KR970024132A - 회로장치와 그 제조방법(circuit device and method of fabricating same) - Google Patents

회로장치와 그 제조방법(circuit device and method of fabricating same) Download PDF

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KR970024132A
KR970024132A KR1019960028171A KR19960028171A KR970024132A KR 970024132 A KR970024132 A KR 970024132A KR 1019960028171 A KR1019960028171 A KR 1019960028171A KR 19960028171 A KR19960028171 A KR 19960028171A KR 970024132 A KR970024132 A KR 970024132A
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frame element
component mounting
circuit device
conductor pattern
electrodes
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KR1019960028171A
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KR100193777B1 (ko
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에이지 고바야시
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기다오까 다까시
미쓰비시 뎅끼 가부시끼가이샤
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/163—Connection portion, e.g. seal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10371—Shields or metal cases
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2018—Presence of a frame in a printed circuit or printed circuit assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/167—Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Wire Bonding (AREA)

Abstract

회로장치, 예컨데, 혼성집적회로장치에 있어서, 프레임소자의 위치결정 정밀도의 향상을 꾀한다.
두꺼운막기판(7)의 부품탑재면(7S)상에있어서, 접착제(6)에 의해서 부품탑재면(7S)상에 접착되는 프레임소자(5)의 저면(5B)의 외벽측주변(5OE)을 따라 적어도 2개소에, 직경0.3mm이상의 원형 형상의 두꺼운막전극(7a)를 형성하고, 이것들의 두꺼운막전극(7a)상에 땜납으로 이루어지는 볼록부(4a)를 형성한다.
이것들의 볼록부(4a)의 존재에 의해, 프레임소자(5)의 위치가 결정되어, 프레임소자(5)의 위치어긋남이 방지된다.
상기 두꺼운막전극(7a)의 형상으로서는 직사각형 형상의 것을 사용해도 좋고, 이 경우에는보다 안정하여 프레임소자(5)의 위치를 결정할 수 있다.
상기 두꺼운막전극(7a)와 볼록부(4a)를 프레임소자(5)의 저면(5B)의 내벽측주변으로 따라 형성해도 좋다.

Description

회로장치와 그 제조방법(CIRCUIT DEVICE AND METHOD OF FABRICATING SAME)
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 실시의 형태1에 따른 혼성집적회로장치의 단면도.

Claims (14)

  1. 실장기판과, 상기 실장기판의 부품탑재면상에 형성된 복수의 부품과, 상기 복수의 부품을 모두 덮기 위한 상기 부품탑재면상에 접착된 프레임소자와, 상기 부품탑재면상의 적어도 2개소에 있어서 주소적으로 형성된, 상기 프레임소자의 위치를 결정하기 위한 도체패턴부와, 상기 도체패턴부의 각각의 위에 형성된 땜납으로 이루어져 있는 볼록부를 구비한 회로장치.
  2. 제 1 항에 있어서, 상기 도체패턴부는 상기 부품탑재면상에 접착된 상기 프레임소자의 저면의 대응하는 외벽측주변으로 따라 배치되어 있는 회로장치.
  3. 제 1 항에 있어서, 상기 도체패턴부의 적어도 한개는 원형 형상으로 이루어진 회로장치.
  4. 제 1 항에 있어서, 상기 도체패턴부의 적어도 한개는 직사각형 형상으로 이루어진 회로장치.
  5. 제 1 항에 있어서, 상기 도체패턴부는 원형 형상의 도체패턴부와 직사각형 형상의 도체패턴부를 구비한 회로장치.
  6. 제 1 항에 있어서, 상기 도체패턴부는 상기 프레임소자의 저면의 대응하는 외벽측주변의 거의 중앙에 주소적으로 설치된 회로장치.
  7. 제 1 항에 있어서, 상기 도체패턴부는 상기 부품탑재표면상에 접착된 상기 프레임소자의 저면의 대응하는 내벽측주변을 따라 배치되어 있는 회로장치.
  8. 제 7 항에 있어서, 상기 도체패턴부는 상기 프레임소자의 내벽측면가까이 탑재된 상기 복수의 부품중의 적어도 한개와 상기 내벽측면과의 사이에 있어서 상기 내벽측주변중의 적어도 한개를 따라 배치되어 있는 도전체 패턴부를 구비한 혼성집적회로 장치.
  9. 실장기판과, 실장기판에 탑재해야 할 복수의 부품과, 상기 복수의 부품을 모두 덮기 위한 형상을 갖은 프레임소자를 준비하는 공정과, 상기 실장기판의 부품탑재면상에, 복수의 부품탑재용전극과, 상기 복수의 부품탑재용전극의 주위측위치에 있어서 적어도 2개의 소정의 패턴을 갖는 프레임 소자 위치결정용의 전극을 형성하는 공정과, 상기 복수의 부품탑재용전극과 상기 프레임 소자 위치결정용의 전극의 쌍방의 위에 땜납페이스트를 도포하는 공정과, 상기 복수의 부품탑재용전극의 각각의 위에 도포된 상기 땜납페이스트상에 대응하는 상기 부품을 탑재하여 일시적으로 고정하고, 상기 땜납페이스트의 융점이상의 가열처리에 의해서 상기 복수의 부품를 상기 복수의 부품탑재용전극에 납땜함과 동시에, 각각의 상기 프레임 소자 위치결정용의 전극상에 볼록부를 형성하는 공정과, 상기 프레임소자를 적어도 2개의 상기 볼록부와 일직선으로 위치결정 하면서 상기 부품탑재면상에 상기 프레임소자를 접착·고정하는 공정을 구비한 회로장치의 제조방법.
  10. 제 9 항에 있어서, 상기 프레임소자는 상기 볼록부를 상기 프레임소자의 대응하는 외벽 측면과 접촉시키도록 배치되는 회로장치의 제조방법.
  11. 제 9 항에 있어서, 상기 프레임소자는 상기 볼록부를 상기 프레임소자의 대응하는 내벽 측면과 접촉시키도록 배치되는 회로장치의 제조방법.
  12. 제 9 항에 있어서, 상기 프레임 소자 위치결정용의 전극의 상기 소정의 패턴은 상기 볼록부가 상기 프레임소자와 점접촉하도록 설정되어 있는 회로장치의 제조방법.
  13. 제 9 항에 있어서, 상기 프레임 소자 위치결정용 전극의 상기 소정의 패턴은 상기 볼록부가 상기 프레임 소자와 면접촉하도록 설정되어 있는 회로장치의 제조방법.
  14. 실장기판과, 상기 실장기판의 부품탑재면상에 탑재된 복수의 부품과, 상기 부품을 덮기 위한 상기 실장기판의 상기 부품탑재면상에 형성된 프레임 소자와; 상기 프레임 소자의 위치를 결정하기 위한 상기 부품탑재면상에 주소적으로 형성된 복수의 볼록부를 구비한 회로장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019960028171A 1995-10-27 1996-07-12 회로장치와 그 제조방법 KR100193777B1 (ko)

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JP7280704A JPH09130009A (ja) 1995-10-27 1995-10-27 混成集積回路装置とその製造方法
JP95-280704 1995-10-27

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KR100193777B1 KR100193777B1 (ko) 1999-06-15

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US6197119B1 (en) 1999-02-18 2001-03-06 Mks Instruments, Inc. Method and apparatus for controlling polymerized teos build-up in vacuum pump lines
US6356453B1 (en) * 2000-06-29 2002-03-12 Amkor Technology, Inc. Electronic package having flip chip integrated circuit and passive chip component
US6546620B1 (en) 2000-06-29 2003-04-15 Amkor Technology, Inc. Flip chip integrated circuit and passive chip component package fabrication method
US6930256B1 (en) 2002-05-01 2005-08-16 Amkor Technology, Inc. Integrated circuit substrate having laser-embedded conductive patterns and method therefor
US7042084B2 (en) * 2002-01-02 2006-05-09 Intel Corporation Semiconductor package with integrated heat spreader attached to a thermally conductive substrate core
US7633765B1 (en) * 2004-03-23 2009-12-15 Amkor Technology, Inc. Semiconductor package including a top-surface metal layer for implementing circuit features
US9691635B1 (en) 2002-05-01 2017-06-27 Amkor Technology, Inc. Buildup dielectric layer having metallization pattern semiconductor package fabrication method
US7548430B1 (en) 2002-05-01 2009-06-16 Amkor Technology, Inc. Buildup dielectric and metallization process and semiconductor package
DE10256945A1 (de) * 2002-12-05 2004-06-17 Epcos Ag Elektronisches Bauelement mit mehreren Chips und Verfahren zur Herstellung
WO2005055317A1 (ja) * 2003-12-05 2005-06-16 Matsushita Electric Industrial Co., Ltd. パッケージされた電子素子、及び電子素子パッケージの製造方法
US10811277B2 (en) 2004-03-23 2020-10-20 Amkor Technology, Inc. Encapsulated semiconductor package
US11081370B2 (en) 2004-03-23 2021-08-03 Amkor Technology Singapore Holding Pte. Ltd. Methods of manufacturing an encapsulated semiconductor device
DE102005017527A1 (de) * 2005-04-15 2006-11-02 Osram Opto Semiconductors Gmbh Oberflächenmontierbares optoelektronisches Bauelement
JP4395775B2 (ja) * 2005-10-05 2010-01-13 ソニー株式会社 半導体装置及びその製造方法
JP4698473B2 (ja) * 2006-04-27 2011-06-08 京セラ株式会社 構造体の製造方法及び電子装置
US7550857B1 (en) 2006-11-16 2009-06-23 Amkor Technology, Inc. Stacked redistribution layer (RDL) die assembly package
JP4555369B2 (ja) 2008-08-13 2010-09-29 富士通メディアデバイス株式会社 電子部品モジュール及びその製造方法
US8082650B2 (en) * 2008-09-26 2011-12-27 Developmental Industries, Inc. Apparatus for forming hooked roofing panels during seaming
US7960827B1 (en) 2009-04-09 2011-06-14 Amkor Technology, Inc. Thermal via heat spreader package and method
TW201110275A (en) * 2009-05-13 2011-03-16 Seiko Instr Inc Electronic component, manufacturing method for electronic component, and electronic device
US8623753B1 (en) 2009-05-28 2014-01-07 Amkor Technology, Inc. Stackable protruding via package and method
US8222538B1 (en) 2009-06-12 2012-07-17 Amkor Technology, Inc. Stackable via package and method
US8471154B1 (en) 2009-08-06 2013-06-25 Amkor Technology, Inc. Stackable variable height via package and method
US8796561B1 (en) 2009-10-05 2014-08-05 Amkor Technology, Inc. Fan out build up substrate stackable package and method
US8937381B1 (en) 2009-12-03 2015-01-20 Amkor Technology, Inc. Thin stackable package and method
US9691734B1 (en) 2009-12-07 2017-06-27 Amkor Technology, Inc. Method of forming a plurality of electronic component packages
US8536462B1 (en) 2010-01-22 2013-09-17 Amkor Technology, Inc. Flex circuit package and method
US8300423B1 (en) 2010-05-25 2012-10-30 Amkor Technology, Inc. Stackable treated via package and method
US8294276B1 (en) 2010-05-27 2012-10-23 Amkor Technology, Inc. Semiconductor device and fabricating method thereof
US8338229B1 (en) 2010-07-30 2012-12-25 Amkor Technology, Inc. Stackable plasma cleaned via package and method
US8717775B1 (en) 2010-08-02 2014-05-06 Amkor Technology, Inc. Fingerprint sensor package and method
US8337657B1 (en) 2010-10-27 2012-12-25 Amkor Technology, Inc. Mechanical tape separation package and method
US8482134B1 (en) 2010-11-01 2013-07-09 Amkor Technology, Inc. Stackable package and method
US9748154B1 (en) 2010-11-04 2017-08-29 Amkor Technology, Inc. Wafer level fan out semiconductor device and manufacturing method thereof
US8525318B1 (en) 2010-11-10 2013-09-03 Amkor Technology, Inc. Semiconductor device and fabricating method thereof
US8557629B1 (en) 2010-12-03 2013-10-15 Amkor Technology, Inc. Semiconductor device having overlapped via apertures
US8535961B1 (en) 2010-12-09 2013-09-17 Amkor Technology, Inc. Light emitting diode (LED) package and method
US9721872B1 (en) 2011-02-18 2017-08-01 Amkor Technology, Inc. Methods and structures for increasing the allowable die size in TMV packages
US9013011B1 (en) 2011-03-11 2015-04-21 Amkor Technology, Inc. Stacked and staggered die MEMS package and method
KR101140113B1 (ko) 2011-04-26 2012-04-30 앰코 테크놀로지 코리아 주식회사 반도체 디바이스
US8653674B1 (en) 2011-09-15 2014-02-18 Amkor Technology, Inc. Electronic component package fabrication method and structure
US8633598B1 (en) 2011-09-20 2014-01-21 Amkor Technology, Inc. Underfill contacting stacking balls package fabrication method and structure
US9029962B1 (en) 2011-10-12 2015-05-12 Amkor Technology, Inc. Molded cavity substrate MEMS package fabrication method and structure
US9799592B2 (en) 2013-11-19 2017-10-24 Amkor Technology, Inc. Semicondutor device with through-silicon via-less deep wells
KR101366461B1 (ko) 2012-11-20 2014-02-26 앰코 테크놀로지 코리아 주식회사 반도체 디바이스 및 그 제조 방법
KR101488590B1 (ko) 2013-03-29 2015-01-30 앰코 테크놀로지 코리아 주식회사 반도체 디바이스 및 그 제조 방법
TWM458672U (zh) * 2013-04-10 2013-08-01 Genesis Photonics Inc 光源模組
KR101607981B1 (ko) 2013-11-04 2016-03-31 앰코 테크놀로지 코리아 주식회사 반도체 패키지용 인터포저 및 이의 제조 방법, 제조된 인터포저를 이용한 반도체 패키지
US9960328B2 (en) 2016-09-06 2018-05-01 Amkor Technology, Inc. Semiconductor device and manufacturing method thereof
KR101856481B1 (ko) * 2016-11-04 2018-05-10 (주)포인트엔지니어링 광 디바이스용 기판 및 그 제조방법 및 광 디바이스
KR101982056B1 (ko) * 2017-10-31 2019-05-24 삼성전기주식회사 팬-아웃 반도체 패키지 모듈

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58122755A (ja) * 1982-01-14 1983-07-21 Sumitomo Electric Ind Ltd 印刷基板の構造
US5151773A (en) * 1990-03-30 1992-09-29 Hitachi, Ltd. Electronic circuit apparatus comprising a structure for sealing an electronic circuit
JP2821229B2 (ja) * 1990-03-30 1998-11-05 株式会社日立製作所 電子回路装置
JPH0487354A (ja) * 1990-07-30 1992-03-19 Hitachi Ltd 半導体装置
JP2541487B2 (ja) * 1993-11-29 1996-10-09 日本電気株式会社 半導体装置パッケ―ジ

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KR100193777B1 (ko) 1999-06-15
US5883425A (en) 1999-03-16

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