KR20210107609A - 점착 테이프 - Google Patents
점착 테이프 Download PDFInfo
- Publication number
- KR20210107609A KR20210107609A KR1020217003863A KR20217003863A KR20210107609A KR 20210107609 A KR20210107609 A KR 20210107609A KR 1020217003863 A KR1020217003863 A KR 1020217003863A KR 20217003863 A KR20217003863 A KR 20217003863A KR 20210107609 A KR20210107609 A KR 20210107609A
- Authority
- KR
- South Korea
- Prior art keywords
- adhesive tape
- base film
- adhesive layer
- ultraviolet
- weight
- Prior art date
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- 229920000728 polyester Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920001470 polyketone Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical class C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 239000003643 water by type Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/16—Layered products comprising a layer of synthetic resin specially treated, e.g. irradiated
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2377/00—Characterised by the use of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/124—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Organic Insulating Materials (AREA)
- Laminated Bodies (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Dicing (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP-P-2018-241138 | 2018-12-25 | ||
| JP2018241138 | 2018-12-25 | ||
| PCT/JP2019/050377 WO2020137980A1 (ja) | 2018-12-25 | 2019-12-23 | 粘着テープ |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20210107609A true KR20210107609A (ko) | 2021-09-01 |
Family
ID=71127293
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020217003863A KR20210107609A (ko) | 2018-12-25 | 2019-12-23 | 점착 테이프 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPWO2020137980A1 (ja) |
| KR (1) | KR20210107609A (ja) |
| CN (1) | CN113795380B (ja) |
| TW (1) | TWI821492B (ja) |
| WO (1) | WO2020137980A1 (ja) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7286011B2 (ja) * | 2020-09-23 | 2023-06-02 | 積水化学工業株式会社 | 仮固定材、及び、電子部品の製造方法 |
| WO2022071150A1 (ja) * | 2020-10-02 | 2022-04-07 | 昭和電工マテリアルズ株式会社 | 仮固定用フィルム、仮固定用積層体、及び半導体装置の製造方法 |
| WO2023243488A1 (ja) * | 2022-06-13 | 2023-12-21 | 日東電工株式会社 | 電子部品仮固定用粘接着シート |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0532946A (ja) | 1991-07-31 | 1993-02-09 | Lintec Corp | 再剥離型粘着性ポリマー |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007070432A (ja) * | 2005-09-06 | 2007-03-22 | Nitto Denko Corp | 粘着シート及びこの粘着シートを用いた製品の加工方法 |
| JP2009057469A (ja) * | 2007-08-31 | 2009-03-19 | Sekisui Chem Co Ltd | 表面保護フィルム |
| JP4318743B1 (ja) * | 2008-10-07 | 2009-08-26 | 昭和高分子株式会社 | 紫外線硬化型再剥離性粘着剤組成物及びこれを用いた粘着シート |
| JP4851613B2 (ja) * | 2009-12-22 | 2012-01-11 | 古河電気工業株式会社 | 半導体ウエハ表面保護用粘着テープ |
| KR101393922B1 (ko) * | 2010-09-16 | 2014-05-12 | 세키스이가가쿠 고교가부시키가이샤 | 점착제 조성물, 점착 테이프, 및 웨이퍼의 처리 방법 |
| JP5367903B2 (ja) * | 2012-03-19 | 2013-12-11 | 古河電気工業株式会社 | 半導体ウェハ表面保護用粘着テープ |
| TWI615453B (zh) * | 2012-12-10 | 2018-02-21 | Nitto Denko Corp | 切晶帶一體型接著片材、使用切晶帶一體型接著片材之半導體裝置之製造方法、及半導體裝置 |
| JP2014189778A (ja) * | 2013-03-28 | 2014-10-06 | Lintec Corp | 両面粘着シートおよび捲回体 |
| JP6261115B2 (ja) * | 2013-09-19 | 2018-01-17 | 日東電工株式会社 | 粘着シート |
| JP5718515B1 (ja) * | 2014-01-23 | 2015-05-13 | 古河電気工業株式会社 | 半導体ウエハ表面保護用粘着テープおよび半導体ウエハの加工方法 |
| JP6364200B2 (ja) * | 2014-02-07 | 2018-07-25 | 積水化学工業株式会社 | 電子部品用粘着テープ、電子部品の製造方法及びイメージセンサの製造方法 |
| CN105684131B (zh) * | 2014-03-03 | 2018-09-25 | 古河电气工业株式会社 | 半导体加工用粘合带 |
| JP6632324B2 (ja) * | 2015-10-28 | 2020-01-22 | リンテック株式会社 | 粘着シート及び半導体装置製造方法 |
| JP6802029B2 (ja) * | 2016-10-07 | 2020-12-16 | 積水化学工業株式会社 | 半導体保護テープ |
| JP2018150521A (ja) * | 2017-03-10 | 2018-09-27 | 積水化学工業株式会社 | 表面保護テープ |
| JP6832784B2 (ja) * | 2017-04-24 | 2021-02-24 | デンカ株式会社 | ステルスダイシング用粘着テープ及びそれを用いた半導体チップの製造方法 |
-
2019
- 2019-12-23 JP JP2020506838A patent/JPWO2020137980A1/ja active Pending
- 2019-12-23 WO PCT/JP2019/050377 patent/WO2020137980A1/ja active Application Filing
- 2019-12-23 CN CN201980062135.1A patent/CN113795380B/zh active Active
- 2019-12-23 KR KR1020217003863A patent/KR20210107609A/ko not_active Application Discontinuation
- 2019-12-25 TW TW108147493A patent/TWI821492B/zh active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0532946A (ja) | 1991-07-31 | 1993-02-09 | Lintec Corp | 再剥離型粘着性ポリマー |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI821492B (zh) | 2023-11-11 |
| WO2020137980A1 (ja) | 2020-07-02 |
| CN113795380B (zh) | 2024-05-03 |
| JPWO2020137980A1 (ja) | 2021-11-18 |
| CN113795380A (zh) | 2021-12-14 |
| TW202033704A (zh) | 2020-09-16 |
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| A201 | Request for examination | ||
| E902 | Notification of reason for refusal |