TW200911455A - Dicing device - Google Patents

Dicing device Download PDF

Info

Publication number
TW200911455A
TW200911455A TW97132323A TW97132323A TW200911455A TW 200911455 A TW200911455 A TW 200911455A TW 97132323 A TW97132323 A TW 97132323A TW 97132323 A TW97132323 A TW 97132323A TW 200911455 A TW200911455 A TW 200911455A
Authority
TW
Taiwan
Prior art keywords
stage
workpiece
oil pan
fixed
bellows
Prior art date
Application number
TW97132323A
Other languages
English (en)
Chinese (zh)
Inventor
Junichi Ito
Original Assignee
Tokyo Seimitsu Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Seimitsu Co Ltd filed Critical Tokyo Seimitsu Co Ltd
Publication of TW200911455A publication Critical patent/TW200911455A/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/06—Dust extraction equipment on grinding or polishing machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Auxiliary Devices For Machine Tools (AREA)
TW97132323A 2007-08-28 2008-08-25 Dicing device TW200911455A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007220930 2007-08-28

Publications (1)

Publication Number Publication Date
TW200911455A true TW200911455A (en) 2009-03-16

Family

ID=40387087

Family Applications (1)

Application Number Title Priority Date Filing Date
TW97132323A TW200911455A (en) 2007-08-28 2008-08-25 Dicing device

Country Status (3)

Country Link
JP (1) JPWO2009028364A1 (ja)
TW (1) TW200911455A (ja)
WO (1) WO2009028364A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI449095B (zh) * 2009-04-24 2014-08-11 Tokyo Seimitsu Co Ltd Cutting device, cutting device unit and cutting method

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112405219B (zh) * 2020-10-20 2022-09-23 南京合信自动化有限公司 一种带有快速定位机构的机械零件加工用打磨机器人

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3815551B2 (ja) * 2001-12-21 2006-08-30 株式会社東京精密 ダイシング装置
JP4459728B2 (ja) * 2004-06-14 2010-04-28 株式会社ソディック 切削装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI449095B (zh) * 2009-04-24 2014-08-11 Tokyo Seimitsu Co Ltd Cutting device, cutting device unit and cutting method

Also Published As

Publication number Publication date
WO2009028364A1 (ja) 2009-03-05
JPWO2009028364A1 (ja) 2010-12-02

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