KR970067653A - 웨이퍼 습식 처리장치 - Google Patents

웨이퍼 습식 처리장치 Download PDF

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Publication number
KR970067653A
KR970067653A KR1019960006618A KR19960006618A KR970067653A KR 970067653 A KR970067653 A KR 970067653A KR 1019960006618 A KR1019960006618 A KR 1019960006618A KR 19960006618 A KR19960006618 A KR 19960006618A KR 970067653 A KR970067653 A KR 970067653A
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KR
South Korea
Prior art keywords
wall
wafer
treatment tank
wafer transfer
processing
Prior art date
Application number
KR1019960006618A
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English (en)
Other versions
KR100211074B1 (ko
Inventor
한석빈
허윤준
Original Assignee
문정환
Lg 반도체주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 문정환, Lg 반도체주식회사 filed Critical 문정환
Priority to KR1019960006618A priority Critical patent/KR100211074B1/ko
Priority to US08/803,640 priority patent/US5845663A/en
Priority to JP09039574A priority patent/JP3143865B2/ja
Publication of KR970067653A publication Critical patent/KR970067653A/ko
Application granted granted Critical
Publication of KR100211074B1 publication Critical patent/KR100211074B1/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B11/00—Cleaning flexible or delicate articles by methods or apparatus specially adapted thereto
    • B08B11/02—Devices for holding articles during cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Weting (AREA)

Abstract

본 발명은 웨이퍼 습식 처리장치에 관한 것으로, 처리액이 바닥으로 유입되어 벽으로 흘러넘치는 처리조와, 바닥과 상면이 개구되고 처리조에 삽입되어 적어도 벽 외면의 하단부가 처리조 벽과 접하여 처리액이 내부로 통과하는 웨이퍼 운반통을 포함하여 이루어진다. 여기서, 웨이퍼 운반통이 처리조에 삽입되어 벽 외면이 처리조 벽 내면과 접하는 것, 처리조는 벽의 내면 일부 또는 전부가 상기 웨이퍼 운반통 벽 외면과 소정각을 이루는 경사면이고 처리조의 경사면과 대응하는 웨이퍼 운반통 벽 부위는 상부가 바깥쪽으로 굴절되어 처리조 벽과 접하는 흐름 안내부를 포함하는 것이 특징이다.

Description

웨이퍼 습식 처리장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제3도는 본 발명에 따른 웨이퍼 습식 처리장치의 일실시예를 도시한 도면.

Claims (9)

  1. 웨이퍼 습식 처리장치에 있어서, 처리액이 바닥으로 유입되어 벽으로 흘러넘치는 처리조와, 바닥과 상면이 개구되고, 상기 처리조에 삽입되어 적어도 벽 외면의 하단부가 상기 처리조 벽과 접하여 처리액이 내부로 통과하는 웨이퍼 운반통을 포함하여 이루어진 웨이퍼 습식 처리장치.
  2. 제1항에 있어서, 상기 웨이퍼 운반통이 상기 처리조에 삽입되어 벽 외면이 상기 처리조 벽 내면과 접하는 것이 특징인 웨이퍼 습식 처리장치.
  3. 제1항에 있어서, 상기 처리조는 벽의 내면 일부 또는 전부가 상기 웨이퍼 운반통 벽 외면과 소정각을 이루는 경사면인 것이 특징인 웨이퍼 습식 처리장치.
  4. 제3항에 있어서, 상기 처리조의 경사면과 대응하는 웨이퍼 운반통 벽부위는 상부가 바깥쪽으로 굴절되어 상기 처리조 벽과 접하는 흐름 안내부를 포함하는 것이 특징인 웨이퍼 습식 처리장치.
  5. 제4항에 있어서, 상기 흐름안내부는 상기 처리조 벽 상단을 감싸게 형성된 것이 특징인 웨이퍼 습식 처리장치.
  6. 제4항에 있어서, 상기 처리조의 경사면과 대응하는 웨이퍼 운반통 벽 부위는 폐쇄면인 것이 특징인 웨이퍼 습식 처리장치.
  7. 제3항에 있어서, 상기 소정각은 1° 내지 15°인 것이 특징인 웨이퍼 습식 처리장치.
  8. 제1항에 있어서, 상기 처리조 벽 내면과 상기기 웨이퍼 운반통 외면의 접촉면은 상호 대응되는 파형(corrugated)면인 것이 특징인 웨이퍼 습식 처리장치.
  9. 제1항에 있어서, 상기 웨이퍼 운반통 하단에 돌출부를 형성하고, 상기 돌출부에 대응하는 홈부를 상기 처리조 바닥에 형성된 것이 특징인 웨이퍼 습식 처리장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019960006618A 1996-03-13 1996-03-13 웨이퍼 습식 처리장치 KR100211074B1 (ko)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1019960006618A KR100211074B1 (ko) 1996-03-13 1996-03-13 웨이퍼 습식 처리장치
US08/803,640 US5845663A (en) 1996-03-13 1997-02-21 Wafer wet processing device
JP09039574A JP3143865B2 (ja) 1996-03-13 1997-02-24 ウェーハ湿式処理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019960006618A KR100211074B1 (ko) 1996-03-13 1996-03-13 웨이퍼 습식 처리장치

Publications (2)

Publication Number Publication Date
KR970067653A true KR970067653A (ko) 1997-10-13
KR100211074B1 KR100211074B1 (ko) 1999-07-15

Family

ID=19452950

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019960006618A KR100211074B1 (ko) 1996-03-13 1996-03-13 웨이퍼 습식 처리장치

Country Status (3)

Country Link
US (1) US5845663A (ko)
JP (1) JP3143865B2 (ko)
KR (1) KR100211074B1 (ko)

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US20060060814A1 (en) * 2002-12-17 2006-03-23 Lucyna Pawlowska Alkenylsuccinic anhydride surface-applied system and method for using the same
TW200504265A (en) * 2002-12-17 2005-02-01 Bayer Chemicals Corp Alkenylsuccinic anhydride surface-applied system and uses thereof
US20090281212A1 (en) * 2005-04-28 2009-11-12 Lucyna Pawlowska Alkenylsuccinic anhydride surface-applied system and uses thereof
JP4835938B2 (ja) * 2007-02-15 2011-12-14 富士ゼロックス株式会社 記録媒体供給装置、及び画像形成装置
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US9632426B2 (en) * 2011-01-18 2017-04-25 Taiwan Semiconductor Manufacturing Company, Ltd. In-situ immersion hood cleaning

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Also Published As

Publication number Publication date
JP3143865B2 (ja) 2001-03-07
US5845663A (en) 1998-12-08
JPH09321017A (ja) 1997-12-12
KR100211074B1 (ko) 1999-07-15

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