JPS52127756A - Semiconductor unit - Google Patents

Semiconductor unit

Info

Publication number
JPS52127756A
JPS52127756A JP4457976A JP4457976A JPS52127756A JP S52127756 A JPS52127756 A JP S52127756A JP 4457976 A JP4457976 A JP 4457976A JP 4457976 A JP4457976 A JP 4457976A JP S52127756 A JPS52127756 A JP S52127756A
Authority
JP
Japan
Prior art keywords
semiconductor unit
modl
metalic
stand
connect
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4457976A
Other languages
Japanese (ja)
Inventor
Mitsuru Imai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP4457976A priority Critical patent/JPS52127756A/en
Publication of JPS52127756A publication Critical patent/JPS52127756A/en
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE: To obtain DIP type resin modl unit including maximum element within limited outline dimension by extending the edge of external lead to the face of the element fixed on metalic stand to connect it to element electrode.
COPYRIGHT: (C)1977,JPO&Japio
JP4457976A 1976-04-19 1976-04-19 Semiconductor unit Pending JPS52127756A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4457976A JPS52127756A (en) 1976-04-19 1976-04-19 Semiconductor unit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4457976A JPS52127756A (en) 1976-04-19 1976-04-19 Semiconductor unit

Publications (1)

Publication Number Publication Date
JPS52127756A true JPS52127756A (en) 1977-10-26

Family

ID=12695400

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4457976A Pending JPS52127756A (en) 1976-04-19 1976-04-19 Semiconductor unit

Country Status (1)

Country Link
JP (1) JPS52127756A (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6077432A (en) * 1983-10-05 1985-05-02 Fujitsu Ltd Manufacture of semiconductor device
JPS63239852A (en) * 1987-12-03 1988-10-05 Mitsui Haitetsuku:Kk Semiconductor device
JPH01123428A (en) * 1987-11-06 1989-05-16 Mitsubishi Electric Corp Resin sealed semiconductor device
JPH01171256A (en) * 1987-12-25 1989-07-06 Fuji Electric Co Ltd Buitl-up structure of semiconductor device
JPH0245969A (en) * 1988-08-06 1990-02-15 Toshiba Corp Lead frame and semiconductor device consisting of lead frame therefor and manufacture thereof
JPH02143449A (en) * 1988-11-24 1990-06-01 Toshiba Corp Semiconductor sealing vessel
JPH06188353A (en) * 1992-12-21 1994-07-08 Mitsui High Tec Inc Semiconductor device
EP0987758A3 (en) * 1991-12-27 2000-05-24 Fujitsu Limited Semiconducter device and method of producing the same
US7138673B2 (en) 2002-08-19 2006-11-21 Nec Electronics Corporation Semiconductor package having encapsulated chip attached to a mounting plate

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6077432A (en) * 1983-10-05 1985-05-02 Fujitsu Ltd Manufacture of semiconductor device
JPH01123428A (en) * 1987-11-06 1989-05-16 Mitsubishi Electric Corp Resin sealed semiconductor device
JPS63239852A (en) * 1987-12-03 1988-10-05 Mitsui Haitetsuku:Kk Semiconductor device
JPH01171256A (en) * 1987-12-25 1989-07-06 Fuji Electric Co Ltd Buitl-up structure of semiconductor device
JPH0245969A (en) * 1988-08-06 1990-02-15 Toshiba Corp Lead frame and semiconductor device consisting of lead frame therefor and manufacture thereof
JPH02143449A (en) * 1988-11-24 1990-06-01 Toshiba Corp Semiconductor sealing vessel
EP0987758A3 (en) * 1991-12-27 2000-05-24 Fujitsu Limited Semiconducter device and method of producing the same
JPH06188353A (en) * 1992-12-21 1994-07-08 Mitsui High Tec Inc Semiconductor device
US7138673B2 (en) 2002-08-19 2006-11-21 Nec Electronics Corporation Semiconductor package having encapsulated chip attached to a mounting plate
US7449370B2 (en) 2002-08-19 2008-11-11 Nec Electronics Corporation Production process for manufacturing such semiconductor package

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