KR900004006A - 개선된 리드구조를 갖춘 반도체장치와 그 제조방법 - Google Patents

개선된 리드구조를 갖춘 반도체장치와 그 제조방법 Download PDF

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KR900004006A
KR900004006A KR1019890011189A KR890011189A KR900004006A KR 900004006 A KR900004006 A KR 900004006A KR 1019890011189 A KR1019890011189 A KR 1019890011189A KR 890011189 A KR890011189 A KR 890011189A KR 900004006 A KR900004006 A KR 900004006A
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frame
semiconductor chip
die pad
predetermined
frame body
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KR1019890011189A
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KR920008254B1 (ko
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겐지 다카하시
야스히로 야마지
스스무 하라다
도시하루 사쿠라이
마사시 무로마치
히로시 하라다
가즈이치 고메나타
미츠구 미야모토
가즈오 누마지리
하루유키 시마카와
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아오이 죠이치
가부시키가이샤 도시바
다케다이 마사다카
도시바 마이크로 일렉트로닉스 가부시키가이샤
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Publication of KR900004006A publication Critical patent/KR900004006A/ko
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Abstract

내용 없음

Description

개선된 리드구조를 갖춘 반도체장치와 그 제조방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제2a도는 본 발명의 실시예 1에 따른 반도체장치의 평면도.
제2b도와 제2c도는 각각 제2a도에 나타낸 A-A'선과 B-B'선에 따른 단면도.
제3도는 본 발명의 실시예 2를 나타낸 단면도.
제9도는 반도체칩과 내부리드상에 형성된 본딩패드의 구성을 설명하기 위한 평면도.
제10a도와 제10b도는 내부리드와 본딩와이어간의 접속에 관한 문제를 설명하기 위한 도면.

Claims (17)

  1. 반도체칩(50)을 포함하는 반도체장치의 제조를 위한 프레임몸체에 있어서, 반도체칩(50)을 지지하기 위한 주표면을 갖춘 다이패드부(33)와, 이 다이패드부(33)를 에워쌓는 제1표면을 갖춘 제1프레임부(31,36) 및, 상기 주표면과 제1표면사이에서 오프세트(h)를 발생시켜 상기 다이패드부(33)를 제1프레임부(31,36)의 소정부위에 접속시키기 위한 접속수단(32)을 포함하는 제1프레임수단(30)과; 제2프레임부(41,46)와, 이 제2프레임부(41,46)로 둘러쌓여진 중앙부 및, 제1 및 제2프레임몸체(30,40)가 결합될 경우 반도체칩(50)을 중첩시키기 위해 제2프레임부(41,46)에서 중앙부까지 확장된 다수의 리드부(42)를 포함하여 제1프레임수단(30)과 결합되는 제2프레임수단(40)을 구비하여 구성된 것을 특징으로 하는 프레임몸체.
  2. 제1항에 있어서, 상기 리드부(42)상에 절연버퍼층(57)이 더 구비되어 이루어진 것을 특징으로 하는 프레임몸체.
  3. 제1항에 있어서, 상기 제1 및 제2프레임부(31,36,41,46)가 소정의 용융점을 갖춘 금속으로 이루어지면서 소정용융점보다 낮은 용융점의 특정금속층(34,44)을 갖추어 이루어진 것을 특징으로 하는 프레임몸체.
  4. 제3항에 있어서, 상기 제1 및 제2프레임부(31,36,41,46)가 구리를 기본 재료로 이루어지면서 특정 금속층(34,44)이 주석으로 이루어진 것을 특징으로 하는 프레임몸체.
  5. 제1항에 있어서, 상기 제2프레임부(41,46)가 상기 제1프레임부(31,36)의 소정부분에 대응하는 영역에서 제1노치부(49)를 포함해서 이루어진 것을 특징으로 하는 프레임몸체.
  6. 제5항에 있어서, 상기 제1프레임부(31,36)가 접속수단(32)의 길이를 증가시키기 위한 제2노치부(39)를 포함해서 이루어진 것을 특징으로 하는 프레임몸체.
  7. 제1항에 있어서, 상기 제1프레임부(31,36)가 소정의 제1내부체적을 갖으면서 상기 제2프레임부(14,46)가 소정의 제2내부체적을 갖고, 상기 소정의 제1내부체적이 소정량(d)만큼 소정의 제2내부체적 보다 넓도록 된 것을 특징으로 하는 프레임몸체.
  8. 소정두께의 반도체칩(50)을 포함하는 반도체장치의 제조를 위해 사용되는 프레임몸체에 있어서, 소정위치를 정의하기 위한 한쌍의 노치(39)를 갖추면서 폐루프를 형성하는 프레임부(31,36)와, 반도체칩(50)을 지지하기 위한 다이패드부(33) 및, 상기 프레임부(31,36)의 소정부분에 다이패드부(33)를 접속시키기 위한 타이바수단(32)을 구비하여 구성된 것을 특징으로 하는 프레임몸체.
  9. 제8항에 있어서, 상기 프레임부(31,36)가 제1표면을 갖추고, 상기 다이패드부(33)가 반도체칩(50)을 지지하기 위한 제2표면을 갖추며, 상기 타이바수단(32)이 반도체칩(50)의 두께보다 같거나 큰 제1표면과 제2표면상에서 오프세트(h)를 발생시키도록 된 것을 특징으로 하는 프레임몸체.
  10. 주표면상에 형성되어 다수의 본딩패드(54)를 갖춘 반도체칩(50)과; 이 반도체칩(50)을 지지하기 위한 제1표면을 갖춘 다이패드부(33)와, 제2표면을 갖춘 다이패드지지부(32a) 및, 이 다이패드지지부(32a)의 제2표면과 상기 다이패드부(33)의 제1표면간에서 소정의 오프세트(h)를 발생시키기 위한 타이바부(32b)를 포함하는 반도체칩지지수단; 각각 제3표면 및 제4표면을 갖추고 이 제4표면이 다이패드지지부(32a)의 제2표면에 의해 형성된 평면과 일치하면서 주표면상에서 반도체칩(50)과 중첩되는 다수의 내부리드(42a) 및; 상기 내부리드(42a)의 제3표면을 대응하는 본딩패드(54)에 접속시키기 위한 다수의 본딩와이어(51)를 구비하여 구성된 것을 특징으로 하는 반도체장치.
  11. 제10항에 있어서, 상기 반도체칩(50)의 내부리드(42a)와 주표면사이에 절연버퍼층(57,58)이 더 구비되어 구성된 것을 특징으로 하는 반도체장치.
  12. 제10항에 있어서, 상기 절연버퍼층(57)이 상기 내부리드(42a)아래쪽에 형성된 것을 특징으로 하는 반도체장치.
  13. 제10항에 있어서, 절연버퍼층(58)이 상기 반도체칩(50)의 주표면상에 형성된 것을 특징으로 하는 반도체장치.
  14. 반도체칩(50)을 지지하기 위한 다이패드부(33)와, 이 다이패드부(33)를 에워쌓는 제1프레임부(31,36) 및, 상기 다이패드부(33)를 상기 제1프레임부(31,36)에 접속시키기 위한 접속수단(32)을 포함한 제1프레임몸체(30)를 준비하는 단계와; 제2프레임부(41,46)와, 이 제2프레임부(41,46)에 의해 에워쌓은 중앙부 및, 상기 제2프레임부(41,46)에서 중앙부까지 연장된 다수의 리드부(42)를 포함한 제2프레임몸체(40)를 준비하는 단계; 상기 제1프레임몸체(30)의 다이패드부(33)상의 주표면상에 다수의 본딩패드(54)를 갖춘 반도체칩(50)을 취부시키는 단계; 상기 제1 및 제2프레임몸체(30,40)를 용접시키는 단계; 상기 반도체칩(50)상의 본딩패드(54)를 상기 제2프레임몸체(40)의 리드부(42a)에 접속시키는 단계 및; 상기 제1 및 제2프레임몸체(30,40)로부터 리드부(42a)와 다이패드부(33)를 분리시키는 단계로 이루어진 것을 특징으로 하는 반도체장치의 제조방법.
  15. 제14항에 있어서, 상기 용접공정이 저항성 용접단계를 포함하도록 된 것을 특징으로 하는 반도체장치의 제조방법.
  16. 제14항에 있어서, 상기 반도체칩(50)의 리드부(42a)와 주표면사이에 절연버퍼층(57,58)을 형성하는 단계가 더 구비되어 이루어진 것을 특징으로 하는 반도체장치의 제조방법.
  17. 제14항에 있어서, 상기 제1프레임몸체(30)를 준비하는 단계가 소정의 용융점을 갖춘 제1금속으로 이루어진 제1프레임수단(30)을 준비하는 단계를 포함하면서 제1프레임수단(30)보다 낮은 소정의 용융점을 갖춘 재표로 소정 위치에서 제1프레임수단(30)을 도금하도록 된 것을 특징으로 하는 반도체장치의 제조방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019890011189A 1988-08-06 1989-08-05 개선된 리드구조를 갖춘 반도체장치와 그 제조방법 KR920008254B1 (ko)

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