KR20060035736A - 전기 부품의 실장 방법 및 실장 장치 - Google Patents
전기 부품의 실장 방법 및 실장 장치 Download PDFInfo
- Publication number
- KR20060035736A KR20060035736A KR1020067000575A KR20067000575A KR20060035736A KR 20060035736 A KR20060035736 A KR 20060035736A KR 1020067000575 A KR1020067000575 A KR 1020067000575A KR 20067000575 A KR20067000575 A KR 20067000575A KR 20060035736 A KR20060035736 A KR 20060035736A
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- South Korea
- Prior art keywords
- wiring board
- electrical component
- thermocompression
- chip
- bonding
- Prior art date
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- 238000000034 method Methods 0.000 title claims abstract description 24
- 238000004806 packaging method and process Methods 0.000 title abstract 5
- 229920001971 elastomer Polymers 0.000 claims abstract description 40
- 239000002313 adhesive film Substances 0.000 claims abstract description 25
- 239000011347 resin Substances 0.000 claims abstract description 24
- 229920005989 resin Polymers 0.000 claims abstract description 24
- 239000005060 rubber Substances 0.000 claims abstract description 24
- 239000000853 adhesive Substances 0.000 claims abstract description 20
- 239000000806 elastomer Substances 0.000 claims abstract description 16
- 230000001070 adhesive effect Effects 0.000 claims abstract description 12
- 238000002788 crimping Methods 0.000 claims description 30
- 239000011230 binding agent Substances 0.000 claims description 21
- 239000002245 particle Substances 0.000 claims description 11
- 239000000155 melt Substances 0.000 abstract description 11
- 230000000052 comparative effect Effects 0.000 description 16
- 238000010438 heat treatment Methods 0.000 description 7
- 229920002379 silicone rubber Polymers 0.000 description 7
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- 238000010586 diagram Methods 0.000 description 5
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- 229910052751 metal Inorganic materials 0.000 description 4
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- 230000006835 compression Effects 0.000 description 3
- 238000007906 compression Methods 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 230000032683 aging Effects 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 244000043261 Hevea brasiliensis Species 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 description 1
- 229920003052 natural elastomer Polymers 0.000 description 1
- 229920001194 natural rubber Polymers 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 239000005061 synthetic rubber Substances 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B30—PRESSES
- B30B—PRESSES IN GENERAL
- B30B5/00—Presses characterised by the use of pressing means other than those mentioned in the preceding groups
- B30B5/02—Presses characterised by the use of pressing means other than those mentioned in the preceding groups wherein the pressing means is in the form of a flexible element, e.g. diaphragm, urged by fluid pressure
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B30—PRESSES
- B30B—PRESSES IN GENERAL
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
제1 비교예 | 제1 실시예 | 제2 실시예 | 제2 비교예 | |
고무 경도 | 10 이하 | 40 | 80 | 120 |
공동 | 없음 | 없음 | 없음 | 있음 |
초기 도통 저항 | × | ○ | ○ | ○ |
접속 신뢰성 | × | ○ | ○ | × |
제3 비교예 | 제3 실시예 | 제1 실시예 | 제4 비교예 | |
수지 용융 점도 (mPa·S) | 5 | 1.0 × 102 | 1.0 × 105 | 1.0 ×109 |
공동 | 없음 | 없음 | 없음 | 있음 |
초기 도통 저항 | × | ○ | ○ | ○ |
접속 신뢰성 | × | ○ | ○ | × |
Claims (12)
- 전기 부품을 배선 기판 상에 실장하는 실장 방법이며,접착제를 이용하여 전기 부품을 배선 기판 상에 열압착하는 공정을 갖고,상기 열압착시, 상기 전기 부품의 정상부 영역을 상기 배선 기판에 대해 소정의 압력으로 압박하는 한편, 상기 전기 부품의 측부 영역을 상기 정상부 영역에 대한 압력보다 작은 압력으로 압박하는 전기 부품의 실장 방법.
- 제1항에 있어서, 상기 열압착시 상기 전기 부품측을 소정 온도로 가열하는 동시에, 상기 배선 기판측을 상기 소정 온도보다 높은 온도로 가열하는 전기 부품의 실장 방법.
- 제1항에 있어서, 소정의 엘라스토머로 이루어지는 압착부를 상기 전기 부품의 정상부 및 측부에 압박하는 전기 부품의 실장 방법.
- 제3항에 있어서, 상기 열압착 헤드의 압착부로서, 고무 경도가 40 이상 80 이하인 엘라스토머를 이용하는 전기 부품의 실장 방법.
- 제1항에 있어서, 상기 열압착시, 상기 접착제를, 용융 점도가 1.0 × 102 mPa·s 이상 1.0 × 105 mPa·s 이하가 되도록 가열하는 전기 부품의 실장 방법.
- 제1항에 있어서, 상기 접착제로서, 결착 수지 중에 도전 입자가 분산된 이방 도전성 접착 필름을 이용하는 전기 부품의 실장 방법.
- 제1항에 있어서, 상기 전기 부품의 정상부 영역과 측부 영역을 동시에 압박하는 전기 부품의 실장 방법.
- 전기 부품을 배선 기판 상에 실장하는 실장 장치이며,고무 경도가 40 이상 80 이하인 엘라스토머로 이루어지는 압착부를 갖는 열압착 헤드를 구비하고,배선 기판 상에 배치된 전기 부품에 대해 상기 압착부를 소정의 압력으로 압박하도록 구성되어 있는 실장 장치.
- 제8항에 있어서, 상기 열압착 헤드의 압착부의 두께가, 상기 전기 부품의 두께와 동등 이상인 실장 장치.
- 제8항에 있어서, 상기 열압착 헤드의 압착부의 크기가, 상기 배선 기판 상에 배치된 전기 부품의 면적보다 큰 실장 장치.
- 제8항에 있어서, 상기 열압착 헤드의 압착부의 크기가, 복수의 전기 부품을 배치한 영역의 면적보다 큰 실장 장치.
- 제8항에 있어서, 상기 배선 기판을 지지하는 베이스를 더 갖고, 상기 베이스에 히터가 설치되어 있는 실장 장치.
Applications Claiming Priority (3)
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JPJP-P-2003-00195684 | 2003-07-11 | ||
JP2003195684A JP3921459B2 (ja) | 2003-07-11 | 2003-07-11 | 電気部品の実装方法及び実装装置 |
PCT/JP2004/009726 WO2005006430A1 (ja) | 2003-07-11 | 2004-07-08 | 電気部品の実装方法及び実装装置 |
Publications (2)
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KR20060035736A true KR20060035736A (ko) | 2006-04-26 |
KR101105948B1 KR101105948B1 (ko) | 2012-01-18 |
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KR1020067000575A KR101105948B1 (ko) | 2003-07-11 | 2004-07-08 | 전기 부품의 실장 방법 및 실장 장치 |
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US (2) | US7556190B2 (ko) |
EP (1) | EP1646081B1 (ko) |
JP (1) | JP3921459B2 (ko) |
KR (1) | KR101105948B1 (ko) |
CN (2) | CN101350324B (ko) |
HK (1) | HK1125226A1 (ko) |
TW (1) | TWI296905B (ko) |
WO (1) | WO2005006430A1 (ko) |
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- 2004-07-08 CN CN2008102144331A patent/CN101350324B/zh not_active Expired - Lifetime
- 2004-07-08 CN CNB2004800198375A patent/CN100459080C/zh not_active Expired - Lifetime
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WO2005006430A1 (ja) | 2005-01-20 |
US20060113356A1 (en) | 2006-06-01 |
US20090230171A1 (en) | 2009-09-17 |
JP3921459B2 (ja) | 2007-05-30 |
CN100459080C (zh) | 2009-02-04 |
KR101105948B1 (ko) | 2012-01-18 |
CN101350324B (zh) | 2010-09-01 |
EP1646081A1 (en) | 2006-04-12 |
EP1646081A4 (en) | 2010-06-16 |
CN1823409A (zh) | 2006-08-23 |
CN101350324A (zh) | 2009-01-21 |
TW200505299A (en) | 2005-02-01 |
HK1125226A1 (en) | 2009-07-31 |
TWI296905B (en) | 2008-05-11 |
US7556190B2 (en) | 2009-07-07 |
US7703657B2 (en) | 2010-04-27 |
EP1646081B1 (en) | 2018-09-05 |
JP2005032952A (ja) | 2005-02-03 |
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