KR20200103548A - 부가 경화형 실리콘 조성물, 광반사재용 실리콘 경화물, 광반사재 및 광반도체 장치 - Google Patents

부가 경화형 실리콘 조성물, 광반사재용 실리콘 경화물, 광반사재 및 광반도체 장치 Download PDF

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Publication number: KR20200103548A
Authority: KR; South Korea
Prior art keywords: component; sio; group; mass; addition
Prior art date: 2019-02-25

Application number

KR1020200020780A

Other languages

English (en)

Korean (ko)

Inventor

신지 기무라

Original Assignee

신에쓰 가가꾸 고교 가부시끼가이샤

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2019-02-25

Filing date

2020-02-20

Publication date

2020-09-02

2020-02-20 Application filed by 신에쓰 가가꾸 고교 가부시끼가이샤 filed Critical 신에쓰 가가꾸 고교 가부시끼가이샤

2020-09-02 Publication of KR20200103548A publication Critical patent/KR20200103548A/ko

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- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/12—Polysiloxanes containing silicon bound to hydrogen
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5435—Silicon-containing compounds containing oxygen containing oxygen in a ring
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
- C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
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- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/004—Reflecting paints; Signal paints
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
- H01L33/46—Reflective coating, e.g. dielectric Bragg reflector
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
- C—CHEMISTRY; METALLURGY
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- C08K3/00—Use of inorganic substances as compounding ingredients
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- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2237—Oxides; Hydroxides of metals of titanium
- C08K2003/2241—Titanium dioxide
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- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
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- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
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Citations (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP2008106226A (ja)	2006-09-26	2008-05-08	Hitachi Chem Co Ltd	熱硬化性光反射用樹脂組成物、これを用いた光半導体素子搭載用基板とその製造方法および光半導体装置
JP4694371B2 (ja)	2003-02-25	2011-06-08	株式会社カネカ	硬化性組成物とその調製方法、遮光ペースト、遮光用樹脂とその形成方法、発光ダイオード用パッケージ及び半導体装置
JP2012233035A (ja)	2011-04-28	2012-11-29	Shin-Etsu Chemical Co Ltd	付加硬化型シリコーン組成物及びそれを用いた光半導体装置
JP2013221075A (ja)	2012-04-16	2013-10-28	Shin-Etsu Chemical Co Ltd	Ｌｅｄのリフレクター用熱硬化性シリコーン樹脂組成物並びにこれを用いたｌｅｄ用リフレクター及び光半導体装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH07207162A (ja) *	1994-01-21	1995-08-08	Toshiba Silicone Co Ltd	半導体整流素子被覆保護剤
US20100213415A1 (en) *	2009-02-26	2010-08-26	Nitto Denko Corporation	Metal oxide fine particles, silicone resin composition and use thereof
JP5875780B2 (ja) *	2010-04-02	2016-03-02	株式会社カネカ	白色硬化性樹脂組成物およびそれを用いた半導体のパッケージ
JP5844252B2 (ja) *	2010-04-02	2016-01-13	株式会社カネカ	硬化性樹脂組成物、硬化性樹脂組成物タブレット、成形体、半導体のパッケージ、半導体部品及び発光ダイオード
KR101881604B1 (ko) *	2011-11-21	2018-07-24	신에쓰 가가꾸 고교 가부시끼가이샤	Ｌｅｄ 리플렉터로서 유용한 백색 열경화성 실리콘 수지 조성물 및 상기 조성물을 이용한 광반도체 장치
US20140191263A1 (en) *	2013-01-07	2014-07-10	Sabic Innovative Plastics Ip B.V.	Compositions for an led reflector and articles thereof
WO2014200112A1 (ja) *	2013-06-14	2014-12-18	東レ・ダウコーニング株式会社	反応性シリコーン組成物、反応性熱可塑体、硬化物、および光半導体装置
CN103408951B (zh) *	2013-08-28	2016-01-13	江苏博睿光电有限公司	Led封装用硅树脂胶及其制备方法
CN103627227B (zh) *	2013-11-27	2015-08-19	天津市职业大学	一种太阳能玻璃自清洁减反射涂料及其生产方法
WO2016038836A1 (ja) *	2014-09-10	2016-03-17	東レ・ダウコーニング株式会社	硬化性シリコーン組成物、その硬化物、および光半導体装置
JP6751368B2 (ja) *	2017-04-27	2020-09-02	信越化学工業株式会社	付加硬化型シリコーン組成物、該組成物の製造方法、及び光学半導体装置

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- 2019-02-25 JP JP2019032102A patent/JP7103974B2/ja active Active
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Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP4694371B2 (ja)	2003-02-25	2011-06-08	株式会社カネカ	硬化性組成物とその調製方法、遮光ペースト、遮光用樹脂とその形成方法、発光ダイオード用パッケージ及び半導体装置
JP2008106226A (ja)	2006-09-26	2008-05-08	Hitachi Chem Co Ltd	熱硬化性光反射用樹脂組成物、これを用いた光半導体素子搭載用基板とその製造方法および光半導体装置
JP2012233035A (ja)	2011-04-28	2012-11-29	Shin-Etsu Chemical Co Ltd	付加硬化型シリコーン組成物及びそれを用いた光半導体装置
JP2013221075A (ja)	2012-04-16	2013-10-28	Shin-Etsu Chemical Co Ltd	Ｌｅｄのリフレクター用熱硬化性シリコーン樹脂組成物並びにこれを用いたｌｅｄ用リフレクター及び光半導体装置

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KR101265886B1 (ko)	2013-05-20	발광 다이오드용 부가 경화형 실리콘 수지 조성물
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