WO2009028364A1 - ダイシング装置 - Google Patents

ダイシング装置 Download PDF

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Publication number
WO2009028364A1
WO2009028364A1 PCT/JP2008/064799 JP2008064799W WO2009028364A1 WO 2009028364 A1 WO2009028364 A1 WO 2009028364A1 JP 2008064799 W JP2008064799 W JP 2008064799W WO 2009028364 A1 WO2009028364 A1 WO 2009028364A1
Authority
WO
WIPO (PCT)
Prior art keywords
bellows
oil pan
remnants
dicing apparatus
tables
Prior art date
Application number
PCT/JP2008/064799
Other languages
English (en)
French (fr)
Inventor
Junichi Ito
Original Assignee
Tokyo Seimitsu Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Seimitsu Co., Ltd. filed Critical Tokyo Seimitsu Co., Ltd.
Priority to JP2009530058A priority Critical patent/JPWO2009028364A1/ja
Publication of WO2009028364A1 publication Critical patent/WO2009028364A1/ja

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/06—Dust extraction equipment on grinding or polishing machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Auxiliary Devices For Machine Tools (AREA)

Abstract

　本発明の実施形態の形態のダイシング装置（１）は、Ｘテーブル（１６、１８）の真下にオイルパン（２０）を配置することにより、オイルパン（２０）の容積を十分に確保し、排水性を向上させている。また、Ｘテーブル（１６、１８）をＸ方向に移動自在に案内するガイドレール（２２、３６）と、ボールねじ（２４、３８）とをオイルパン（２０）の側面に沿って配置し、ガイドレール（２２、３６）と、ボールねじ（２４、３８）とを覆うそれぞれ一対の蛇腹（３４、４６）も同様にオイルパン（２０）の側面に沿って鉛直方向に配置した。蛇腹（３４、４６）に付着した端材は自重により蛇腹（３４、４６）に沿って流下し、十分な容積を有するオイルパン（２０）に落下して排出される。したがって、蛇腹（３４、４６）には、端材が堆積しないので、端材の堆積に起因する蛇腹（３４、４６）の破損を防止できる。
PCT/JP2008/064799 2007-08-28 2008-08-20 ダイシング装置 WO2009028364A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009530058A JPWO2009028364A1 (ja) 2007-08-28 2008-08-20 ダイシング装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007220930 2007-08-28
JP2007-220930 2007-08-28

Publications (1)

Publication Number Publication Date
WO2009028364A1 true WO2009028364A1 (ja) 2009-03-05

Family

ID=40387087

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/064799 WO2009028364A1 (ja) 2007-08-28 2008-08-20 ダイシング装置

Country Status (3)

Country Link
JP (1) JPWO2009028364A1 (ja)
TW (1) TW200911455A (ja)
WO (1) WO2009028364A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112405219A (zh) * 2020-10-20 2021-02-26 南京合信自动化有限公司 一种带有快速定位机构的机械零件加工用环保型打磨机器人

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5495832B2 (ja) * 2009-04-24 2014-05-21 株式会社東京精密 ダイシング装置、ダイシング装置ユニット及びダイシング方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003197560A (ja) * 2001-12-21 2003-07-11 Tokyo Seimitsu Co Ltd ダイシング装置
JP2005349551A (ja) * 2004-06-14 2005-12-22 Sodick Co Ltd 切削装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003197560A (ja) * 2001-12-21 2003-07-11 Tokyo Seimitsu Co Ltd ダイシング装置
JP2005349551A (ja) * 2004-06-14 2005-12-22 Sodick Co Ltd 切削装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112405219A (zh) * 2020-10-20 2021-02-26 南京合信自动化有限公司 一种带有快速定位机构的机械零件加工用环保型打磨机器人
CN112405219B (zh) * 2020-10-20 2022-09-23 南京合信自动化有限公司 一种带有快速定位机构的机械零件加工用打磨机器人

Also Published As

Publication number Publication date
JPWO2009028364A1 (ja) 2010-12-02
TW200911455A (en) 2009-03-16

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