SG82017A1 - Pressure sensitive adhesive double coated sheet and method of use thereof - Google Patents
Pressure sensitive adhesive double coated sheet and method of use thereofInfo
- Publication number
- SG82017A1 SG82017A1 SG9904187A SG1999004187A SG82017A1 SG 82017 A1 SG82017 A1 SG 82017A1 SG 9904187 A SG9904187 A SG 9904187A SG 1999004187 A SG1999004187 A SG 1999004187A SG 82017 A1 SG82017 A1 SG 82017A1
- Authority
- SG
- Singapore
- Prior art keywords
- sensitive adhesive
- pressure sensitive
- coated sheet
- double coated
- adhesive double
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
- B24B41/061—Work supports, e.g. adjustable steadies axially supporting turning workpieces, e.g. magnetically, pneumatically
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/6834—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
- Y10T156/1168—Gripping and pulling work apart during delaminating
- Y10T156/1179—Gripping and pulling work apart during delaminating with poking during delaminating [e.g., jabbing, etc.]
- Y10T156/1184—Piercing layer during delaminating [e.g., cutting, etc.]
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Ceramic Engineering (AREA)
- Organic Chemistry (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Dicing (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP24017098 | 1998-08-26 | ||
JP10980699A JP3784202B2 (ja) | 1998-08-26 | 1999-04-16 | 両面粘着シートおよびその使用方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG82017A1 true SG82017A1 (en) | 2001-07-24 |
Family
ID=26449521
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG9904187A SG82017A1 (en) | 1998-08-26 | 1999-08-25 | Pressure sensitive adhesive double coated sheet and method of use thereof |
Country Status (10)
Country | Link |
---|---|
US (1) | US6398892B1 (ja) |
JP (1) | JP3784202B2 (ja) |
KR (1) | KR100655036B1 (ja) |
CN (1) | CN1147555C (ja) |
DE (1) | DE19940390A1 (ja) |
GB (1) | GB2340772B (ja) |
HK (1) | HK1023786A1 (ja) |
MY (1) | MY123333A (ja) |
SG (1) | SG82017A1 (ja) |
TW (1) | TW513480B (ja) |
Families Citing this family (71)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7105226B2 (en) * | 1998-08-26 | 2006-09-12 | Lintec Corporation | Pressure sensitive adhesive double coated sheet and method of use thereof |
US6783620B1 (en) * | 1998-10-13 | 2004-08-31 | Matsushita Electronic Materials, Inc. | Thin-laminate panels for capacitive printed-circuit boards and methods for making the same |
US6114015A (en) * | 1998-10-13 | 2000-09-05 | Matsushita Electronic Materials, Inc. | Thin-laminate panels for capacitive printed-circuit boards and methods for making the same |
JP4275254B2 (ja) | 1999-06-17 | 2009-06-10 | リンテック株式会社 | 両面粘着シートに固定された物品の剥離方法および剥離装置 |
JP4137310B2 (ja) * | 1999-09-06 | 2008-08-20 | リンテック株式会社 | 両面粘着シートに固定された物品の剥離方法および剥離装置 |
JP4392732B2 (ja) | 2000-02-07 | 2010-01-06 | リンテック株式会社 | 半導体チップの製造方法 |
JP4230080B2 (ja) * | 2000-02-18 | 2009-02-25 | リンテック株式会社 | ウエハ貼着用粘着シート |
JP2002033296A (ja) * | 2000-04-26 | 2002-01-31 | Lintec Corp | シリコンウエハ用の補強材および該補強材を用いたicチップの製造方法 |
JP3768069B2 (ja) * | 2000-05-16 | 2006-04-19 | 信越半導体株式会社 | 半導体ウエーハの薄型化方法 |
JP2002075937A (ja) * | 2000-08-30 | 2002-03-15 | Nitto Denko Corp | 半導体ウエハの加工方法 |
CN1315615C (zh) * | 2000-09-27 | 2007-05-16 | 斯特拉斯保 | 用于设置弹性带的工具及相关方法 |
DE10048881A1 (de) | 2000-09-29 | 2002-03-07 | Infineon Technologies Ag | Vorrichtung und Verfahren zum planen Verbinden zweier Wafer für ein Dünnschleifen und ein Trennen eines Produkt-Wafers |
JP4109823B2 (ja) * | 2000-10-10 | 2008-07-02 | 株式会社東芝 | 半導体装置の製造方法 |
DE10052293A1 (de) * | 2000-10-20 | 2002-04-25 | B L E Lab Equipment Gmbh | Verfahren zum Aufbringen eines Substrats |
JP2002164414A (ja) * | 2000-11-27 | 2002-06-07 | Shinkawa Ltd | 半導体ペレット処理方法及び装置 |
JP2002203822A (ja) * | 2000-12-28 | 2002-07-19 | Lintec Corp | 脆性部材の加工方法および両面粘着シート |
DE10065686C2 (de) * | 2000-12-29 | 2002-11-14 | Infineon Technologies Ag | Verfahren zur Handhabung eines dünnen Halbleiterwafers oder Substrats |
JP2002270560A (ja) * | 2001-03-07 | 2002-09-20 | Lintec Corp | ウエハの加工方法 |
JP4482243B2 (ja) * | 2001-03-13 | 2010-06-16 | 株式会社新川 | ダイのピックアップ方法及びピックアップ装置 |
WO2003041154A2 (en) * | 2001-11-07 | 2003-05-15 | Schlumberger Systemes | A method of manufacturing a plurality of assemblies |
DE10157153A1 (de) * | 2001-11-22 | 2003-09-04 | Tesa Ag | Verfahren zur Herstellung haftklebriger Stanzprodukte |
JP2003218063A (ja) * | 2002-01-24 | 2003-07-31 | Canon Inc | ウエハ貼着用粘着シート及び該シートを利用する加工方法 |
JP3911174B2 (ja) * | 2002-03-01 | 2007-05-09 | シャープ株式会社 | 半導体素子の製造方法および半導体素子 |
US7238421B2 (en) * | 2002-03-28 | 2007-07-03 | Mitsui Chemicals, Inc. | Pressure sensitive adhesive film for protection of semiconductor wafer surface and method of protecting semiconductor wafer with the pressure sensitive adhesive film |
US7018268B2 (en) * | 2002-04-09 | 2006-03-28 | Strasbaugh | Protection of work piece during surface processing |
JP2004083633A (ja) * | 2002-08-23 | 2004-03-18 | Nihon Micro Coating Co Ltd | 研磨パッド及び研磨テープ用接着テープ |
JP4107417B2 (ja) * | 2002-10-15 | 2008-06-25 | 日東電工株式会社 | チップ状ワークの固定方法 |
DE10256247A1 (de) * | 2002-11-29 | 2004-06-09 | Andreas Jakob | Schichtverbund aus einer Trennschicht und einer Schutzschicht zum Schutze und zum Handling eines Wafers beim Dünnen, bei der Rückseitenbeschichtung und beim Vereinzeln |
JP2004319045A (ja) * | 2003-04-18 | 2004-11-11 | Lintec Corp | 光ディスク製造用シートおよび光ディスク |
JP4283596B2 (ja) * | 2003-05-29 | 2009-06-24 | 日東電工株式会社 | チップ状ワークの固定方法 |
JP4646508B2 (ja) * | 2003-10-01 | 2011-03-09 | 日東電工株式会社 | 両面接着テープ又はシートおよびその製造方法 |
JP4275522B2 (ja) | 2003-12-26 | 2009-06-10 | 日東電工株式会社 | ダイシング・ダイボンドフィルム |
JP4443962B2 (ja) | 2004-03-17 | 2010-03-31 | 日東電工株式会社 | ダイシング・ダイボンドフィルム |
KR100590198B1 (ko) * | 2004-03-25 | 2006-06-19 | 엘에스전선 주식회사 | 수축성 이형필름을 갖는 다이싱 필름 및 이를 이용한반도체 패키지 제조방법 |
JP4833519B2 (ja) * | 2004-03-31 | 2011-12-07 | 古河電気工業株式会社 | 両面粘着シート |
US7015064B1 (en) | 2004-04-23 | 2006-03-21 | National Semiconductor Corporation | Marking wafers using pigmentation in a mounting tape |
US7135385B1 (en) | 2004-04-23 | 2006-11-14 | National Semiconductor Corporation | Semiconductor devices having a back surface protective coating |
WO2005111166A2 (en) * | 2004-04-30 | 2005-11-24 | 3M Innovative Properties Company | Roll stabilized double-sided pressure sensitive adhesive tape assembly |
DE102004036794A1 (de) * | 2004-07-29 | 2006-03-23 | Konarka Technologies, Inc., Lowell | Aufbereitung eines Substrats |
US7101620B1 (en) | 2004-09-07 | 2006-09-05 | National Semiconductor Corporation | Thermal release wafer mount tape with B-stage adhesive |
DE102004058456A1 (de) * | 2004-12-03 | 2006-06-08 | Disco Hi-Tec Europe Gmbh | Verfahren zur Formkorrektur eines mit einer Schicht und/oder einer Klebefolie versehenen, dünngeschliffenen Wafers |
JP2006261519A (ja) * | 2005-03-18 | 2006-09-28 | Sharp Corp | 半導体装置及びその製造方法 |
TWI333672B (en) * | 2005-03-29 | 2010-11-21 | Furukawa Electric Co Ltd | Wafer-dicing adhesive tape and method of producing chips using the same |
JP4754278B2 (ja) * | 2005-06-23 | 2011-08-24 | リンテック株式会社 | チップ体の製造方法 |
JP5404992B2 (ja) * | 2006-03-20 | 2014-02-05 | 電気化学工業株式会社 | 仮固定用組成物、部材の仮固定方法とそれに用いる基材 |
DE102006025671B4 (de) * | 2006-06-01 | 2011-12-15 | Infineon Technologies Ag | Verfahren zur Herstellung von dünnen integrierten Halbleitereinrichtungen |
US8030138B1 (en) | 2006-07-10 | 2011-10-04 | National Semiconductor Corporation | Methods and systems of packaging integrated circuits |
US20100019365A1 (en) * | 2006-09-12 | 2010-01-28 | Nitto Denko Corporation | Dicing/die bonding film |
DE102007010710A1 (de) * | 2007-02-28 | 2008-09-04 | Q-Cells Ag | Carriersystem und Verfahren zum Prozessieren einer Mehrzahl von Substraten, die am Carriersystem fixiert sind |
US8282754B2 (en) | 2007-04-05 | 2012-10-09 | Avery Dennison Corporation | Pressure sensitive shrink label |
CN101679818A (zh) | 2007-04-05 | 2010-03-24 | 艾利丹尼森公司 | 压敏收缩标签 |
SG148884A1 (en) * | 2007-06-15 | 2009-01-29 | Micron Technology Inc | Method and system for removing tape from substrates |
US7749809B2 (en) * | 2007-12-17 | 2010-07-06 | National Semiconductor Corporation | Methods and systems for packaging integrated circuits |
US8048781B2 (en) * | 2008-01-24 | 2011-11-01 | National Semiconductor Corporation | Methods and systems for packaging integrated circuits |
US20100015329A1 (en) * | 2008-07-16 | 2010-01-21 | National Semiconductor Corporation | Methods and systems for packaging integrated circuits with thin metal contacts |
JP2010129700A (ja) * | 2008-11-26 | 2010-06-10 | Nitto Denko Corp | ダイシング・ダイボンドフィルム及び半導体装置の製造方法 |
JP2010263041A (ja) * | 2009-05-01 | 2010-11-18 | Nitto Denko Corp | ダイアタッチフィルム付きダイシングテープおよび半導体装置の製造方法 |
KR20120116008A (ko) | 2010-01-28 | 2012-10-19 | 애버리 데니슨 코포레이션 | 라벨 부착기 벨트 시스템 |
DE102010043871A1 (de) * | 2010-11-12 | 2012-05-16 | Tesa Se | Klebmasse und Verfahren zur Kapselung einer elektronischen Anordnung |
KR20120133890A (ko) * | 2011-06-01 | 2012-12-11 | 동우 화인켐 주식회사 | 유리 접합용 접착제 조성물, 이를 이용한 유리 접합체 및 화상표시장치 |
EP2734595A2 (en) * | 2011-07-19 | 2014-05-28 | 3M Innovative Properties Company | Heat-debondable adhesive article and methods of making and using the same |
EP2752867B1 (en) * | 2011-08-31 | 2019-01-02 | Soken Chemical & Engineering Co., Ltd. | Adhesive sheet for immobilizing imprint mold, imprint device, and imprint method |
JP2014011242A (ja) * | 2012-06-28 | 2014-01-20 | Nitto Denko Corp | Ledの製造方法 |
JP2014011243A (ja) * | 2012-06-28 | 2014-01-20 | Nitto Denko Corp | Ledの製造方法 |
US10471681B2 (en) | 2012-07-26 | 2019-11-12 | 3M Innovative Properties Company | Heat de-bondable adhesive articles |
CN103035483B (zh) * | 2012-08-28 | 2015-10-14 | 上海华虹宏力半导体制造有限公司 | 一种应用于薄硅片的临时键合和解离工艺方法 |
KR101527184B1 (ko) * | 2013-10-14 | 2015-06-09 | 도레이첨단소재 주식회사 | 전자 부품 공정용 양면 점착 백 테이프 및 이를 이용한 전자 부품의 분리방법 |
JP6156509B2 (ja) * | 2013-10-15 | 2017-07-05 | 三菱電機株式会社 | 半導体素子の製造方法 |
EP3180159B1 (en) | 2014-07-22 | 2021-04-07 | Blue Photon Technology&workholding Systems LLC | Method and devices to minimize work-piece distortion due to adhering stresses and changes in internal stresses |
CN108611010A (zh) * | 2018-03-30 | 2018-10-02 | 东莞市澳中电子材料有限公司 | 一种易清除的双面uv保护胶带及其制备方法 |
US11935865B2 (en) * | 2018-11-21 | 2024-03-19 | Mitsui Mining & Smelting Co., Ltd. | Semiconductor package manufacturing method, and adhesive sheet used therein |
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EP0157508A2 (en) * | 1984-03-12 | 1985-10-09 | Nitto Denko Corporation | Thin adhesive sheet for use in working semiconductor wafers |
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JPH0762304A (ja) * | 1993-08-31 | 1995-03-07 | Sekisui Chem Co Ltd | 粘着テープの製造方法 |
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JP2601956B2 (ja) | 1991-07-31 | 1997-04-23 | リンテック株式会社 | 再剥離型粘着性ポリマー |
GB2263195B (en) * | 1992-01-08 | 1996-03-20 | Murata Manufacturing Co | Component supply method |
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DE19520238C2 (de) * | 1995-06-02 | 1998-01-15 | Beiersdorf Ag | Selbstklebeband |
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JP3388674B2 (ja) * | 1996-04-19 | 2003-03-24 | リンテック株式会社 | エネルギー線硬化型感圧接着剤組成物およびその利用方法 |
JPH10150007A (ja) * | 1996-11-18 | 1998-06-02 | Toyo Chem Co Ltd | 半導体ウエハ固定用シート |
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-
1999
- 1999-04-16 JP JP10980699A patent/JP3784202B2/ja not_active Expired - Lifetime
- 1999-08-25 DE DE19940390A patent/DE19940390A1/de not_active Ceased
- 1999-08-25 TW TW088114514A patent/TW513480B/zh not_active IP Right Cessation
- 1999-08-25 US US09/382,965 patent/US6398892B1/en not_active Expired - Lifetime
- 1999-08-25 SG SG9904187A patent/SG82017A1/en unknown
- 1999-08-25 GB GB9920154A patent/GB2340772B/en not_active Expired - Fee Related
- 1999-08-25 KR KR1019990035415A patent/KR100655036B1/ko not_active IP Right Cessation
- 1999-08-26 CN CNB991183487A patent/CN1147555C/zh not_active Expired - Fee Related
- 1999-08-26 MY MYPI99003686A patent/MY123333A/en unknown
-
2000
- 2000-05-16 HK HK00102925A patent/HK1023786A1/xx not_active IP Right Cessation
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0157508A2 (en) * | 1984-03-12 | 1985-10-09 | Nitto Denko Corporation | Thin adhesive sheet for use in working semiconductor wafers |
US4965127A (en) * | 1985-12-27 | 1990-10-23 | Fsk Kabushiki Kaisha | Adhesive sheets |
JPH0762304A (ja) * | 1993-08-31 | 1995-03-07 | Sekisui Chem Co Ltd | 粘着テープの製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JP2000136362A (ja) | 2000-05-16 |
HK1023786A1 (en) | 2000-09-22 |
MY123333A (en) | 2006-05-31 |
GB2340772B (en) | 2002-08-14 |
CN1147555C (zh) | 2004-04-28 |
GB2340772A (en) | 2000-03-01 |
KR20000017531A (ko) | 2000-03-25 |
US6398892B1 (en) | 2002-06-04 |
TW513480B (en) | 2002-12-11 |
DE19940390A1 (de) | 2000-03-16 |
CN1245819A (zh) | 2000-03-01 |
KR100655036B1 (ko) | 2006-12-07 |
JP3784202B2 (ja) | 2006-06-07 |
GB9920154D0 (en) | 1999-10-27 |
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