KR830004676A - 회로 패키지들의 제조방법 - Google Patents
회로 패키지들의 제조방법 Download PDFInfo
- Publication number
- KR830004676A KR830004676A KR1019800004900A KR800004900A KR830004676A KR 830004676 A KR830004676 A KR 830004676A KR 1019800004900 A KR1019800004900 A KR 1019800004900A KR 800004900 A KR800004900 A KR 800004900A KR 830004676 A KR830004676 A KR 830004676A
- Authority
- KR
- South Korea
- Prior art keywords
- contact pads
- relatively large
- solder
- large component
- substrate
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims 2
- 239000000758 substrate Substances 0.000 claims description 7
- 229910000679 solder Inorganic materials 0.000 claims description 6
- 238000005476 soldering Methods 0.000 claims 1
- 239000011800 void material Substances 0.000 claims 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
- H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
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- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
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- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09145—Edge details
- H05K2201/09181—Notches in edge pads
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- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10984—Component carrying a connection agent, e.g. solder, adhesive
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/041—Solder preforms in the shape of solder balls
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도 및 제2도는 본 발명의 일실시예에 따라 적용된 땜납구체들을 갖는 세라믹칩개리어의 상부투시도 및 저면투시도. 제3도는 본 발명의 일실시예에 따라 지지기판상에 형성된 박막(薄膜)회로를 갖는 지지기판의 일부분에 대한 상부평면도. 제4도는 동일 실시예에 따라 칩캐리어를 기판에 접착시키는 것을 도시한 종단면도.
Claims (1)
- 비교적 큰 부품 표면상에 형성된 제1접점패드(14)세트를 포함하는 전기적인 비교적 큰 부품(제1도의10)을 제공하는 단계와, 비교적 큰 부품상의 제1접점 패드세트에 대응하여 지지절연기판 표면상에 형성된 제2접점패드세트(25)를 포함하는 지지절연기판을 제공하는 단계와, 상기 접점패드세트들을 상호 납땜하므로써 비교적 큰 부품들을 기판에 부착하는 단계들을 포함하는 회로 패키지 제조방법에 있어서,상기 납땜이 상기 접점패드세트들 중의 하나에 미리 형성된 큰 땜납을 부착하고, 접점패드의 다른 세트를 미리 형성된 땜납에 대응하여 접촉시키고 그리고 비교적 큰 부품과 기판 사이의 공극을 적어도 0.25㎜로서 유지하면서 미리 형성된 땜납을 상기 다른 접점패드세트에 부착하므로써 수행되는 것을 특징으로 하는 회로 패키지들의 제조방법.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US107327 | 1979-12-26 | ||
US06/107,327 US4352449A (en) | 1979-12-26 | 1979-12-26 | Fabrication of circuit packages |
Publications (2)
Publication Number | Publication Date |
---|---|
KR830004676A true KR830004676A (ko) | 1983-07-16 |
KR840000477B1 KR840000477B1 (ko) | 1984-04-09 |
Family
ID=22316067
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019800004900A KR840000477B1 (ko) | 1979-12-26 | 1980-12-23 | 회로 패키지들의 제조방법 |
Country Status (10)
Country | Link |
---|---|
US (1) | US4352449A (ko) |
EP (1) | EP0042417B1 (ko) |
JP (1) | JPH0341983B2 (ko) |
KR (1) | KR840000477B1 (ko) |
CA (1) | CA1147478A (ko) |
DE (1) | DE3071833D1 (ko) |
GB (1) | GB2067011B (ko) |
HK (1) | HK69784A (ko) |
SG (1) | SG33084G (ko) |
WO (1) | WO1981001912A1 (ko) |
Families Citing this family (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3138296A1 (de) * | 1981-09-25 | 1983-04-28 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zum positionieren und fixieren von optischen bauelementen relativ zueinander |
US4412642A (en) * | 1982-03-15 | 1983-11-01 | Western Electric Co., Inc. | Cast solder leads for leadless semiconductor circuits |
US4727633A (en) * | 1985-08-08 | 1988-03-01 | Tektronix, Inc. | Method of securing metallic members together |
US4646435A (en) * | 1985-10-04 | 1987-03-03 | Raychem Corporation | Chip carrier alignment device and alignment method |
IL80683A0 (en) * | 1985-12-20 | 1987-02-27 | Hughes Aircraft Co | Chip interface mesa |
US4878611A (en) * | 1986-05-30 | 1989-11-07 | American Telephone And Telegraph Company, At&T Bell Laboratories | Process for controlling solder joint geometry when surface mounting a leadless integrated circuit package on a substrate |
US4790894A (en) * | 1987-02-19 | 1988-12-13 | Hitachi Condenser Co., Ltd. | Process for producing printed wiring board |
US4769272A (en) * | 1987-03-17 | 1988-09-06 | National Semiconductor Corporation | Ceramic lid hermetic seal package structure |
FR2651025B1 (fr) * | 1989-08-18 | 1991-10-18 | Commissariat Energie Atomique | Assemblage de pieces faisant un angle entre elles et procede d'obtention de cet assemblage |
JP2528718B2 (ja) * | 1989-11-30 | 1996-08-28 | いすゞ自動車株式会社 | セラミックスと金属の接合方法 |
US5051869A (en) * | 1990-05-10 | 1991-09-24 | Rockwell International Corporation | Advanced co-fired multichip/hybrid package |
US5058265A (en) * | 1990-05-10 | 1991-10-22 | Rockwell International Corporation | Method for packaging a board of electronic components |
US5155067A (en) * | 1991-03-26 | 1992-10-13 | Micron Technology, Inc. | Packaging for a semiconductor die |
US5255839A (en) * | 1992-01-02 | 1993-10-26 | Motorola, Inc. | Method for solder application and reflow |
CA2154409C (en) * | 1994-07-22 | 1999-12-14 | Yuzo Shimada | Connecting member and a connecting method using the same |
US6521477B1 (en) | 2000-02-02 | 2003-02-18 | Raytheon Company | Vacuum package fabrication of integrated circuit components |
US6479320B1 (en) | 2000-02-02 | 2002-11-12 | Raytheon Company | Vacuum package fabrication of microelectromechanical system devices with integrated circuit components |
US6690014B1 (en) | 2000-04-25 | 2004-02-10 | Raytheon Company | Microbolometer and method for forming |
US6777681B1 (en) | 2001-04-25 | 2004-08-17 | Raytheon Company | Infrared detector with amorphous silicon detector elements, and a method of making it |
US7151310B2 (en) * | 2001-09-25 | 2006-12-19 | Tdk Corporation | Package substrate, integrated circuit apparatus, substrate unit, surface acoustic wave apparatus, and circuit device |
US7462831B2 (en) * | 2006-01-26 | 2008-12-09 | L-3 Communications Corporation | Systems and methods for bonding |
US7459686B2 (en) * | 2006-01-26 | 2008-12-02 | L-3 Communications Corporation | Systems and methods for integrating focal plane arrays |
US7655909B2 (en) * | 2006-01-26 | 2010-02-02 | L-3 Communications Corporation | Infrared detector elements and methods of forming same |
US7718965B1 (en) | 2006-08-03 | 2010-05-18 | L-3 Communications Corporation | Microbolometer infrared detector elements and methods for forming same |
US8153980B1 (en) | 2006-11-30 | 2012-04-10 | L-3 Communications Corp. | Color correction for radiation detectors |
US8765514B1 (en) | 2010-11-12 | 2014-07-01 | L-3 Communications Corp. | Transitioned film growth for conductive semiconductor materials |
JP6623508B2 (ja) * | 2014-09-30 | 2019-12-25 | 日亜化学工業株式会社 | 光源及びその製造方法、実装方法 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3292240A (en) * | 1963-08-08 | 1966-12-20 | Ibm | Method of fabricating microminiature functional components |
US3429040A (en) * | 1965-06-18 | 1969-02-25 | Ibm | Method of joining a component to a substrate |
FR1483574A (ko) * | 1965-06-24 | 1967-09-06 | ||
US3436818A (en) * | 1965-12-13 | 1969-04-08 | Ibm | Method of fabricating a bonded joint |
US3486223A (en) * | 1967-04-27 | 1969-12-30 | Philco Ford Corp | Solder bonding |
US3609471A (en) * | 1969-07-22 | 1971-09-28 | Gen Electric | Semiconductor device with thermally conductive dielectric barrier |
US3871014A (en) * | 1969-08-14 | 1975-03-11 | Ibm | Flip chip module with non-uniform solder wettable areas on the substrate |
US3591839A (en) * | 1969-08-27 | 1971-07-06 | Siliconix Inc | Micro-electronic circuit with novel hermetic sealing structure and method of manufacture |
US3839727A (en) * | 1973-06-25 | 1974-10-01 | Ibm | Semiconductor chip to substrate solder bond using a locally dispersed, ternary intermetallic compound |
US4143385A (en) * | 1976-09-30 | 1979-03-06 | Hitachi, Ltd. | Photocoupler |
-
1979
- 1979-12-26 US US06/107,327 patent/US4352449A/en not_active Expired - Lifetime
-
1980
- 1980-12-22 WO PCT/US1980/001698 patent/WO1981001912A1/en active IP Right Grant
- 1980-12-22 JP JP56500427A patent/JPH0341983B2/ja not_active Expired - Lifetime
- 1980-12-22 GB GB8041071A patent/GB2067011B/en not_active Expired
- 1980-12-22 DE DE8181900254T patent/DE3071833D1/de not_active Expired
- 1980-12-22 EP EP81900254A patent/EP0042417B1/en not_active Expired
- 1980-12-23 KR KR1019800004900A patent/KR840000477B1/ko active
- 1980-12-23 CA CA000367428A patent/CA1147478A/en not_active Expired
-
1984
- 1984-04-25 SG SG330/84A patent/SG33084G/en unknown
- 1984-09-06 HK HK697/84A patent/HK69784A/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
GB2067011B (en) | 1983-12-14 |
CA1147478A (en) | 1983-05-31 |
JPS56501820A (ko) | 1981-12-10 |
SG33084G (en) | 1991-01-04 |
KR840000477B1 (ko) | 1984-04-09 |
GB2067011A (en) | 1981-07-15 |
JPH0341983B2 (ko) | 1991-06-25 |
EP0042417A1 (en) | 1981-12-30 |
WO1981001912A1 (en) | 1981-07-09 |
HK69784A (en) | 1984-09-14 |
EP0042417B1 (en) | 1986-11-12 |
EP0042417A4 (en) | 1984-03-27 |
DE3071833D1 (en) | 1987-01-02 |
US4352449A (en) | 1982-10-05 |
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