CN105283289B - 树脂模塑用模组和树脂模塑装置 - Google Patents
树脂模塑用模组和树脂模塑装置 Download PDFInfo
- Publication number
- CN105283289B CN105283289B CN201480033965.9A CN201480033965A CN105283289B CN 105283289 B CN105283289 B CN 105283289B CN 201480033965 A CN201480033965 A CN 201480033965A CN 105283289 B CN105283289 B CN 105283289B
- Authority
- CN
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- Prior art keywords
- die cavity
- resin
- mould
- block
- moulded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 239000011347 resin Substances 0.000 title claims abstract description 241
- 229920005989 resin Polymers 0.000 title claims abstract description 241
- 238000000465 moulding Methods 0.000 title claims description 109
- 230000007246 mechanism Effects 0.000 claims abstract description 104
- 230000009471 action Effects 0.000 claims description 46
- 239000007788 liquid Substances 0.000 claims description 34
- 230000033001 locomotion Effects 0.000 claims description 15
- 238000003825 pressing Methods 0.000 claims description 13
- 230000015572 biosynthetic process Effects 0.000 claims description 11
- 230000008859 change Effects 0.000 claims description 9
- 230000009467 reduction Effects 0.000 claims description 9
- 238000007667 floating Methods 0.000 claims description 6
- 230000002093 peripheral effect Effects 0.000 claims description 5
- 239000011800 void material Substances 0.000 claims description 4
- 238000007599 discharging Methods 0.000 claims description 3
- 230000006837 decompression Effects 0.000 claims description 2
- 230000001815 facial effect Effects 0.000 claims description 2
- 238000010521 absorption reaction Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 abstract description 114
- 239000004065 semiconductor Substances 0.000 abstract description 73
- 238000001746 injection moulding Methods 0.000 abstract description 4
- 239000000243 solution Substances 0.000 abstract description 3
- 238000007493 shaping process Methods 0.000 description 28
- 230000005540 biological transmission Effects 0.000 description 16
- 238000007789 sealing Methods 0.000 description 13
- 238000001816 cooling Methods 0.000 description 8
- 230000000694 effects Effects 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 230000037237 body shape Effects 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 4
- 229920001296 polysiloxane Polymers 0.000 description 4
- 239000000725 suspension Substances 0.000 description 4
- 239000000945 filler Substances 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 2
- -1 polypropylene Polymers 0.000 description 2
- 238000004382 potting Methods 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229920000840 ethylene tetrafluoroethylene copolymer Polymers 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
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- 239000011159 matrix material Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229920009441 perflouroethylene propylene Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/12—Moulds or cores; Details thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/12—Moulds or cores; Details thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels
- B29C33/123—Moulds or cores; Details thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels for centering the inserts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14065—Positioning or centering articles in the mould
- B29C2045/14098—Positioning or centering articles in the mould fixing or clamping inserts having variable dimensions
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013-125978 | 2013-06-14 | ||
JP2013125978A JP6062810B2 (ja) | 2013-06-14 | 2013-06-14 | 樹脂モールド金型及び樹脂モールド装置 |
PCT/JP2014/061748 WO2014199733A1 (ja) | 2013-06-14 | 2014-04-25 | 樹脂モールド金型及び樹脂モールド装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN105283289A CN105283289A (zh) | 2016-01-27 |
CN105283289B true CN105283289B (zh) | 2017-08-08 |
Family
ID=52022035
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201480033965.9A Active CN105283289B (zh) | 2013-06-14 | 2014-04-25 | 树脂模塑用模组和树脂模塑装置 |
Country Status (6)
Country | Link |
---|---|
JP (1) | JP6062810B2 (ko) |
KR (2) | KR102301482B1 (ko) |
CN (1) | CN105283289B (ko) |
SG (1) | SG11201508701YA (ko) |
TW (1) | TWI593538B (ko) |
WO (1) | WO2014199733A1 (ko) |
Families Citing this family (34)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3271131B1 (en) * | 2015-03-20 | 2020-12-30 | Husky Injection Molding Systems Ltd. | Molding system having a mold stack with a cleaning configuration and a shut height adjustment mechanism |
JP6236486B2 (ja) * | 2016-03-07 | 2017-11-22 | Towa株式会社 | 位置調節機構、樹脂封止装置、樹脂封止方法、及び樹脂封止製品の製造方法。 |
JP6499105B2 (ja) * | 2016-03-11 | 2019-04-10 | 東芝メモリ株式会社 | 金型 |
JP6576862B2 (ja) * | 2016-03-16 | 2019-09-18 | 東芝メモリ株式会社 | トランスファ成型装置 |
JP6710107B2 (ja) * | 2016-06-10 | 2020-06-17 | アサヒ・エンジニアリング株式会社 | 樹脂封止装置 |
JP7036720B2 (ja) * | 2016-07-08 | 2022-03-15 | 株式会社小糸製作所 | 金型および二色成形品の製造方法 |
CN106079282B (zh) * | 2016-07-25 | 2018-04-17 | 安徽宁国中鼎模具制造有限公司 | 一种新型结构注塑包胶手柄模具 |
KR101953260B1 (ko) | 2016-09-23 | 2019-02-28 | 동국실업 주식회사 | 수지역류 가스 인젝션을 이용한 수지 성형물 제조 방법 |
JP6304517B1 (ja) * | 2017-02-14 | 2018-04-04 | 第一精工株式会社 | 樹脂封止方法及び樹脂封止装置 |
JP6721525B2 (ja) | 2017-03-03 | 2020-07-15 | キオクシア株式会社 | 金型 |
JP6822901B2 (ja) * | 2017-06-02 | 2021-01-27 | アピックヤマダ株式会社 | 樹脂モールド金型及び樹脂モールド装置 |
JP6891048B2 (ja) * | 2017-06-02 | 2021-06-18 | アピックヤマダ株式会社 | 樹脂モールド金型及び樹脂モールド装置 |
KR101973630B1 (ko) | 2017-10-23 | 2019-09-02 | 케이비아이동국실업 주식회사 | 수지역류 가스 인젝션을 이용한 수지 성형물 제조 방법 |
JP6861609B2 (ja) * | 2017-10-30 | 2021-04-21 | Towa株式会社 | 樹脂成形装置及び樹脂成形品の製造方法 |
JP6541746B2 (ja) * | 2017-10-30 | 2019-07-10 | Towa株式会社 | 樹脂成形装置及び樹脂成形品の製造方法 |
CN108198764B (zh) * | 2017-12-18 | 2019-07-02 | 重庆市长寿区普爱网络科技有限公司 | 电子元器件制造方法 |
DE102017131110A1 (de) * | 2017-12-22 | 2019-06-27 | Osram Opto Semiconductors Gmbh | Verfahren zum einbetten von optoelektronischen bauelementen in eine schicht |
TWI787417B (zh) * | 2018-02-09 | 2022-12-21 | 日商山田尖端科技股份有限公司 | 壓縮成形用模具及壓縮成形裝置 |
JP6936177B2 (ja) * | 2018-03-23 | 2021-09-15 | アピックヤマダ株式会社 | 樹脂モールド装置 |
JP7102238B2 (ja) * | 2018-06-08 | 2022-07-19 | Towa株式会社 | 樹脂成形装置および樹脂成形品の製造方法 |
DE102018214823A1 (de) | 2018-08-31 | 2020-03-05 | Bayerische Motoren Werke Aktiengesellschaft | Spritzgusswerkzeug |
NL2021845B1 (en) * | 2018-10-22 | 2020-05-13 | Besi Netherlands Bv | Mould half and mould method for encapsulating electronic components mounted on a carrier including a dual support surface and a method for using such |
CN109545694B (zh) * | 2018-11-13 | 2020-11-17 | 无锡中微高科电子有限公司 | 一种破损基板的模封方法 |
JP7084348B2 (ja) | 2019-04-25 | 2022-06-14 | Towa株式会社 | 樹脂成形装置及び樹脂成形品の製造方法 |
JP7084349B2 (ja) * | 2019-04-25 | 2022-06-14 | Towa株式会社 | 樹脂成形装置及び樹脂成形品の製造方法 |
KR102257217B1 (ko) * | 2019-06-18 | 2021-05-28 | 한국생산기술연구원 | 포탄형 사출 제품 상에 에어 트랩 방지를 위한 장치 |
CN111391219B (zh) * | 2020-03-20 | 2021-12-24 | 东莞市艾尔玛塑件科技有限公司 | 一种模内转印*** |
JP7277936B2 (ja) * | 2020-04-28 | 2023-05-19 | アピックヤマダ株式会社 | 樹脂モールド装置 |
JP7417495B2 (ja) | 2020-08-28 | 2024-01-18 | Towa株式会社 | 樹脂成形装置及び樹脂成形品の製造方法 |
CN115214068B (zh) * | 2021-04-25 | 2024-01-23 | 广州汽车集团股份有限公司 | 一种成型孔的加工模具及加工方法 |
KR102446919B1 (ko) * | 2021-06-02 | 2022-09-23 | 한화솔루션 주식회사 | 언더커버 성형장치 |
KR102408586B1 (ko) * | 2021-08-23 | 2022-06-16 | 광성기업 주식회사 | 금형 장치 및 사출 금형 방법 |
KR20240073105A (ko) * | 2022-01-25 | 2024-05-24 | 아픽 야마다 가부시끼가이샤 | 수지 봉지 장치, 봉지 금형, 및 수지 봉지 방법 |
KR102494872B1 (ko) * | 2022-05-31 | 2023-02-07 | 장용수 | 방수판 제조 장치 및 방법 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2002217222A (ja) * | 2001-01-17 | 2002-08-02 | Mitsubishi Electric Corp | 半導体製造装置及び半導体製造方法 |
US7985357B2 (en) * | 2005-07-12 | 2011-07-26 | Towa Corporation | Method of resin-sealing and molding an optical device |
JP4194596B2 (ja) * | 2005-11-25 | 2008-12-10 | 第一精工株式会社 | 樹脂封止金型装置および樹脂封止方法 |
EP2540776B1 (en) * | 2007-09-25 | 2017-08-09 | Hitachi Chemical Co., Ltd. | Thermosetting light-reflecting resin composition, optical semiconductor element mounting board produced therewith, method for manufacture thereof, and optical semiconductor device |
JP5352896B2 (ja) | 2008-01-19 | 2013-11-27 | アピックヤマダ株式会社 | トランスファ成形方法及びトランスファ成形装置 |
JP5140517B2 (ja) * | 2008-08-07 | 2013-02-06 | アピックヤマダ株式会社 | 樹脂モールド装置および樹脂モールド方法 |
JP5185069B2 (ja) * | 2008-10-31 | 2013-04-17 | アピックヤマダ株式会社 | トランスファモールド金型およびトランスファモールド装置とこれを用いた樹脂成形方法 |
JP5215886B2 (ja) * | 2009-01-27 | 2013-06-19 | Towa株式会社 | 電子部品の樹脂封止成形装置 |
JP5560479B2 (ja) * | 2009-07-01 | 2014-07-30 | アピックヤマダ株式会社 | 樹脂モールド金型及び樹脂モールド装置、並びに樹脂モールド方法 |
JP2012035433A (ja) * | 2010-08-04 | 2012-02-23 | Sumitomo Heavy Ind Ltd | 圧縮成形用金型及び圧縮成形方法 |
JP5663785B2 (ja) * | 2010-12-17 | 2015-02-04 | アピックヤマダ株式会社 | 樹脂モールド方法及び樹脂モールド装置 |
JP5807898B2 (ja) * | 2011-03-24 | 2015-11-10 | アピックヤマダ株式会社 | モールド金型及びこれを用いた樹脂モールド装置 |
JP5906528B2 (ja) * | 2011-07-29 | 2016-04-20 | アピックヤマダ株式会社 | モールド金型及びこれを用いた樹脂モールド装置 |
KR101603932B1 (ko) * | 2011-09-30 | 2016-03-25 | 디아이씨 가부시끼가이샤 | 활성 에너지선 경화형 수지 조성물, 그 제조 방법, 도료, 도막, 및 필름 |
-
2013
- 2013-06-14 JP JP2013125978A patent/JP6062810B2/ja active Active
-
2014
- 2014-04-25 SG SG11201508701YA patent/SG11201508701YA/en unknown
- 2014-04-25 KR KR1020217002052A patent/KR102301482B1/ko active IP Right Grant
- 2014-04-25 WO PCT/JP2014/061748 patent/WO2014199733A1/ja active Application Filing
- 2014-04-25 CN CN201480033965.9A patent/CN105283289B/zh active Active
- 2014-04-25 KR KR1020167001126A patent/KR102208459B1/ko active IP Right Grant
- 2014-06-13 TW TW103120404A patent/TWI593538B/zh active
Also Published As
Publication number | Publication date |
---|---|
TW201446458A (zh) | 2014-12-16 |
WO2014199733A1 (ja) | 2014-12-18 |
KR102301482B1 (ko) | 2021-09-13 |
KR102208459B1 (ko) | 2021-01-27 |
KR20210011070A (ko) | 2021-01-29 |
SG11201508701YA (en) | 2015-12-30 |
JP6062810B2 (ja) | 2017-01-18 |
TWI593538B (zh) | 2017-08-01 |
JP2015000520A (ja) | 2015-01-05 |
CN105283289A (zh) | 2016-01-27 |
KR20160021240A (ko) | 2016-02-24 |
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