVRAM structure, and process for forming the mixed memory and NVRAM structure |
JP4014708B2 (ja) * | 1997-08-21 | 2007-11-28 | 株式会社ルネサステクノロジ | 半導体集積回路装置の設計方法 |
JP3853513B2 (ja) * | 1998-04-09 | 2006-12-06 | エルピーダメモリ株式会社 | ダイナミック型ram |
US6249841B1 (en) * | 1998-12-03 | 2001-06-19 | Ramtron International Corporation | Integrated circuit memory device and method incorporating flash and ferroelectric random access memory arrays |
DE19911939C2 (de) * | 1999-03-17 | 2001-03-22 | Siemens Ag | Verfahren für den eingebauten Selbsttest einer elektronischen Schaltung |
JP2001035994A (ja) * | 1999-07-15 | 2001-02-09 | Toshiba Corp | 半導体集積回路装置およびシステム基板 |
US7678836B2 (en) * | 1999-11-04 | 2010-03-16 | Fxs Ventures, Llc | Method for rendering a contact lens wettable |
JP2001291779A (ja) * | 2000-04-05 | 2001-10-19 | Mitsubishi Electric Corp | 半導体装置およびその製造方法 |
KR100370155B1 (ko) * | 2000-05-01 | 2003-01-29 | 주식회사 하이닉스반도체 | 반도체 소자 및 그의 제조 방법 |
JP3718106B2 (ja) * | 2000-05-22 | 2005-11-16 | 松下電器産業株式会社 | 半導体集積回路 |
US20020125537A1 (en) * | 2000-05-30 | 2002-09-12 | Ting-Wah Wong | Integrated radio frequency circuits |
US6441442B1 (en) * | 2000-05-30 | 2002-08-27 | Programmable Silicon Solutions | Integrated inductive circuits |
US6917095B1 (en) * | 2000-05-30 | 2005-07-12 | Altera Corporation | Integrated radio frequency circuits |
TW451466B (en) * | 2000-06-09 | 2001-08-21 | Macronix Int Co Ltd | A method of erasing a non-volatile memory |
US6815803B1 (en) * | 2000-06-16 | 2004-11-09 | Infineon Technologies Ag | Multiple chip semiconductor arrangement having electrical components in separating regions |
JP2002033436A (ja) * | 2000-07-14 | 2002-01-31 | Hitachi Ltd | 半導体装置 |
JP2002324393A (ja) * | 2001-04-25 | 2002-11-08 | Mitsubishi Electric Corp | 半導体記憶装置 |
US6815231B2 (en) * | 2001-06-11 | 2004-11-09 | Hitachi, Ltd. | Method of testing and manufacturing nonvolatile semiconductor memory |
US6670234B2 (en) * | 2001-06-22 | 2003-12-30 | International Business Machines Corporation | Method of integrating volatile and non-volatile memory cells on the same substrate and a semiconductor memory device thereof |
US6621325B2 (en) * | 2001-09-18 | 2003-09-16 | Xilinx, Inc. | Structures and methods for selectively applying a well bias to portions of a programmable device |
US6650589B2 (en) * | 2001-11-29 | 2003-11-18 | Intel Corporation | Low voltage operation of static random access memory |
US7408218B2 (en) * | 2001-12-14 | 2008-08-05 | Renesas Technology Corporation | Semiconductor device having plural dram memory cells and a logic circuit |
US6681309B2 (en) * | 2002-01-25 | 2004-01-20 | Hewlett-Packard Development Company, L.P. | Method and apparatus for measuring and optimizing spatial segmentation of electronic storage workloads |
JP4005813B2 (ja) * | 2002-01-28 | 2007-11-14 | 株式会社東芝 | 半導体装置 |
JP2003282823A (ja) * | 2002-03-26 | 2003-10-03 | Toshiba Corp | 半導体集積回路 |
US7112978B1 (en) | 2002-04-16 | 2006-09-26 | Transmeta Corporation | Frequency specific closed loop feedback control of integrated circuits |
US7941675B2 (en) * | 2002-12-31 | 2011-05-10 | Burr James B | Adaptive power control |
JP2004134599A (ja) * | 2002-10-11 | 2004-04-30 | Renesas Technology Corp | 半導体装置、およびそのレイアウト方法 |
US7205758B1 (en) | 2004-02-02 | 2007-04-17 | Transmeta Corporation | Systems and methods for adjusting threshold voltage |
US7949864B1 (en) | 2002-12-31 | 2011-05-24 | Vjekoslav Svilan | Balanced adaptive body bias control |
US6936898B2 (en) * | 2002-12-31 | 2005-08-30 | Transmeta Corporation | Diagonal deep well region for routing body-bias voltage for MOSFETS in surface well regions |
US7953990B2 (en) * | 2002-12-31 | 2011-05-31 | Stewart Thomas E | Adaptive power control based on post package characterization of integrated circuits |
US7076757B2 (en) * | 2003-02-27 | 2006-07-11 | Nec Electronics Corporation | Semiconductor integrated device and apparatus for designing the same |
KR100508090B1 (ko) * | 2003-03-25 | 2005-08-17 | 삼성전자주식회사 | 반도체 소자의 테스트 패턴 및 그 형성방법 |
KR100493061B1 (ko) * | 2003-06-20 | 2005-06-02 | 삼성전자주식회사 | 비휘발성 메모리가 내장된 단일 칩 데이터 처리 장치 |
US7205633B2 (en) * | 2003-06-27 | 2007-04-17 | Micron Technology, Inc. | Capacitor layout orientation |
US7649402B1 (en) | 2003-12-23 | 2010-01-19 | Tien-Min Chen | Feedback-controlled body-bias voltage source |
US7027316B2 (en) * | 2003-12-29 | 2006-04-11 | Micron Technology, Inc. | Access circuit and method for allowing external test voltage to be applied to isolated wells |
US20050172182A1 (en) * | 2004-01-15 | 2005-08-04 | Elias Gedamu | Optimal operational voltage identification for a processor design |
US7859062B1 (en) | 2004-02-02 | 2010-12-28 | Koniaris Kleanthes G | Systems and methods for integrated circuits comprising multiple body biasing domains |
US7816742B1 (en) | 2004-09-30 | 2010-10-19 | Koniaris Kleanthes G | Systems and methods for integrated circuits comprising multiple body biasing domains |
KR100604561B1 (ko) * | 2004-05-11 | 2006-07-31 | 에스티마이크로일렉트로닉스 엔.브이. | 낸드 플래시 메모리 소자 및 이의 웰 형성 방법 |
US7509504B1 (en) * | 2004-09-30 | 2009-03-24 | Transmeta Corporation | Systems and methods for control of integrated circuits comprising body biasing systems |
KR100797896B1 (ko) * | 2004-11-12 | 2008-01-24 | 타이완 세미콘덕터 매뉴팩쳐링 컴퍼니 리미티드 | 다양한 동작 전압들을 갖는 집적 회로들을 절연시키기 위한반도체 구조 |
JP4522352B2 (ja) * | 2005-11-09 | 2010-08-11 | シャープ株式会社 | 回路検査方法及び回路検査システム |
US8030649B2 (en) * | 2006-07-28 | 2011-10-04 | International Business Machines Corporation | Scan testing in single-chip multicore systems |
US7539034B2 (en) * | 2007-02-01 | 2009-05-26 | Qimonda North America Corp. | Memory configured on a common substrate |
US7881679B1 (en) * | 2007-03-14 | 2011-02-01 | Rf Micro Devices, Inc. | Method and apparatus for integrating power amplifiers with phase locked loop in a single chip transceiver |
US7893712B1 (en) | 2009-09-10 | 2011-02-22 | Xilinx, Inc. | Integrated circuit with a selectable interconnect circuit for low power or high performance operation |
JP5631750B2 (ja) * | 2010-03-19 | 2014-11-26 | 株式会社東芝 | 複合メモリ |
JP5520747B2 (ja) * | 2010-08-25 | 2014-06-11 | 株式会社日立製作所 | キャッシュを搭載した情報装置及びコンピュータ読み取り可能な記憶媒体 |
JP5623653B2 (ja) * | 2010-11-23 | 2014-11-12 | コンバーサント・インテレクチュアル・プロパティ・マネジメント・インコーポレイテッドConversant Intellectual Property Management Inc. | 集積回路デバイス内の内部電源を共有するための方法および装置 |
US8921978B2 (en) * | 2012-01-10 | 2014-12-30 | Taiwan Semiconductor Manufacturing Co., Ltd. | Dual DNW isolation structure for reducing RF noise on high voltage semiconductor devices |
KR101975528B1 (ko) | 2012-07-17 | 2019-05-07 | 삼성전자주식회사 | 패스트 어레이 영역을 갖는 반도체 메모리 셀 어레이 및 그것을 포함하는 반도체 메모리 |
US9304163B2 (en) * | 2013-11-07 | 2016-04-05 | Qualcomm Incorporated | Methodology for testing integrated circuits |
JP6451177B2 (ja) * | 2014-09-25 | 2019-01-16 | 株式会社ソシオネクスト | スタティックramおよびスタティックramを搭載する半導体装置 |
KR102388044B1 (ko) * | 2015-10-19 | 2022-04-19 | 삼성전자주식회사 | 테스트 장치 및 이를 포함하는 테스트 시스템 |
US9953695B2 (en) * | 2015-12-29 | 2018-04-24 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device, electronic device, and semiconductor wafer |
FR3053156B1 (fr) * | 2016-06-28 | 2018-11-16 | Stmicroelectronics (Rousset) Sas | Composant a faible dispersion dans une puce electronique |
JP7487213B2 (ja) | 2019-04-15 | 2024-05-20 | 長江存儲科技有限責任公司 | プロセッサおよびダイナミック・ランダムアクセス・メモリを有する接合半導体デバイスおよびそれを形成する方法 |
JP7197719B2 (ja) | 2019-04-15 | 2022-12-27 | 長江存儲科技有限責任公司 | 半導体デバイス及び方法 |
CN110731012B (zh) | 2019-04-15 | 2021-01-29 | 长江存储科技有限责任公司 | 具有处理器和异构存储器的一体化半导体器件及其形成方法 |
WO2020220484A1 (en) | 2019-04-30 | 2020-11-05 | Yangtze Memory Technologies Co., Ltd. | Bonded unified semiconductor chips and fabrication and operation methods thereof |
CN110192269A (zh) * | 2019-04-15 | 2019-08-30 | 长江存储科技有限责任公司 | 三维nand存储器件与多个功能芯片的集成 |
JP7311615B2 (ja) * | 2019-04-30 | 2023-07-19 | 長江存儲科技有限責任公司 | プロセッサおよびnandフラッシュメモリを有する接合半導体デバイスならびにそれを形成する方法 |
CN110720143B (zh) | 2019-04-30 | 2021-01-29 | 长江存储科技有限责任公司 | 具有处理器和nand闪存的键合半导体器件及其形成方法 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4467400A (en) * | 1981-01-16 | 1984-08-21 | Burroughs Corporation | Wafer scale integrated circuit |
JPS6230367U (zh) * | 1985-08-07 | 1987-02-24 | ||
JP2628154B2 (ja) * | 1986-12-17 | 1997-07-09 | 富士通株式会社 | 半導体集積回路 |
JPH036853A (ja) * | 1989-06-05 | 1991-01-14 | Hitachi Ltd | 半導体集積回路装置 |
JPH0344961A (ja) * | 1989-07-13 | 1991-02-26 | Mitsubishi Electric Corp | 半導体集積回路装置 |
DE69031257T2 (de) * | 1989-09-21 | 1998-02-12 | Texas Instruments Inc | Integrierte Schaltung mit einem eingebetteten digitalen Signalprozessor |
JP2656394B2 (ja) * | 1991-03-29 | 1997-09-24 | シャープ株式会社 | 集積回路装置 |
US5663901A (en) * | 1991-04-11 | 1997-09-02 | Sandisk Corporation | Computer memory cards using flash EEPROM integrated circuit chips and memory-controller systems |
FR2700063B1 (fr) * | 1992-12-31 | 1995-02-10 | Sgs Thomson Microelectronics | Procédé de test de puces de circuit intégré et dispositif intégré correspondant. |
JP2839819B2 (ja) * | 1993-05-28 | 1998-12-16 | 株式会社東芝 | 不揮発性半導体記憶装置 |
JP3075892B2 (ja) * | 1993-07-09 | 2000-08-14 | 株式会社東芝 | 半導体装置 |
JP3293995B2 (ja) * | 1994-03-10 | 2002-06-17 | 株式会社東芝 | プロ−ビング装置およびプロ−ビング方法 |
US5721445A (en) * | 1995-03-02 | 1998-02-24 | Lucent Technologies Inc. | Semiconductor device with increased parasitic emitter resistance and improved latch-up immunity |
JP3135825B2 (ja) * | 1995-09-27 | 2001-02-19 | 株式会社東芝 | プローブカードおよびそのプローブカードを使用した半導体集積回路のプロービング試験方法 |
-
1997
- 1997-05-01 JP JP9113900A patent/JPH1070243A/ja not_active Withdrawn
- 1997-05-23 TW TW086106990A patent/TW340973B/zh not_active IP Right Cessation
- 1997-05-29 US US08/865,371 patent/US6055655A/en not_active Expired - Lifetime
- 1997-05-29 KR KR1019970021701A patent/KR100308749B1/ko not_active IP Right Cessation
- 1997-05-30 CN CN97115946A patent/CN1118100C/zh not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6661248B2 (en) | 2001-08-31 | 2003-12-09 | Mitsubishi Denki Kabushiki Kaisha | Tester for semiconductor integrated circuits |
Also Published As
Publication number | Publication date |
---|---|
JPH1070243A (ja) | 1998-03-10 |
KR100308749B1 (ko) | 2001-12-15 |
US6055655A (en) | 2000-04-25 |
CN1190262A (zh) | 1998-08-12 |
CN1118100C (zh) | 2003-08-13 |
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