JP5406974B2 - 熱圧着装置及び電気部品の実装方法 - Google Patents
熱圧着装置及び電気部品の実装方法 Download PDFInfo
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- JP5406974B2 JP5406974B2 JP2012264673A JP2012264673A JP5406974B2 JP 5406974 B2 JP5406974 B2 JP 5406974B2 JP 2012264673 A JP2012264673 A JP 2012264673A JP 2012264673 A JP2012264673 A JP 2012264673A JP 5406974 B2 JP5406974 B2 JP 5406974B2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7525—Means for applying energy, e.g. heating means
- H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/75301—Bonding head
- H01L2224/75314—Auxiliary members on the pressing surface
- H01L2224/75315—Elastomer inlay
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7525—Means for applying energy, e.g. heating means
- H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/75301—Bonding head
- H01L2224/75314—Auxiliary members on the pressing surface
- H01L2224/75315—Elastomer inlay
- H01L2224/75316—Elastomer inlay with retaining mechanisms
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
- H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
- H01L2924/15788—Glasses, e.g. amorphous oxides, nitrides or fluorides
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Combinations Of Printed Boards (AREA)
- Wire Bonding (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
この従来技術によれば、従来各実装方式の電気部品毎に行っていた各実装工程を一括して行うことが可能になるため、実装効率を向上させることができる。
本発明は、上述した熱圧着装置を用い、電気部品を配線基板上に実装する電気部品の実装方法であって、実装方式の異なる複数の電気部品を、その接続側面を上方に向けた状態で前記ステージの前記圧着部材上に配置するとともに、当該電気部品上に接着剤を介して前記配線基板を配置し、前記加熱機構を下降させ前記配線基板を前記電気部品に対して押圧することにより、当該配線基板と当該電気部品とを一括して熱圧着する工程を有する電気部品の実装方法である。
本発明では、前記接着剤として、結着樹脂中に導電粒子が分散された異方導電性接着フィルムを用いる場合にも効果的である。
本発明では、前記配線基板が、液晶表示装置用の配線パターンが形成された基板である場合にも効果的である。
また、本発明によれば、弾性材料からなる圧着部材がステージ側に設けられており確実に固定することができるので、ファインピッチの電極を有する電気部品の接続の際においても、安定して熱圧着を行うことができる。
本発明においては、加熱機構が、電気部品の接着剤によって接着される部分と同様の形状で、かつ、当該熱圧着の際に当該接着剤の広がる領域と同等の面積の加熱押圧面を有することから、熱圧着の際に例えば基板側から電気部品の実装領域、即ち接着剤の広がる領域と同等の領域のみを加熱することができるため、液晶表示装置等の配線パターンへのダメージを確実に回避することができる。
図1は、本発明に係る熱圧着装置の実施の形態を示す部分断面図、図2(a)(b)は、同熱圧着装置を用いた実装方法の実施の形態を示す部分断面工程図である。
このステージ2は、鉛直方向には移動しないように固定された状態で設置されている。なお、ステージ2を水平方向に移動可能に構成することもできる。
例えば、上述の実施の形態においては、電気部品としてICチップ、フレキシブル基板を実装する場合を例にとって説明したが、本発明はこれに限られず、抵抗器、コンデンサ等を実装する場合に適用することはもちろんである。
ただし、本発明は液晶表示装置用のガラス基板上に電気部品を実装する場合に特に実装効率を向上させることができるものである。
2……ステージ
3……圧着部材
4……加熱機構
5……ヒーター
10……電気部品
20……異方導電性接着フィルム(接着剤)
40……本体部
40a…加熱押圧面
Claims (4)
- 実装方式の異なる複数の電気部品を一括して熱圧着を行い実装するための熱圧着装置であって、
剛性材料からなるステージと、
前記ステージに装着され弾性材料からなる圧着部材と、
前記圧着部材に対して上方に対向配置され、上下動可能に構成された加熱機構とを有し、
前記加熱機構は、前記電気部品の接着剤によって接着される部分と同様の形状で、かつ、当該熱圧着の際に当該接着剤の広がる領域と同等の面積の加熱押圧面を有する熱圧着装置。 - 請求項1記載の熱圧着装置を用い、電気部品を配線基板上に実装する電気部品の実装方法であって、
実装方式の異なる複数の電気部品を、その接続側面を上方に向けた状態で前記ステージの前記圧着部材上に配置するとともに、当該電気部品上に接着剤を介して前記配線基板を配置し、
前記加熱機構を下降させ前記配線基板を前記電気部品に対して押圧することにより、当該配線基板と前記電気部品とを一括して熱圧着する工程を有する電気部品の実装方法。 - 前記接着剤として、結着樹脂中に導電粒子が分散された異方導電性接着フィルムを用いる請求項2記載の電気部品の実装方法。
- 前記配線基板が、液晶表示装置用の配線パターンが形成された基板である請求項2又は3のいずれか1項記載の電気部品の実装方法。
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JP2012264673A JP5406974B2 (ja) | 2012-12-03 | 2012-12-03 | 熱圧着装置及び電気部品の実装方法 |
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JP2012264673A JP5406974B2 (ja) | 2012-12-03 | 2012-12-03 | 熱圧着装置及び電気部品の実装方法 |
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JP2007194160A Division JP2009032845A (ja) | 2007-07-26 | 2007-07-26 | 熱圧着装置及び電気部品の実装方法 |
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JP2013048300A JP2013048300A (ja) | 2013-03-07 |
JP5406974B2 true JP5406974B2 (ja) | 2014-02-05 |
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DE102014104496B4 (de) * | 2014-03-31 | 2019-07-18 | Semikron Elektronik Gmbh & Co. Kg | Vorrichtung zur schweißtechnischen Verbindung von Anschlusselementen mit dem Substrat eines Leistungshalbleitermoduls und zugehöriges Verfahren |
JP7004921B2 (ja) | 2019-04-26 | 2022-01-21 | 日亜化学工業株式会社 | 発光モジュールの製造方法及び発光モジュール |
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JP3052300B2 (ja) * | 1992-06-23 | 2000-06-12 | ソニーケミカル株式会社 | 配線基板及び加圧ツール |
JP3688686B2 (ja) * | 2002-03-06 | 2005-08-31 | 株式会社東芝 | 半導体装置の製造方法 |
JP3921459B2 (ja) * | 2003-07-11 | 2007-05-30 | ソニーケミカル&インフォメーションデバイス株式会社 | 電気部品の実装方法及び実装装置 |
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