JPS52127756A - Semiconductor unit - Google Patents
Semiconductor unitInfo
- Publication number
- JPS52127756A JPS52127756A JP4457976A JP4457976A JPS52127756A JP S52127756 A JPS52127756 A JP S52127756A JP 4457976 A JP4457976 A JP 4457976A JP 4457976 A JP4457976 A JP 4457976A JP S52127756 A JPS52127756 A JP S52127756A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor unit
- modl
- metalic
- stand
- connect
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
PURPOSE: To obtain DIP type resin modl unit including maximum element within limited outline dimension by extending the edge of external lead to the face of the element fixed on metalic stand to connect it to element electrode.
COPYRIGHT: (C)1977,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4457976A JPS52127756A (en) | 1976-04-19 | 1976-04-19 | Semiconductor unit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4457976A JPS52127756A (en) | 1976-04-19 | 1976-04-19 | Semiconductor unit |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS52127756A true JPS52127756A (en) | 1977-10-26 |
Family
ID=12695400
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4457976A Pending JPS52127756A (en) | 1976-04-19 | 1976-04-19 | Semiconductor unit |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS52127756A (en) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6077432A (en) * | 1983-10-05 | 1985-05-02 | Fujitsu Ltd | Manufacture of semiconductor device |
JPS63239852A (en) * | 1987-12-03 | 1988-10-05 | Mitsui Haitetsuku:Kk | Semiconductor device |
JPH01123428A (en) * | 1987-11-06 | 1989-05-16 | Mitsubishi Electric Corp | Resin sealed semiconductor device |
JPH01171256A (en) * | 1987-12-25 | 1989-07-06 | Fuji Electric Co Ltd | Buitl-up structure of semiconductor device |
JPH0245969A (en) * | 1988-08-06 | 1990-02-15 | Toshiba Corp | Lead frame and semiconductor device consisting of lead frame therefor and manufacture thereof |
JPH02143449A (en) * | 1988-11-24 | 1990-06-01 | Toshiba Corp | Semiconductor sealing vessel |
JPH06188353A (en) * | 1992-12-21 | 1994-07-08 | Mitsui High Tec Inc | Semiconductor device |
EP0987758A3 (en) * | 1991-12-27 | 2000-05-24 | Fujitsu Limited | Semiconducter device and method of producing the same |
US7138673B2 (en) | 2002-08-19 | 2006-11-21 | Nec Electronics Corporation | Semiconductor package having encapsulated chip attached to a mounting plate |
-
1976
- 1976-04-19 JP JP4457976A patent/JPS52127756A/en active Pending
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6077432A (en) * | 1983-10-05 | 1985-05-02 | Fujitsu Ltd | Manufacture of semiconductor device |
JPH01123428A (en) * | 1987-11-06 | 1989-05-16 | Mitsubishi Electric Corp | Resin sealed semiconductor device |
JPS63239852A (en) * | 1987-12-03 | 1988-10-05 | Mitsui Haitetsuku:Kk | Semiconductor device |
JPH01171256A (en) * | 1987-12-25 | 1989-07-06 | Fuji Electric Co Ltd | Buitl-up structure of semiconductor device |
JPH0245969A (en) * | 1988-08-06 | 1990-02-15 | Toshiba Corp | Lead frame and semiconductor device consisting of lead frame therefor and manufacture thereof |
JPH02143449A (en) * | 1988-11-24 | 1990-06-01 | Toshiba Corp | Semiconductor sealing vessel |
EP0987758A3 (en) * | 1991-12-27 | 2000-05-24 | Fujitsu Limited | Semiconducter device and method of producing the same |
JPH06188353A (en) * | 1992-12-21 | 1994-07-08 | Mitsui High Tec Inc | Semiconductor device |
US7138673B2 (en) | 2002-08-19 | 2006-11-21 | Nec Electronics Corporation | Semiconductor package having encapsulated chip attached to a mounting plate |
US7449370B2 (en) | 2002-08-19 | 2008-11-11 | Nec Electronics Corporation | Production process for manufacturing such semiconductor package |
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