TW200717544A - Conductive paste and wiring substrate with the same - Google Patents

Conductive paste and wiring substrate with the same

Info

Publication number
TW200717544A
TW200717544A TW095132281A TW95132281A TW200717544A TW 200717544 A TW200717544 A TW 200717544A TW 095132281 A TW095132281 A TW 095132281A TW 95132281 A TW95132281 A TW 95132281A TW 200717544 A TW200717544 A TW 200717544A
Authority
TW
Taiwan
Prior art keywords
v1rpm
rpm
viscosity
wiring substrate
electroconductive paste
Prior art date
Application number
TW095132281A
Other languages
English (en)
Chinese (zh)
Inventor
Takashi Kasuga
Kohei Shimoda
Original Assignee
Sumitomo Electric Industries
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries filed Critical Sumitomo Electric Industries
Publication of TW200717544A publication Critical patent/TW200717544A/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0263—Details about a collection of particles
    • H05K2201/0272—Mixed conductive particles, i.e. using different conductive particles, e.g. differing in shape
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0323—Carbon
TW095132281A 2005-09-02 2006-09-01 Conductive paste and wiring substrate with the same TW200717544A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005254385A JP4929653B2 (ja) 2005-09-02 2005-09-02 導電性ペーストおよびそれを用いた配線基板

Publications (1)

Publication Number Publication Date
TW200717544A true TW200717544A (en) 2007-05-01

Family

ID=37808895

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095132281A TW200717544A (en) 2005-09-02 2006-09-01 Conductive paste and wiring substrate with the same

Country Status (3)

Country Link
JP (1) JP4929653B2 (ja)
TW (1) TW200717544A (ja)
WO (1) WO2007026812A1 (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102057443A (zh) * 2008-06-04 2011-05-11 Lg化学株式会社 用于形成电极的金属膏组合物以及使用该组合物的银-碳复合电极和硅太阳能电池
CN105658745A (zh) * 2013-10-31 2016-06-08 昭和电工株式会社 薄膜印刷用导电性组合物及薄膜导电图案形成方法
TWI669722B (zh) * 2013-10-22 2019-08-21 日商日立化成股份有限公司 Silver paste and semiconductor device using the same
CN110519914A (zh) * 2019-08-28 2019-11-29 刘明炜 一种导热结构及其制备方法和应用

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010021371A (ja) 2008-07-10 2010-01-28 Fujitsu Ltd 配線基板、配線製造方法、および、導電性ペースト
JP2010272837A (ja) * 2009-04-24 2010-12-02 Sumitomo Electric Ind Ltd プリント配線板用基板、プリント配線板、及びプリント配線板用基板の製造方法
WO2010122918A1 (ja) * 2009-04-24 2010-10-28 住友電気工業株式会社 プリント配線板用基板、プリント配線板、及びそれらの製造方法
JP2011228481A (ja) * 2010-04-20 2011-11-10 Sumitomo Electric Printed Circuit Inc 導電性ペースト、フレキシブルプリント配線板、電子機器
JP5833298B2 (ja) * 2010-09-03 2015-12-16 株式会社ノリタケカンパニーリミテド 太陽電池の製造方法と該方法に用いられる電極形成用ペースト材料
KR102011523B1 (ko) * 2011-03-18 2019-08-16 스미토모 세이카 가부시키가이샤 금속 페이스트 조성물
TWI481326B (zh) * 2011-11-24 2015-04-11 Showa Denko Kk A conductive pattern forming method, and a conductive pattern forming composition by light irradiation or microwave heating
JP6484218B2 (ja) 2014-03-20 2019-03-13 住友電気工業株式会社 プリント配線板用基板及びプリント配線板
CN106134298B (zh) 2014-03-27 2019-02-22 住友电气工业株式会社 印刷线路板用基板、印刷线路板以及制造印刷线路板用基板的方法
US10703924B2 (en) * 2014-05-30 2020-07-07 Electroninks Writeables, Inc. Conductive ink for a rollerball pen and conductive trace formed on a substrate
CN107211537A (zh) 2015-01-22 2017-09-26 住友电气工业株式会社 印刷线路板用基材、印刷线路板以及印刷线路板的制造方法
JP7057738B2 (ja) * 2018-08-21 2022-04-20 Ｄｏｗａテクノロジー株式会社 硫化銅粉末の製造方法、および硫化銅粉末

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2802622B2 (ja) * 1987-12-15 1998-09-24 東洋紡績株式会社 導電性ペースト
JPH0685344B2 (ja) * 1992-03-31 1994-10-26 信越ポリマー株式会社 ヒ−トシ−ルコネクタ−の製造方法
JP3856074B2 (ja) * 1999-03-31 2006-12-13 ライオン株式会社 導電性ペースト及びその製造方法並びに二次電池用導電助剤
JP4681710B2 (ja) * 2000-04-28 2011-05-11 御国色素株式会社 電子写真用導電性高濃度カーボンブラック分散体およびその製造方法、ならびにそれからなる組成物
JP2005044771A (ja) * 2003-07-10 2005-02-17 Toyobo Co Ltd 導電性ペースト
JP2005078967A (ja) * 2003-09-01 2005-03-24 Toyobo Co Ltd 導電性ペースト
JP2005093105A (ja) * 2003-09-12 2005-04-07 Asahi Glass Co Ltd 導電性構造体およびその製造方法
JP4134878B2 (ja) * 2003-10-22 2008-08-20 株式会社デンソー 導体組成物および導体組成物を用いた実装基板ならびに実装構造
JP4363340B2 (ja) * 2004-03-12 2009-11-11 住友電気工業株式会社 導電性銀ペースト及びそれを用いた電磁波シールド部材
JP2005259546A (ja) * 2004-03-12 2005-09-22 Toyobo Co Ltd ロータリースクリーン印刷機用導電性ペースト及びそれを用いた導体回路

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102057443A (zh) * 2008-06-04 2011-05-11 Lg化学株式会社 用于形成电极的金属膏组合物以及使用该组合物的银-碳复合电极和硅太阳能电池
TWI669722B (zh) * 2013-10-22 2019-08-21 日商日立化成股份有限公司 Silver paste and semiconductor device using the same
CN105658745A (zh) * 2013-10-31 2016-06-08 昭和电工株式会社 薄膜印刷用导电性组合物及薄膜导电图案形成方法
US9845404B2 (en) 2013-10-31 2017-12-19 Showa Denko K.K. Conductive composition for thin film printing and method for forming thin film conductive pattern
CN105658745B (zh) * 2013-10-31 2019-06-04 昭和电工株式会社 薄膜印刷用导电性组合物及薄膜导电图案形成方法
CN110519914A (zh) * 2019-08-28 2019-11-29 刘明炜 一种导热结构及其制备方法和应用

Also Published As

Publication number Publication date
WO2007026812A1 (ja) 2007-03-08
JP4929653B2 (ja) 2012-05-09
JP2007066824A (ja) 2007-03-15

Similar Documents

Publication Publication Date Title
TW200717544A (en) Conductive paste and wiring substrate with the same
CN107112069B (zh) 导电性银浆
CN105264614B (zh) 聚合物厚膜铜导体组合物的光子烧结
JP4936142B2 (ja) 導電性ペースト組成物及び電子回路並びに電子部品
TW200739611A (en) Thermosetting type conductive paste and laminated ceramic electronic component having an external electrode formed by using such thermosetting type conductive paste
US20100119789A1 (en) Advanced conductive ink
WO2005044865A3 (en) Electrically conductive compositions and method of manufacture thereof
WO2011022188A3 (en) Formation of high electrical conductivity polymer composites with multiple fillers
DE602005013214D1 (de) Elektrisch leitfähige zusammensetzung und anwendung davon
WO2008027888A3 (en) Radio frequency and electromagnetic interference shielding
TW200603177A (en) Composition of conductive paste
BRPI0822649B8 (pt) Aparelho, método para estabelecer um padrão condutor sobre um substrato isolante plano, o substrato isolante plano e chipset do mesmo
CN103980854B (zh) 一种新型导电胶及其制备方法
CN101436442A (zh) 一种低温导电浆料
JP2010047716A (ja) スクリーン印刷用導電性インキ組成物及び導電性塗膜
TW200631034A (en) Conductive paste and flexible printed wiring board formed by using it
JP2009138155A (ja) 無溶剤型導電性接着剤
WO2010114272A3 (ko) 저온소성 가능한 전극 또는 배선 형성용 페이스트 조성물
KR102197541B1 (ko) 페이스트의 유변물성 예측방법
JP2010090264A (ja) 機能性導電塗料とそれを用いた印刷配線板の製造方法
KR20160001790A (ko) 전도성 실리콘 수지 조성물 및 이로부터 제조된 전자파 차폐용 가스켓
TW200735736A (en) Assembly with at leat two component in electrical leading effect connection and procedure for manufacturing the assembly
CN103219065B (zh) 一种基于碳纳米管-纳米铜粉的环保型导电浆料
US6500361B1 (en) Conductive resin composition and encoder switch using the same
KR100750331B1 (ko) 열 경화형 카본 저항 페이스트 조성물