SG11201508701YA - Resin molding die set and resin molding apparatus - Google Patents

Resin molding die set and resin molding apparatus

Info

Publication number
SG11201508701YA
SG11201508701YA SG11201508701YA SG11201508701YA SG11201508701YA SG 11201508701Y A SG11201508701Y A SG 11201508701YA SG 11201508701Y A SG11201508701Y A SG 11201508701YA SG 11201508701Y A SG11201508701Y A SG 11201508701YA SG 11201508701Y A SG11201508701Y A SG 11201508701YA
Authority
SG
Singapore
Prior art keywords
resin molding
die set
molding die
molding apparatus
resin
Prior art date
Application number
SG11201508701YA
Other languages
English (en)
Inventor
Makoto Kawaguchi
Shinya Tajima
Kenji Nakajima
Original Assignee
Apic Yamada Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Apic Yamada Corp filed Critical Apic Yamada Corp
Publication of SG11201508701YA publication Critical patent/SG11201508701YA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/12—Moulds or cores; Details thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/12—Moulds or cores; Details thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels
    • B29C33/123—Moulds or cores; Details thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels for centering the inserts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould
    • B29C2045/14098—Positioning or centering articles in the mould fixing or clamping inserts having variable dimensions

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
SG11201508701YA 2013-06-14 2014-04-25 Resin molding die set and resin molding apparatus SG11201508701YA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013125978A JP6062810B2 (ja) 2013-06-14 2013-06-14 樹脂モールド金型及び樹脂モールド装置
PCT/JP2014/061748 WO2014199733A1 (ja) 2013-06-14 2014-04-25 樹脂モールド金型及び樹脂モールド装置

Publications (1)

Publication Number Publication Date
SG11201508701YA true SG11201508701YA (en) 2015-12-30

Family

ID=52022035

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201508701YA SG11201508701YA (en) 2013-06-14 2014-04-25 Resin molding die set and resin molding apparatus

Country Status (6)

Country Link
JP (1) JP6062810B2 (ko)
KR (2) KR102301482B1 (ko)
CN (1) CN105283289B (ko)
SG (1) SG11201508701YA (ko)
TW (1) TWI593538B (ko)
WO (1) WO2014199733A1 (ko)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3271131B1 (en) * 2015-03-20 2020-12-30 Husky Injection Molding Systems Ltd. Molding system having a mold stack with a cleaning configuration and a shut height adjustment mechanism
JP6236486B2 (ja) * 2016-03-07 2017-11-22 Ｔｏｗａ株式会社 位置調節機構、樹脂封止装置、樹脂封止方法、及び樹脂封止製品の製造方法。
JP6499105B2 (ja) * 2016-03-11 2019-04-10 東芝メモリ株式会社 金型
JP6576862B2 (ja) * 2016-03-16 2019-09-18 東芝メモリ株式会社 トランスファ成型装置
JP6710107B2 (ja) * 2016-06-10 2020-06-17 アサヒ・エンジニアリング株式会社 樹脂封止装置
JP7036720B2 (ja) * 2016-07-08 2022-03-15 株式会社小糸製作所 金型および二色成形品の製造方法
CN106079282B (zh) * 2016-07-25 2018-04-17 安徽宁国中鼎模具制造有限公司 一种新型结构注塑包胶手柄模具
KR101953260B1 (ko) 2016-09-23 2019-02-28 동국실업 주식회사 수지역류 가스 인젝션을 이용한 수지 성형물 제조 방법
JP6304517B1 (ja) * 2017-02-14 2018-04-04 第一精工株式会社 樹脂封止方法及び樹脂封止装置
JP6721525B2 (ja) 2017-03-03 2020-07-15 キオクシア株式会社 金型
JP6822901B2 (ja) * 2017-06-02 2021-01-27 アピックヤマダ株式会社 樹脂モールド金型及び樹脂モールド装置
JP6891048B2 (ja) * 2017-06-02 2021-06-18 アピックヤマダ株式会社 樹脂モールド金型及び樹脂モールド装置
KR101973630B1 (ko) 2017-10-23 2019-09-02 케이비아이동국실업 주식회사 수지역류 가스 인젝션을 이용한 수지 성형물 제조 방법
JP6861609B2 (ja) * 2017-10-30 2021-04-21 Ｔｏｗａ株式会社 樹脂成形装置及び樹脂成形品の製造方法
JP6541746B2 (ja) * 2017-10-30 2019-07-10 Ｔｏｗａ株式会社 樹脂成形装置及び樹脂成形品の製造方法
CN108198764B (zh) * 2017-12-18 2019-07-02 重庆市长寿区普爱网络科技有限公司 电子元器件制造方法
DE102017131110A1 (de) * 2017-12-22 2019-06-27 Osram Opto Semiconductors Gmbh Verfahren zum einbetten von optoelektronischen bauelementen in eine schicht
TWI787417B (zh) * 2018-02-09 2022-12-21 日商山田尖端科技股份有限公司 壓縮成形用模具及壓縮成形裝置
JP6936177B2 (ja) * 2018-03-23 2021-09-15 アピックヤマダ株式会社 樹脂モールド装置
JP7102238B2 (ja) * 2018-06-08 2022-07-19 Ｔｏｗａ株式会社 樹脂成形装置および樹脂成形品の製造方法
DE102018214823A1 (de) 2018-08-31 2020-03-05 Bayerische Motoren Werke Aktiengesellschaft Spritzgusswerkzeug
NL2021845B1 (en) * 2018-10-22 2020-05-13 Besi Netherlands Bv Mould half and mould method for encapsulating electronic components mounted on a carrier including a dual support surface and a method for using such
CN109545694B (zh) * 2018-11-13 2020-11-17 无锡中微高科电子有限公司 一种破损基板的模封方法
JP7084348B2 (ja) 2019-04-25 2022-06-14 Ｔｏｗａ株式会社 樹脂成形装置及び樹脂成形品の製造方法
JP7084349B2 (ja) * 2019-04-25 2022-06-14 Ｔｏｗａ株式会社 樹脂成形装置及び樹脂成形品の製造方法
KR102257217B1 (ko) * 2019-06-18 2021-05-28 한국생산기술연구원 포탄형 사출 제품 상에 에어 트랩 방지를 위한 장치
CN111391219B (zh) * 2020-03-20 2021-12-24 东莞市艾尔玛塑件科技有限公司 一种模内转印***
JP7277936B2 (ja) * 2020-04-28 2023-05-19 アピックヤマダ株式会社 樹脂モールド装置
JP7417495B2 (ja) 2020-08-28 2024-01-18 Ｔｏｗａ株式会社 樹脂成形装置及び樹脂成形品の製造方法
CN115214068B (zh) * 2021-04-25 2024-01-23 广州汽车集团股份有限公司 一种成型孔的加工模具及加工方法
KR102446919B1 (ko) * 2021-06-02 2022-09-23 한화솔루션 주식회사 언더커버 성형장치
KR102408586B1 (ko) * 2021-08-23 2022-06-16 광성기업 주식회사 금형 장치 및 사출 금형 방법
KR20240073105A (ko) * 2022-01-25 2024-05-24 아픽 야마다 가부시끼가이샤 수지 봉지 장치, 봉지 금형, 및 수지 봉지 방법
KR102494872B1 (ko) * 2022-05-31 2023-02-07 장용수 방수판 제조 장치 및 방법

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002217222A (ja) * 2001-01-17 2002-08-02 Mitsubishi Electric Corp 半導体製造装置及び半導体製造方法
US7985357B2 (en) * 2005-07-12 2011-07-26 Towa Corporation Method of resin-sealing and molding an optical device
JP4194596B2 (ja) * 2005-11-25 2008-12-10 第一精工株式会社 樹脂封止金型装置および樹脂封止方法
EP2540776B1 (en) * 2007-09-25 2017-08-09 Hitachi Chemical Co., Ltd. Thermosetting light-reflecting resin composition, optical semiconductor element mounting board produced therewith, method for manufacture thereof, and optical semiconductor device
JP5352896B2 (ja) 2008-01-19 2013-11-27 アピックヤマダ株式会社 トランスファ成形方法及びトランスファ成形装置
JP5140517B2 (ja) * 2008-08-07 2013-02-06 アピックヤマダ株式会社 樹脂モールド装置および樹脂モールド方法
JP5185069B2 (ja) * 2008-10-31 2013-04-17 アピックヤマダ株式会社 トランスファモールド金型およびトランスファモールド装置とこれを用いた樹脂成形方法
JP5215886B2 (ja) * 2009-01-27 2013-06-19 Ｔｏｗａ株式会社 電子部品の樹脂封止成形装置
JP5560479B2 (ja) * 2009-07-01 2014-07-30 アピックヤマダ株式会社 樹脂モールド金型及び樹脂モールド装置、並びに樹脂モールド方法
JP2012035433A (ja) * 2010-08-04 2012-02-23 Sumitomo Heavy Ind Ltd 圧縮成形用金型及び圧縮成形方法
JP5663785B2 (ja) * 2010-12-17 2015-02-04 アピックヤマダ株式会社 樹脂モールド方法及び樹脂モールド装置
JP5807898B2 (ja) * 2011-03-24 2015-11-10 アピックヤマダ株式会社 モールド金型及びこれを用いた樹脂モールド装置
JP5906528B2 (ja) * 2011-07-29 2016-04-20 アピックヤマダ株式会社 モールド金型及びこれを用いた樹脂モールド装置
KR101603932B1 (ko) * 2011-09-30 2016-03-25 디아이씨 가부시끼가이샤 활성 에너지선 경화형 수지 조성물, 그 제조 방법, 도료, 도막, 및 필름

Also Published As

Publication number Publication date
TW201446458A (zh) 2014-12-16
WO2014199733A1 (ja) 2014-12-18
KR102301482B1 (ko) 2021-09-13
KR102208459B1 (ko) 2021-01-27
KR20210011070A (ko) 2021-01-29
CN105283289B (zh) 2017-08-08
JP6062810B2 (ja) 2017-01-18
TWI593538B (zh) 2017-08-01
JP2015000520A (ja) 2015-01-05
CN105283289A (zh) 2016-01-27
KR20160021240A (ko) 2016-02-24

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