KR930005101A - 테이프 자동 결합 반도체 장치 - Google Patents

테이프 자동 결합 반도체 장치 Download PDF

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Publication number
KR930005101A
KR930005101A KR1019920014646A KR920014646A KR930005101A KR 930005101 A KR930005101 A KR 930005101A KR 1019920014646 A KR1019920014646 A KR 1019920014646A KR 920014646 A KR920014646 A KR 920014646A KR 930005101 A KR930005101 A KR 930005101A
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KR
South Korea
Prior art keywords
electronic component
lead
semiconductor device
tab
leads
Prior art date
Application number
KR1019920014646A
Other languages
English (en)
Inventor
엠. 히긴즈 3세 레엠
에스. 카프맨 모리스
Original Assignee
챨스 알. 루이스
모토로라 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 챨스 알. 루이스, 모토로라 인코포레이티드 filed Critical 챨스 알. 루이스
Publication of KR930005101A publication Critical patent/KR930005101A/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress
    • H01L2924/3511—Warping
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10681—Tape Carrier Package [TCP]; Flexible sheet connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)

Abstract

내용 없음.

Description

테이프 자동 결합 반도체 장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제3도는 본 발명에 따라서 형성된 반도체 장치의 TAB 테이프를 도시한 평면도.

Claims (2)

  1. 전자 컴포넌트(31) 및 TAB 테이프를 구비하는 TAB 반도체 장치에 있어서, 상기 TAB 테이프가 소정의 공간 밀도를 갖고 캐리어 막이 전자 컴포넌트의 소정 대향 섹션에서 전기 리드가 없도록 패턴화되는 전기 리드를 외부 회로에 전기적으로 상호 접속시키는 전기 리드(20)를 지원하는 캐리어 막(12) 및 소정이 공간 밀도를 갖고 전기 리드가 없는 캐리어 막의 소정 대향 섹션을 차지하며, 전자 컴포넌트 주위의 캐리어 막에 균일하게 스트레스를 분배하는 열-기계적 리드(32-A,B,C,D)를 포함하는 것을 특징으로 하는 TAB 반도체 장치.
  2. 전자 컴포넌트 전면상에 배치된 본딩 패드를 갖는 상기 전자 컴포넌트(31) 및 폴리머 서포트(12)와 중첩되는 패턴화된 금속층을 포함한 TAB 테이프를 구비하는 TAB 반도체 장치에 있어서, 전자 컴포넌트에 인접한 폴리머 서포트의 대각선으로 대향하는 섹션에 제1리드 패턴이 없도록 전자 컴포넌트상의 본딩 패딩에 접속된 내부 리드 부분(22) 및 외부 회로에 접속하는 전자 컴포넌트로부터 확장되는 외부리드 부분(24)을 갖는 개개 리드를 포함한 소정의 리드 피치를 구비하는 제1리드 패턴(20) 및 소정 리드 피치를 갖고 제 1리드 패턴과 전기적으로 독립되며, 전자 컴포넌트를 둘러싸는 폴리머 서포트에서의 스트레스 분배가 거의 균일하도록 폴리머 서포트의 대각선으로 대향하는 섹션에 배치되도록 구성된 제2리드 패턴(32-A, B, C, D)를 구비하는 것을 특징으로 하는 TAB 반도체 장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019920014646A 1991-08-16 1992-08-14 테이프 자동 결합 반도체 장치 KR930005101A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/745,655 US5289032A (en) 1991-08-16 1991-08-16 Tape automated bonding(tab)semiconductor device and method for making the same
US745,655 1991-08-16

Publications (1)

Publication Number Publication Date
KR930005101A true KR930005101A (ko) 1993-03-23

Family

ID=24997659

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019920014646A KR930005101A (ko) 1991-08-16 1992-08-14 테이프 자동 결합 반도체 장치

Country Status (4)

Country Link
US (2) US5289032A (ko)
EP (1) EP0528323A1 (ko)
JP (1) JPH05198616A (ko)
KR (1) KR930005101A (ko)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3016658B2 (ja) * 1992-04-28 2000-03-06 ローム株式会社 リードフレーム並びに半導体装置およびその製法
JPH0750762B2 (ja) * 1992-12-18 1995-05-31 山一電機株式会社 Ｉｃキャリア
JPH0763082B2 (ja) * 1993-02-15 1995-07-05 山一電機株式会社 Ｉｃキャリア
JPH0831544B2 (ja) * 1993-06-29 1996-03-27 山一電機株式会社 Ｉｃキャリア
JP2852178B2 (ja) * 1993-12-28 1999-01-27 日本電気株式会社 フィルムキャリアテープ
JPH0878605A (ja) * 1994-09-01 1996-03-22 Hitachi Ltd リードフレームおよびそれを用いた半導体集積回路装置
JP2636761B2 (ja) * 1994-12-09 1997-07-30 日本電気株式会社 フィルムキャリアテープ
JP2709283B2 (ja) * 1995-04-07 1998-02-04 山一電機株式会社 Ｉｃキャリア
JP3346985B2 (ja) * 1996-06-20 2002-11-18 東芝マイクロエレクトロニクス株式会社 半導体装置
US5692950A (en) * 1996-08-08 1997-12-02 Minnesota Mining And Manufacturing Company Abrasive construction for semiconductor wafer modification
US6006981A (en) * 1996-11-19 1999-12-28 Texas Instruments Incorporated Wirefilm bonding for electronic component interconnection
JP3523536B2 (ja) * 1999-08-06 2004-04-26 シャープ株式会社 半導体装置及びその製造方法、並びに液晶モジュール及びその搭載方法
JP2001185585A (ja) * 1999-12-24 2001-07-06 Hitachi Ltd 半導体装置およびその製造方法
US7132734B2 (en) * 2003-01-06 2006-11-07 Micron Technology, Inc. Microelectronic component assemblies and microelectronic component lead frame structures
US7183485B2 (en) * 2003-03-11 2007-02-27 Micron Technology, Inc. Microelectronic component assemblies having lead frames adapted to reduce package bow
JP4758678B2 (ja) * 2005-05-17 2011-08-31 ルネサスエレクトロニクス株式会社 半導体装置
JP3983786B2 (ja) * 2005-11-15 2007-09-26 シャープ株式会社 プリント配線基板
TWI750755B (zh) * 2020-07-31 2021-12-21 頎邦科技股份有限公司 軟性電路板之佈線結構

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5521128A (en) * 1978-08-02 1980-02-15 Hitachi Ltd Lead frame used for semiconductor device and its assembling
DE3061383D1 (en) * 1979-02-19 1983-01-27 Fujitsu Ltd Semiconductor device and method for manufacturing the same
DE3211408A1 (de) * 1982-03-27 1983-09-29 Vdo Adolf Schindling Ag, 6000 Frankfurt Substrat
IT1213259B (it) * 1984-12-18 1989-12-14 Sgs Thomson Microelectronics Gruppo a telaio di conduttori per circuiti integrati con capacita' di termodispersione incrementata, erelativo procedimento.
US4721993A (en) * 1986-01-31 1988-01-26 Olin Corporation Interconnect tape for use in tape automated bonding
US4803540A (en) * 1986-11-24 1989-02-07 American Telephone And Telegraph Co., At&T Bell Labs Semiconductor integrated circuit packages
US4914741A (en) * 1987-06-08 1990-04-03 Digital Equipment Corporation Tape automated bonding semiconductor package
JPH0777228B2 (ja) * 1987-06-23 1995-08-16 三菱電機株式会社 テ−プキヤリア
JPH01175759A (ja) * 1987-12-29 1989-07-12 Hitachi Ltd 半導体装置の製造方法
JPH0828455B2 (ja) * 1988-02-24 1996-03-21 富士通株式会社 リードフレーム及びそれを用いた電子部品の製造方法
JP2700253B2 (ja) * 1988-08-24 1998-01-19 イビデン株式会社 電子部品装置
JP2755731B2 (ja) * 1989-10-17 1998-05-25 株式会社東芝 Ｔａｂテープ
US5053852A (en) * 1990-07-05 1991-10-01 At&T Bell Laboratories Molded hybrid IC package and lead frame therefore

Also Published As

Publication number Publication date
EP0528323A1 (en) 1993-02-24
US5289032A (en) 1994-02-22
JPH05198616A (ja) 1993-08-06
US5361490A (en) 1994-11-08

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