TW201249602A - Electrodeposition liquid for fixed-abrasive saw wire - Google Patents

Electrodeposition liquid for fixed-abrasive saw wire Download PDF

Info

Publication number
TW201249602A
TW201249602A TW101108818A TW101108818A TW201249602A TW 201249602 A TW201249602 A TW 201249602A TW 101108818 A TW101108818 A TW 101108818A TW 101108818 A TW101108818 A TW 101108818A TW 201249602 A TW201249602 A TW 201249602A
Authority
TW
Taiwan
Prior art keywords
wire
particles
abrasive grains
metal core
colloidal particles
Prior art date
Application number
TW101108818A
Other languages
English (en)
Chinese (zh)
Inventor
Hiroshi Shimizu
Kazuhiko Mori
Daigo KANAZAWA
Akifumi Matsuoka
Kenichi Yamashita
Original Assignee
Sumitomo Electric Tochigi Co Ltd
Nihon Parkerizing
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Tochigi Co Ltd, Nihon Parkerizing filed Critical Sumitomo Electric Tochigi Co Ltd
Publication of TW201249602A publication Critical patent/TW201249602A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
    • B24D3/06—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements
    • B24D3/10—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements for porous or cellular structure, e.g. for use with diamonds as abrasives
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D13/00—Electrophoretic coating characterised by the process
    • C25D13/02—Electrophoretic coating characterised by the process with inorganic material
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D13/00—Electrophoretic coating characterised by the process
    • C25D13/22—Servicing or operating apparatus or multistep processes
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
TW101108818A 2011-03-15 2012-03-15 Electrodeposition liquid for fixed-abrasive saw wire TW201249602A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011056727A JP5641536B2 (ja) 2011-03-15 2011-03-15 固定砥粒ソーワイヤー用電着液

Publications (1)

Publication Number Publication Date
TW201249602A true TW201249602A (en) 2012-12-16

Family

ID=46830784

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101108818A TW201249602A (en) 2011-03-15 2012-03-15 Electrodeposition liquid for fixed-abrasive saw wire

Country Status (5)

Country Link
JP (1) JP5641536B2 (ja)
KR (1) KR20140048085A (ja)
CN (1) CN103415373A (ja)
TW (1) TW201249602A (ja)
WO (1) WO2012124718A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI580501B (zh) * 2015-12-21 2017-05-01 銳捷科技股份有限公司 切割線

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201416159A (zh) * 2012-10-25 2014-05-01 Univ Nat Taiwan Science Tech 電泳式切割系統及電泳式切割載體製作方法
BR112015010318A2 (pt) * 2012-11-08 2017-08-22 Albumedix As Variantes de albumina
JP6130247B2 (ja) * 2013-07-01 2017-05-17 ワイヤーエンジプロ合同会社 砥粒電着液，固定砥粒型ソーワイヤの製造方法，及び固定砥粒型ソーワイヤ
JP5820950B1 (ja) * 2015-05-29 2015-11-24 株式会社ファシリティ ニッケルめっき液及び固体微粒子付着ワイヤーの製造方法
CN105908244A (zh) * 2016-06-29 2016-08-31 刘伟 金刚线制备工艺
CN114273724B (zh) * 2022-01-07 2023-05-30 广东技术师范大学 一种电泳辅助激光钢锯表面强化方法及装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3966815B2 (ja) * 2000-03-03 2007-08-29 株式会社ティ・ケー・エックス 研削装置
JP3910850B2 (ja) * 2002-01-11 2007-04-25 岐阜県 導電性砥石及びその製造方法
JP2004050301A (ja) * 2002-07-16 2004-02-19 Noritake Co Ltd ワイヤーソーおよびその製造方法
JP2008126341A (ja) * 2006-11-17 2008-06-05 Japan Fine Steel Co Ltd ワイヤソー用溝付きローラ及びその溝加工方法並びにその溝付きローラを用いたワイヤソー
US20090032006A1 (en) * 2007-07-31 2009-02-05 Chul Woo Nam Wire saw process
TW201111106A (en) * 2009-03-02 2011-04-01 Sumitomo Electric Industries Diamond wire saw, process for manufacturing diamond wire saw
CN101531035B (zh) * 2009-04-21 2014-04-16 青岛科技大学 一种电镀金刚石线锯的制造方法
CN101591769B (zh) * 2009-07-02 2012-06-13 复旦大学 一种C、N含量可调的共掺杂纳米TiO2薄膜的制备方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI580501B (zh) * 2015-12-21 2017-05-01 銳捷科技股份有限公司 切割線

Also Published As

Publication number Publication date
WO2012124718A1 (ja) 2012-09-20
JP5641536B2 (ja) 2014-12-17
CN103415373A (zh) 2013-11-27
JP2012192469A (ja) 2012-10-11
KR20140048085A (ko) 2014-04-23

Similar Documents

Publication Publication Date Title
TW201249602A (en) Electrodeposition liquid for fixed-abrasive saw wire
CN101970723B (zh) 金属材料及其制备方法
TWI637085B (zh) 鍍鎳液以及附著有固體微粒子之鋼線的製造方法
JP6087900B2 (ja) Ｉｉｉ族窒化物表面の化学機械研磨方法
EP2803704A2 (en) Metal compound coated colloidal particles process for making and use therefor
JP2012508821A5 (ja)
CN103173840A (zh) 一种磨削用电镀金刚石砂轮的制备方法
TW201315849A (zh) 碳化矽單晶基板及研磨液
TW201111106A (en) Diamond wire saw, process for manufacturing diamond wire saw
CN101233264A (zh) 在电镀浴中使用金属纳米晶体颗粒形成的复合金属层
CN102618855B (zh) 一种Ni-P-Al2O3纳米复合镀层的制备方法
Khedir et al. Robust superamphiphobic nanoscale copper sheet surfaces produced by a simple and environmentally friendly technique
US20140308155A1 (en) Method for polishing alloy material and method for producing alloy material
CN109518259A (zh) 镍铜复合电镀轮毂型划片刀及其应用
CN110076705A (zh) 一种裸粉上砂电镀金刚线工艺
WO2012124717A1 (ja) 砥粒固着金属線及びその製造方法
CN103221579B (zh) 利用强碱镀浴进行金属无电沉积的方法
JP5802275B2 (ja) 固体微粒子付着ワイヤー及びその固体微粒子付着ワイヤーの製造方法
KR20200035633A (ko) 자기적 특성이 우수한 니켈 피복 초경질 입자 및 이를 이용한 와이어 쏘우
CN110184636B (zh) 通过多电位阶跃法在铝表面原位制备水滑石薄膜的方法
TW200528550A (en) Polishing solution and method of polishing nonferrous metal materials
Fang et al. Effects of Additives on Electrochemical Growth of Cu Film on Co/SiO 2/Si Substrate by Alternating Underpotential Deposition of Pb and Surface-Limited Redox Replacement by Cu
JP6081224B2 (ja) 表面処理鋼板の製造方法
Wang et al. Electrochemical and Tribological Behavior of Ni-Co/ZrO2 Coatings Prepared by Ultrasound-Assisted Electrodeposition
CN111635701B (zh) 一种钴基材抛光液及其应用