TW200717544A - Conductive paste and wiring substrate with the same - Google Patents

Conductive paste and wiring substrate with the same

Info

Publication number
TW200717544A
TW200717544A TW095132281A TW95132281A TW200717544A TW 200717544 A TW200717544 A TW 200717544A TW 095132281 A TW095132281 A TW 095132281A TW 95132281 A TW95132281 A TW 95132281A TW 200717544 A TW200717544 A TW 200717544A
Authority
TW
Taiwan
Prior art keywords
v1rpm
rpm
viscosity
wiring substrate
electroconductive paste
Prior art date
Application number
TW095132281A
Other languages
Chinese (zh)
Inventor
Takashi Kasuga
Kohei Shimoda
Original Assignee
Sumitomo Electric Industries
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries filed Critical Sumitomo Electric Industries
Publication of TW200717544A publication Critical patent/TW200717544A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0263—Details about a collection of particles
    • H05K2201/0272—Mixed conductive particles, i.e. using different conductive particles, e.g. differing in shape
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0323—Carbon

Landscapes

  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Conductive Materials (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

The purpose of the present invention provides an electroconductive paste which could form a fine pattern having high electroconductivity with accuracy; and a wiring substrate by using the electroconductive paste. The electroconductive paste of the present invention comprises silver powder, carbon powder, binder resin and solvent as the major elements. The degree of thixotropy presented by the ratio (V1rpm/V10rpm) of the viscosity (V1rpm) when the rational frequency is 1 rpm and the viscosity (V10rpm) when the rational frequency is 10 rpm which both measured by using E type rotation viscometer under 25 DEG C. Besides, the viscosity (V1rpm) is 600 Pa.s when the rational frequency is 1 rpm.
TW095132281A 2005-09-02 2006-09-01 Conductive paste and wiring substrate with the same TW200717544A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005254385A JP4929653B2 (en) 2005-09-02 2005-09-02 Conductive paste and wiring board using the same

Publications (1)

Publication Number Publication Date
TW200717544A true TW200717544A (en) 2007-05-01

Family

ID=37808895

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095132281A TW200717544A (en) 2005-09-02 2006-09-01 Conductive paste and wiring substrate with the same

Country Status (3)

Country Link
JP (1) JP4929653B2 (en)
TW (1) TW200717544A (en)
WO (1) WO2007026812A1 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102057443A (en) * 2008-06-04 2011-05-11 Lg化学株式会社 Metallic paste composition for formation of an electrode, and Ag-C composite electrodes and silicon solar cells using the same
CN105658745A (en) * 2013-10-31 2016-06-08 昭和电工株式会社 Electrically conductive composition for thin film printing, and method for forming thin film conductive pattern
TWI669722B (en) * 2013-10-22 2019-08-21 日商日立化成股份有限公司 Silver paste and semiconductor device using the same
CN110519914A (en) * 2019-08-28 2019-11-29 刘明炜 A kind of conductive structure and its preparation method and application

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010021371A (en) 2008-07-10 2010-01-28 Fujitsu Ltd Printed wiring board, wiring manufacturing method, and conductive paste
WO2010122918A1 (en) * 2009-04-24 2010-10-28 住友電気工業株式会社 Substrate for printed wiring board, printed wiring board, and methods for producing same
JP2010272837A (en) * 2009-04-24 2010-12-02 Sumitomo Electric Ind Ltd Substrate for printed wiring board, printed wiring board, and method for producing substrate for printed wiring board
JP2011228481A (en) * 2010-04-20 2011-11-10 Sumitomo Electric Printed Circuit Inc Conductive paste, flexible printed-wiring board and electronic equipment
JP5833298B2 (en) * 2010-09-03 2015-12-16 株式会社ノリタケカンパニーリミテド Method for manufacturing solar cell and electrode forming paste material used in the method
JPWO2012128028A1 (en) * 2011-03-18 2014-07-24 住友精化株式会社 Metal paste composition
TWI481326B (en) * 2011-11-24 2015-04-11 Showa Denko Kk A conductive pattern forming method, and a conductive pattern forming composition by light irradiation or microwave heating
JP6484218B2 (en) 2014-03-20 2019-03-13 住友電気工業株式会社 Printed wiring board substrate and printed wiring board
US10237976B2 (en) 2014-03-27 2019-03-19 Sumitomo Electric Industries, Ltd. Substrate for printed circuit board, printed circuit board, and method for producing substrate for printed circuit board
WO2015183679A1 (en) * 2014-05-30 2015-12-03 Electroninks Writeables, Inc. Conductive ink for a rollerball pen and conductive trace formed on a substrate
JPWO2016117575A1 (en) 2015-01-22 2017-10-26 住友電気工業株式会社 Printed wiring board substrate, printed wiring board, and printed wiring board manufacturing method
JP7057738B2 (en) * 2018-08-21 2022-04-20 Ｄｏｗａテクノロジー株式会社 Manufacturing method of copper sulfide powder and copper sulfide powder

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2802622B2 (en) * 1987-12-15 1998-09-24 東洋紡績株式会社 Conductive paste
JPH0685344B2 (en) * 1992-03-31 1994-10-26 信越ポリマー株式会社 Method for manufacturing heat seal connector
JP3856074B2 (en) * 1999-03-31 2006-12-13 ライオン株式会社 Conductive paste, method for producing the same, and conductive additive for secondary battery
JP4681710B2 (en) * 2000-04-28 2011-05-11 御国色素株式会社 Electroconductive high-concentration carbon black dispersion, method for producing the same, and composition comprising the same
JP2005044771A (en) * 2003-07-10 2005-02-17 Toyobo Co Ltd Conductive paste
JP2005078967A (en) * 2003-09-01 2005-03-24 Toyobo Co Ltd Conductive paste
JP2005093105A (en) * 2003-09-12 2005-04-07 Asahi Glass Co Ltd Conductive structure and its manufacturing method
JP4134878B2 (en) * 2003-10-22 2008-08-20 株式会社デンソー Conductor composition, mounting substrate using the conductor composition, and mounting structure
JP4363340B2 (en) * 2004-03-12 2009-11-11 住友電気工業株式会社 Conductive silver paste and electromagnetic wave shielding member using the same
JP2005259546A (en) * 2004-03-12 2005-09-22 Toyobo Co Ltd Conductive paste for rotary screen printing apparatus and conductor circuit using the same

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102057443A (en) * 2008-06-04 2011-05-11 Lg化学株式会社 Metallic paste composition for formation of an electrode, and Ag-C composite electrodes and silicon solar cells using the same
TWI669722B (en) * 2013-10-22 2019-08-21 日商日立化成股份有限公司 Silver paste and semiconductor device using the same
CN105658745A (en) * 2013-10-31 2016-06-08 昭和电工株式会社 Electrically conductive composition for thin film printing, and method for forming thin film conductive pattern
US9845404B2 (en) 2013-10-31 2017-12-19 Showa Denko K.K. Conductive composition for thin film printing and method for forming thin film conductive pattern
CN105658745B (en) * 2013-10-31 2019-06-04 昭和电工株式会社 Film printing conductive composition and Thin film conductive pattern forming method
CN110519914A (en) * 2019-08-28 2019-11-29 刘明炜 A kind of conductive structure and its preparation method and application

Also Published As

Publication number Publication date
WO2007026812A1 (en) 2007-03-08
JP4929653B2 (en) 2012-05-09
JP2007066824A (en) 2007-03-15

Similar Documents

Publication Publication Date Title
TW200717544A (en) Conductive paste and wiring substrate with the same
CN107112069B (en) Conductive silver paste
CN105264614B (en) The photon sintering of polymer thick film copper conductor composition
JP4936142B2 (en) Conductive paste composition, electronic circuit, and electronic component
TW200739611A (en) Thermosetting type conductive paste and laminated ceramic electronic component having an external electrode formed by using such thermosetting type conductive paste
US20100119789A1 (en) Advanced conductive ink
TW200611945A (en) Conductive ink composition, reflective member, circuit substrate, and electronic apparatus
WO2005044865A3 (en) Electrically conductive compositions and method of manufacture thereof
WO2011022188A3 (en) Formation of high electrical conductivity polymer composites with multiple fillers
DE602005013214D1 (en) ELECTRICALLY CONDUCTIVE COMPOSITION AND APPLICATION THEREOF
TW200603177A (en) Composition of conductive paste
EP1753277A3 (en) Wiring circuit board
BRPI0822649B8 (en) APPLIANCE, METHOD FOR ESTABLISHING A CONDUCTIVE STANDARD ON A FLAT INSULATING SUBSTRATE, THE FLAT INSULATING SUBSTRATE AND THE SAME CHIPSET
WO2009054386A1 (en) Coated conductive powder and conductive adhesive using the same
CN103980854B (en) A kind of novel conductive glue and preparation method thereof
CN101436442A (en) Low-temperature conductive slurry
JP2010047716A (en) Electroconductive ink composition for screen printing and electroconductive coated film
JP2009138155A (en) Solventless conductive adhesive
KR102197541B1 (en) Method for predicting rheological properties of paste
TW200735736A (en) Assembly with at leat two component in electrical leading effect connection and procedure for manufacturing the assembly
CN103219065B (en) A kind of environmental-friendly conductive sizing agent based on carbon nanotube-nano copper powder
GB2439264A (en) Circuit materials circuits and methods of manufacture thereof
EP1074997B1 (en) Conductive resin composition and encoder switch using the same
KR100750331B1 (en) Thermosetting carbon resistance paste composition
JP2009070650A (en) Functional conductive coating, its manufacturing method, and printed wiring board