TW200629596A - Reflector for led and led device - Google Patents

Reflector for led and led device

Info

Publication number
TW200629596A
TW200629596A TW094130705A TW94130705A TW200629596A TW 200629596 A TW200629596 A TW 200629596A TW 094130705 A TW094130705 A TW 094130705A TW 94130705 A TW94130705 A TW 94130705A TW 200629596 A TW200629596 A TW 200629596A
Authority
TW
Taiwan
Prior art keywords
led
reflector
wiring board
printed wiring
mounting part
Prior art date
Application number
TW094130705A
Other languages
English (en)
Other versions
TWI313937B (zh
Inventor
Ryouji Sugiura
Hideki Yoshida
Original Assignee
Hitachi Aic Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Aic Inc filed Critical Hitachi Aic Inc
Publication of TW200629596A publication Critical patent/TW200629596A/zh
Application granted granted Critical
Publication of TWI313937B publication Critical patent/TWI313937B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
TW094130705A 2004-09-16 2005-09-07 Reflector for led and led device TW200629596A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004269513 2004-09-16

Publications (2)

Publication Number Publication Date
TW200629596A true TW200629596A (en) 2006-08-16
TWI313937B TWI313937B (zh) 2009-08-21

Family

ID=36059926

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094130705A TW200629596A (en) 2004-09-16 2005-09-07 Reflector for led and led device

Country Status (6)

Country Link
US (2) US7626211B2 (zh)
JP (1) JP4062358B2 (zh)
KR (1) KR100723618B1 (zh)
CN (1) CN100403565C (zh)
TW (1) TW200629596A (zh)
WO (1) WO2006030671A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI422076B (zh) * 2009-02-12 2014-01-01 Osram Opto Semiconductors Gmbh 半導體裝置及半導體裝置之製造方法

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US7723736B2 (en) * 2004-12-14 2010-05-25 Seoul Opto Device Co., Ltd. Light emitting device having a plurality of light emitting cells and package mounting the same
US8076680B2 (en) * 2005-03-11 2011-12-13 Seoul Semiconductor Co., Ltd. LED package having an array of light emitting cells coupled in series
EP1897146A2 (en) * 2005-06-27 2008-03-12 Lamina Lighting, Inc. Light emitting diode package and method for making same
JP2007088155A (ja) * 2005-09-21 2007-04-05 Stanley Electric Co Ltd 表面実装型ｌｅｄ基板
JP2007266546A (ja) * 2006-03-30 2007-10-11 Rohm Co Ltd 光通信モジュールおよびその製造方法
KR101136442B1 (ko) * 2006-04-28 2012-04-19 가부시키가이샤 시마네 덴시 이마후쿠 세이사쿠쇼 반도체 발광모듈, 장치 및 그 제조방법
KR100854328B1 (ko) * 2006-07-07 2008-08-28 엘지전자 주식회사 발광 소자 패키지 및 그 제조방법
JP4533352B2 (ja) * 2006-08-09 2010-09-01 昭和電工株式会社 発光装置、表示装置、およびカバー取付部材
TW200822384A (en) * 2006-11-03 2008-05-16 Coretronic Corp LED package structure
JP5326204B2 (ja) * 2006-11-29 2013-10-30 富士通株式会社 発光部品及びその製造方法及び発光部品組立体及び電子装置
KR100827667B1 (ko) * 2007-01-16 2008-05-07 삼성전자주식회사 기판 내에 반도체 칩을 갖는 반도체 패키지 및 이를제조하는 방법
KR101491138B1 (ko) * 2007-12-12 2015-02-09 엘지이노텍 주식회사 다층 기판 및 이를 구비한 발광 다이오드 모듈
JP2009278012A (ja) * 2008-05-16 2009-11-26 Meio Kasei:Kk Ｌｅｄ装置用パッケージ
US8288845B2 (en) * 2008-11-14 2012-10-16 Triquint Semiconductor, Inc. Package including proximately-positioned lead frame
KR101006246B1 (ko) * 2009-05-21 2011-01-07 에스브이에스 주식회사 발광다이오드용 적층 세라믹 방열판
KR100986544B1 (ko) * 2009-06-10 2010-10-07 엘지이노텍 주식회사 반도체 발광소자 및 그 제조방법
US8602593B2 (en) * 2009-10-15 2013-12-10 Cree, Inc. Lamp assemblies and methods of making the same
KR101041438B1 (ko) * 2009-12-02 2011-06-15 한국광기술원 이중천공을 구비하는 발광 다이오드 패키지 및 그의 제조방법
US8902382B2 (en) * 2009-12-22 2014-12-02 Sharp Kabushiki Kaisha Light emitting diode element, light source device, surface light source illumination device, and liquid crystal display device
KR101028195B1 (ko) * 2010-01-18 2011-04-11 엘지이노텍 주식회사 발광 소자 패키지 및 이를 구비한 라이트 유닛
EP2529420A1 (en) * 2010-01-25 2012-12-05 Vishay Sprague, Inc. Metal based electronic component package and the method of manufacturing the same
US8319247B2 (en) * 2010-03-25 2012-11-27 Koninklijke Philips Electronics N.V. Carrier for a light emitting device
KR101028329B1 (ko) * 2010-04-28 2011-04-12 엘지이노텍 주식회사 발광 소자 패키지 및 그 제조방법
JP2012023281A (ja) * 2010-07-16 2012-02-02 Nitto Denko Corp 発光装置の製法
US9070851B2 (en) 2010-09-24 2015-06-30 Seoul Semiconductor Co., Ltd. Wafer-level light emitting diode package and method of fabricating the same
CN102095091A (zh) * 2010-09-30 2011-06-15 福建省万邦光电科技有限公司 Led光源模组封装结构
CN103340017B (zh) * 2011-01-28 2015-04-22 首尔半导体株式会社 Led驱动电路封装
JP2012222191A (ja) * 2011-04-11 2012-11-12 Okuno Chem Ind Co Ltd Ｌｅｄ照明ユニット
KR101250372B1 (ko) * 2011-12-09 2013-04-05 엘지이노텍 주식회사 광소자 패키지 및 그 제조 방법
DE102011056654A1 (de) * 2011-12-20 2013-06-20 Vossloh-Schwabe Optoelectronic Gmbh & Co. Kg Leuchtdiodenanordnung
US8766654B2 (en) * 2012-03-27 2014-07-01 Universal Scientific Industrial Co., Ltd. Package structure with conformal shielding and inspection method using the same
JP2013239644A (ja) * 2012-05-16 2013-11-28 Toshiba Corp 半導体発光装置
KR101974349B1 (ko) * 2012-10-04 2019-05-02 삼성전자주식회사 발광모듈과 이를 이용한 조명장치
CN103115229B (zh) * 2013-02-27 2015-09-02 利亚德光电股份有限公司 Led显示单元及led显示***
JP6244130B2 (ja) * 2013-07-26 2017-12-06 新光電気工業株式会社 発光素子搭載用パッケージ及び発光素子パッケージ
CN205944139U (zh) 2016-03-30 2017-02-08 首尔伟傲世有限公司 紫外线发光二极管封装件以及包含此的发光二极管模块
JP1613484S (zh) * 2017-11-07 2018-09-10
CN109192838A (zh) * 2018-08-15 2019-01-11 深圳优卫乐得科技有限公司 一种紫外led光源模组制造方法
JPWO2020045604A1 (ja) * 2018-08-31 2021-08-12 パナソニックＩｐマネジメント株式会社 半導体素子搭載用パッケージ及び半導体装置
US10810932B2 (en) * 2018-10-02 2020-10-20 Sct Ltd. Molded LED display module and method of making thererof
US11444120B2 (en) * 2020-01-14 2022-09-13 Au Optronics Corporation Display apparatus and method of fabricating the same

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI422076B (zh) * 2009-02-12 2014-01-01 Osram Opto Semiconductors Gmbh 半導體裝置及半導體裝置之製造方法
US8710609B2 (en) 2009-02-12 2014-04-29 Osram Opto Semiconductors Gmbh Semiconductor arrangement with a solder resist layer

Also Published As

Publication number Publication date
WO2006030671A1 (ja) 2006-03-23
CN1898809A (zh) 2007-01-17
CN100403565C (zh) 2008-07-16
TWI313937B (zh) 2009-08-21
US7626211B2 (en) 2009-12-01
JP4062358B2 (ja) 2008-03-19
JPWO2006030671A1 (ja) 2008-07-31
US20100032693A1 (en) 2010-02-11
US20070063209A1 (en) 2007-03-22
KR20060085928A (ko) 2006-07-28
KR100723618B1 (ko) 2007-06-04

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees