JPS568862A - Manufacture of lead frame for semiconductor device - Google Patents

Manufacture of lead frame for semiconductor device

Info

Publication number
JPS568862A
JPS568862A JP8515479A JP8515479A JPS568862A JP S568862 A JPS568862 A JP S568862A JP 8515479 A JP8515479 A JP 8515479A JP 8515479 A JP8515479 A JP 8515479A JP S568862 A JPS568862 A JP S568862A
Authority
JP
Japan
Prior art keywords
lead
element mounting
mounting section
section
punching
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8515479A
Other languages
Japanese (ja)
Inventor
Satoshi Watakari
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP8515479A priority Critical patent/JPS568862A/en
Publication of JPS568862A publication Critical patent/JPS568862A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49548—Cross section geometry
    • H01L23/49551—Cross section geometry characterised by bent parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To obtain an enlarged element mounting section by leaving, without punching, the border section of an element mounting section and a lead, by performing a cutting work and by having a raised step between the element mounting section and the lead. CONSTITUTION:The border section (a broken line) between an element mounting section 1' and a lead 2' is left without punching and the other unnecessary sections are cut off by punching. Then, cutting work is given at the broken line, the element mounting section and the lead are separated, a bending or a drawing work is performed to an element mounting section 3 and raised step is formed between the mounting section 1' and the lead 2'. As a result, the punched off section of the lead frame in the method heretofore in use can be efficiently used as a section of an element mounting section can be enlarged and also the position of the lead point can be moved toward the inside still more.
JP8515479A 1979-07-04 1979-07-04 Manufacture of lead frame for semiconductor device Pending JPS568862A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8515479A JPS568862A (en) 1979-07-04 1979-07-04 Manufacture of lead frame for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8515479A JPS568862A (en) 1979-07-04 1979-07-04 Manufacture of lead frame for semiconductor device

Publications (1)

Publication Number Publication Date
JPS568862A true JPS568862A (en) 1981-01-29

Family

ID=13850740

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8515479A Pending JPS568862A (en) 1979-07-04 1979-07-04 Manufacture of lead frame for semiconductor device

Country Status (1)

Country Link
JP (1) JPS568862A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5198883A (en) * 1988-08-06 1993-03-30 Kabushiki Kaisha Toshiba Semiconductor device having an improved lead arrangement and method for manufacturing the same
JP2012028822A (en) * 2011-11-08 2012-02-09 Hitachi Cable Precision Co Ltd Lead frame and semiconductor device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5279774A (en) * 1975-12-26 1977-07-05 Toshiba Corp Forming method for lead frame for resin sealing

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5279774A (en) * 1975-12-26 1977-07-05 Toshiba Corp Forming method for lead frame for resin sealing

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5198883A (en) * 1988-08-06 1993-03-30 Kabushiki Kaisha Toshiba Semiconductor device having an improved lead arrangement and method for manufacturing the same
JP2012028822A (en) * 2011-11-08 2012-02-09 Hitachi Cable Precision Co Ltd Lead frame and semiconductor device

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