TWI296905B - Process for mounting electric parts and mounting apparatus - Google Patents

Process for mounting electric parts and mounting apparatus Download PDF

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Publication number
TWI296905B
TWI296905B TW093120441A TW93120441A TWI296905B TW I296905 B TWI296905 B TW I296905B TW 093120441 A TW093120441 A TW 093120441A TW 93120441 A TW93120441 A TW 93120441A TW I296905 B TWI296905 B TW I296905B
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TW
Taiwan
Prior art keywords
head
nip
pressing
electrical component
pressure
Prior art date
Application number
TW093120441A
Other languages
English (en)
Other versions
TW200505299A (en
Inventor
Takashi Matsumura
Hisashi Ando
Shiyuki Kanisawa
Yasuhiro Suga
Noriaki Kudo
Original Assignee
Sony Chemicals Corp
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Filing date
Publication date
Application filed by Sony Chemicals Corp filed Critical Sony Chemicals Corp
Publication of TW200505299A publication Critical patent/TW200505299A/zh
Application granted granted Critical
Publication of TWI296905B publication Critical patent/TWI296905B/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B30—PRESSES
    • B30B—PRESSES IN GENERAL
    • B30B5/00—Presses characterised by the use of pressing means other than those mentioned in the preceding groups
    • B30B5/02—Presses characterised by the use of pressing means other than those mentioned in the preceding groups wherein the pressing means is in the form of a flexible element, e.g. diaphragm, urged by fluid pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B30—PRESSES
    • B30B—PRESSES IN GENERAL
    • B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
    • B30B15/06—Platens or press rams
    • B30B15/065—Press rams
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    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
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    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

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1296905 九、發明說明： 【發明所屬之技術領域】 片等之電氣元件構 種使用接著劑來構 本舍明係關於一種將諸如半導體晶 裝於配線基板上之技術，特別是關於一 裝電氣元件之技術。 【先前技術】 以往，於印刷配線板等之配線基板上直接構裝裸晶片 方法上已知使用一種在黏結劑（binder)中分散著導電 粒子之異向導電性接著薄膜之方法。 使用異向導電性接著薄膜之構裝方法，係於貼附著異 向導電性接著薄膜之基板上搭載IC晶片I，以陶瓷或金 屬衣平坦壓接頭來* Ic晶片加壓、加熱而使得異向導電 性接著薄膜硬化來進行熱壓合構裝。 使用前述般金屬等壓接頭來進行加壓、加熱之方法， :熱壓合之際’對& IC晶片周圍接著劑之條帶(fillet) 15刀的加熱不足，成為連接可靠度降低之原因，又複數1C 曰日片之構裝困難亦為其中問題之一。 疋以’近年來，為了解決此等問題，乃提議使用由矽 酮橡膠等之彈性體所構成之熱壓合頭來進 <亍r c晶片之熱 壓合的技術。 專利文獻1 :特開2000-7961 1號公報 專利文獻2 :特開20 02-359264號公報 然而’刚述習知技術當中，由於1C晶片與基板之連接 Ρ刀（凸塊）在圖案間之加壓力不足，乃無法進行充分的連 1296905 <、’、法充刀確保初期導通電阻以及老化後之連接可靠 度’此為問題所在。 【發明内容】 曰本毛月係用以解決前述習知技術的課題，其目的在於 提供-種能使用接著劑來進行高可靠度之電氣元件構裝的 構裝方法以及構裝裝置。 狀為了達成上述目的，本發明乃提供一種電氣元件之構 衣方法’其特徵在於：具有使用接著劑將電氣it件熱壓合 ;-線基板上之製程；在進行該熱壓合之際，將該電氣元 件^頂^區域對於該配線基板以既定壓力來抵壓，另外將 名電乳7L件之側部區域以相較於該頂部區域之壓力來得小 的壓力來抵壓。 J 圍 立又於本發明中所謂的「電氣元件」之「側部區域 曰I C曰曰片專之電氣元件本身之侧部以及電氣元件周 之例如接著劑部分。 於本發明中，在進行前述熱壓合之際，將該電氣元件 侧以既定溫度加熱，且將該酉己線基板側卩冑於冑述既定溫 度的溫度來加熱亦為有效的做法。 ”又，於本發明中，將既定之彈性體所構成之壓合部抵 壓於該電氣元件之頂部與侧部亦為有效的做法。 再者’於本發明中，做為前述熱壓合頭之壓合部，使 用橡膠硬度40〜80之彈性體亦為有效的做法。 再者，於本發明中，於進行該熱壓合之際，將該接著 1296905 s〜l· 0xl05mPa · s 的方式 劑以炼融黏度成為1. 〇Xl〇2mpa 來加熱亦為有效的做法。 又，在本發明中， 分散著導電粒子而成之 法0 做為前述接著劑使用在黏結樹脂中 異向導電性接著薄膜亦為有效的做 又，在本發明中，將該電氣元件之頂部區域與側部區 域同時抵壓亦為有效的做法。 另-方面，本發明為一種構裝裝置，具備熱壓合頭， 該熱麼合頭具有由橡膠硬度40〜80之彈性體所構成之麼合 部；對於在配線基板上所配置之電氣元件使得該廢合部以 既定壓力進行抵壓。 於本發明中，該熱麼合頭之壓合部的厚度為該電氣元 件之厚度的同等以上亦為有效的做法。 又，於本發明中，該熱壓合頭之壓合部的大小較該電 氣元件之面積來得大亦為有效的做法。 再者，於本發明中，該熱壓合頭之壓合部的大小較配 置複數電氣元件之區域的面積來得大亦為有效的做法。 又，於本發明中，具有用以支持該配線基板之基台， 並於该基台設置加熱器亦為有效的做法。 於本發明方法中，在進行熱壓合之際，將電氣元件之 頂σ卩區域對於配線基板以既定壓力來抵壓，另外，將電氣 元件之側部區域以相較於頂部區域之壓力來得小的壓力來 抵壓，藉此，不但可對於電氣元件與配線基板之連接部分 施加充分的壓力，且對於電氣元件周圍之條帶部亦能以不 1296905 致產生空孔的方式來加壓，乃可利用例如異向導電性接著 薄膜來進行高可靠度之ic晶片等的連接。 特別是，在本發明中，在進行熱壓合之際，若將電氣 疋件側以既定溫度加熱，且將配線基板側利用例如在支持 基台上所設置之加熱器以高於前述既定溫度的溫度來加 熱，則可對於電氣元件周圍之條帶部進行充分的加熱，所 以可進一步防止空孔的發生。 又，於本發日月t，若將既定之彈性體所才籌叙壓合部 抵壓於電氣元件之頂部與側部，則可對於電氣元件之頂部 區域與側部區域輕易賦予既定之麼力差來進行加壓。 再者，右做為壓合部使用橡膠硬度40〜80之彈性體， 、:可對於電氣兀件之頂部區域與侧部區域以最適當之壓力 成於進行該熱M合之際，若將該接著劑以炼 ㈣度成為^102一〜UWs的方式來加熱， =二!:彳=〜在連接部分之黏結樹脂的排除 J進仃可罪度更高之連接。 依據本發明裝置，由於具備熱M合頭（具有由橡
膠硬度40〜80之張极緲私此L 體所構成之壓合部），對於在配線基 槪上所配晉夕金& 一 乳几件使得該壓合部以既定壓力進行抵 土 可進行高可靠度連接、構成簡潔之構裝裝置。 兮電气-杜；本毛明中，當熱壓合頭之壓合部的厚度為 合部的大小㈣上的情況，或是熱遷合頭之屢 電氣元件之頂部U 的情況，能更確實地對於 、时/與側部區域以最適當的壓力進行加 1296905 壓。 再者，於本發明中，當熱壓合頭之壓合部的大小較配 置複數電氣元件之區域的面積來得大的情況，可將複數電 氣元件同時以高可靠度做連接，可進一步大幅提昇構裝效 率。 t明效果 依據本發明，可使用接著劑進行高可靠度之電氣元件 的構裝。 【實施方式】 以下參照本發明相關之電氣元件之構裝方法以及構裝 裳置之最佳實施形態來詳細說明。 圖1與圖2係顯示本實施形態之構裝裝置之主要部分 以及熱壓合製程之概略構成圖。 如圖1所示般，本實施形態之構裝裝置1係具備：用 以载放形成有配線圖案10a之配線基板1〇的基台2、以及 乂對《又置有凸塊2〇a之1C晶片（電氣元件）2〇進行加壓 與加熱之熱壓合頭4。 处基σ 2係由既疋金屬所構成，其内部設置有加 熱用之加熱器3。 八另一方面，熱壓合頭4具有由既定金屬所構成之熱壓 合頭本體5’其内部設置有加熱用之加熱器（未圖示 於熱壓合頭本體5之與基台2相對向的部分形成 f凹部5a，於此凹部5a，由平板狀彈性體所構成之壓合 部6係以密合於凹部5a的方式安裝於該處。 l2969〇5 來配Γ:Γ:壓合部6係以其壓合面6a呈水平的方式 ^置。此外，壓合部6之壓合面6a係以較Ic大 之了貝部20b的面積來得大的方式所構成。 同等:上壓合部6之厚度係設定成為ic晶片2。之厚度的 牿二方面：本發明當中，壓合部6之彈性體種類並無 、】限疋，但彳之連接可靠度之觀點來看，以# 40,者為佳。 ；看則吏用橡膠硬度 橡膠硬度未滿40之彈性體，對於lc晶片2〇之壓力不 =分’初期電阻以及連接可#度差，非所喜好者；橡膠硬 度超過80之彈性體對於條帶部分之麼力不充分，於接著 劑之黏結樹脂會發生空孔造成連接可靠度變差，亦非所喜 好者。 又，於本說明書中，在橡膠硬度方面係採用依據川s 6050之規格。 在前述彈性體方面可使用天然橡膠、合成橡膠任一者， 從耐熱性二㈣性之觀點來看，以使用㈣橡膠為佳。 *具有前述構成之本實施形態在進行Ic晶片2q之構裝 時，係如圖1所示般，將配線基板1〇配置於基台2上， 於該配線基板1 〇上載放異向導電性接著薄臈7。 該異向導電性接著薄膜7係於黏結樹脂7a中分散導電 粒子7b所得者。 又，於黏結樹脂7a中所分散之導電粒子7b之量少量 即可，本發明所使用之接著劑的熔融黏度並不會因導電粒 1296905 子7b分散與否而受到影響。 再者，於前述異向'導電性接著薄膜7上載放K晶片 2β〇，透過未圖示之保護薄膜將_合頭4之壓合面6a緊 遷於1C晶片20之丁冒立15 ° ，以既定條件進行暫時壓合， 進一步以下述條件進行正式壓合。 於本發明之情況，於進扞企★ 仃正式壓合之際，將1C晶片20 側以既定溫度加敎，且蔣两p, 又刀·、、、 1將配線基板10側以較前述既定溫 度為局之溫度來加熱。
具體而言，係以壓合部6之溫度成為loot程度的方 式來控制熱壓合頭4之加熱器，並以異向導電性接著薄膜 7之黏結樹脂7a溫度成為遷合部6之溫度2〇〇艺程度的方 式來控制基台2之加熱器3。 藉此，進行熱壓合之際，可將異向導電性接著薄膜7 以炼融黏度成為UxlG2mPa· s〜1Qxl()5mPa· s的方式來 加熱。 此處，當異向導電性接著薄膜7之熔融黏度未滿1〇χ 102mPa· s的情況，熱壓合時之黏結樹脂7a的流動性大，n 會發生空孔造成初期電阻以及連接可靠度變差，當熔融黏 度超過l.〇xl〇5mPa· s的情況，於熱壓合時在連接部分無 法將黏結樹脂7a完全排除，會發生空孔造成初期電阻以 及連接可靠度變差。 又，正式壓合時之壓力係對於每一個1C晶片以100N 之程度進行15秒左右。 40 〜80 如圖2所示般，本實施形態中，利用橡膠硬度 11 1296905 之彈性體所構成之壓合部6來進行加壓，藉此，可使得ic 晶片20之頂部2〇b相對於配線基板10以既定壓力來抵壓， 另一方面，將IC晶片20之側部的條帶部7c以較頂部2〇b 之壓力來得小之壓力來抵壓，是以，不僅可對於IC晶片2 0 與配線基板1〇之連接部分施加充分的壓力，且對於IC晶 片20周圍之條帶部7c也能以不致發生空孔的方式來加 壓。 其結果，依據本實施形態，可使用異向導電性接著薄 膜7進行高可靠度之ic晶片20等之連接。 特別是，在本實施形態中，進行熱壓合之際，藉由將 K晶片20侧以既定溫度來加熱，且將配線基板1〇側以較 該既定溫度為高之溫度來加熱，則對於IC晶片2〇周圍之 條帶部7c可充分地加熱，可確實防止空孔的發生。 再者，於熱壓合之際，由於將異向導電性接著薄膜7 以熔融黏度成為1〇xl〇2mpa.s〜1〇xl〇5mPa.s的方式來 加熱，乃可更確實地防止熱壓合時在連接部分之黏結樹脂 7a之排除與空孔的發生，可進行可靠度更高之連接。 另一方面，依據本實施形態之構裝裝置1，可得到可 進行高可靠度連接之簡潔構成的構裝裝置。 特別是，依據本實施形態，由於壓合部6之厚度係ic 晶片20厚度之同等以上，乃可對於IC晶片2〇之頂部 與側部之條帶部7c確實地以最適當壓力進行加壓。 圖3係顯示本發明之其他實施形態之概略構成圖，以 下針對與上述實施形態相對應之部分係賦予同一符號而 12 1296905 省略其詳細說明。 ‘ 如圖3所示般，本實施形態之構裝裝置1 a，壓合部6 -
之大小係較配置了複數（例如2個）之例如厚度相異之IC 曰曰片2 0、21的區域面積來得大，此點係與上述實施形熊 不同。 此時，壓合部6本身之橡膠硬度係40〜80，此與上述 實施形態相同。 依據具有此種構成之本實施形態，可將複數之特別是 厚度相異之1C晶片20、21同時以高可靠度做連接，藉此 · 可大幅提昇構裝效率。其他構成與作用效果係與上述實施 形態相同，故在此省略其詳細說明。 又’本發明並不限定於上述實施形態，可進行各種的 變更。 例如，在上述實施形態中，係舉出使用異向導電性接 著薄膜來構裝1C晶片的情況為例來說明，為本發明並不 限定於此，亦可使用不含導電粒子之接著劑。 又，於上述實施形態中，係舉出對於具有凸塊電極之 · 1C晶片進行構裝之情況為例做說明’惟本發明亦可適用於 不具凸塊電極之1C晶片。 (實施例） 以下以實施例與比較例來詳細地說明本發明。 〈實施例1> 在配線基板方面’係使用於玻璃環氧基板上形成寬度 75//m、間距150/zm之銅（Cu)圖案，且其上施以鎳—金锻 13 1296905 係準備形成有150# m間 〇· 4mm之晶片。 敷之硬性基板’在ic晶片方面， 距之凸塊電極的大小6x6mm、厚度 接著’使用熱壓合頭（裝設有由大小6〇x6〇mm、厚度 1〇_、橡膠硬度40之㈣橡膠所構成之壓合部），在異向 導電性接著薄膜方面，係使用於溶融黏度i Qxi()5mPa· g 之黏結樹脂中分散著導電粒子者，將IC日日日片熱壓合於配 線基板上。 此時’以壓合部之溫度為1〇〇。。、異向導電性接著薄 膜之溫度為200 °C的方式來控制基台溫度，以壓力 l〇〇N/IC(278N/cm2)進行15秒鐘之加壓與加熱。 〈實施例2> 除了使用橡膠硬度80之矽酮橡膠所構成之壓合部以 外，其餘與實施例1同樣條件來進行熱壓合。 〈比較例1 > 除了使用橡膠硬度1 〇以下之矽酮橡膠所構成之壓合部 以外’其餘與實施例1同樣條件來進行熱壓合。 〈比較例2> 除了使用橡膠硬度120之矽酮橡膠所構成之壓合部以 外’其餘與實施例1同樣條件來進行熱壓合。 〈實施例3> 除了使用在熔融黏度1 · 〇X1 〇5mpa · s之黏結樹脂中分 散有導電粒子之異向導電性接著薄膜以外，其餘與實施例 1同樣條件來進行熱壓合。 〈比較例3> 1296905 …除了使用在熔融黏度5mPa · s之黏結樹脂中分散有導 電粒子之異向$電性接著薄膜以外，其餘與實施例1同樣 條件來進行熱壓合。 〈比較例4> 除了使用在溶融黏度1.0xl09mPa· s之黏結樹脂中分 政有導電粒子之異向導電性接著薄膜以外，其餘與實施例 1同樣條件來進行熱壓合。 〈比較例5>
除了使用厚度較1C晶片薄（〇.2mm)之矽酮橡膠所構成 之壓合部以外，其餘與實施例1同樣條件來進行熱壓合。 (評價） 對於上述實施例以及比較例之壓合部的橡膠硬度所致 之可靠度以及黏結樹脂之熔融黏度所致之可靠度進行評 價。其結果示於表1、2。 [表1]
^含部之橡膠硬度所致可靠度評價 比較例1 實施例1 實施例2 比較例2 橡膠硬度 10以下 40 80 120 空孔 無 無 無 有 i刀期導通電阻 X 〇 〇 〇 妾可靠度 X 〇 〇 X (句樹脂熔融黏度=l.〇xl〇5mpa · [表2] 黏結樹脂之熔融黏度所致〒 S 「靠度評價 比較例1 實施例1 實施例2 比較例2 树脂溶融黏度 (mPa · s) 5 l.OxlO2 l.OxlO5 l.OxlO9 15 1296905 空孔_ ^^導通電阻 無 無 益 __ —^_ 〇 連接可靠度 X 〇 __g ______2^/ V (註)橡膠硬度=40 -—---^- 此時，初期導通電阻係以4端子法來測定圖案間之電 阻值，該值未滿1 Ω者視為〇，為1Ω以上者視為χ。 連接可靠度係在温度85 C、相對濕度85%之條件下進 行24小時老化後進行既定之熱歷程之熔焊處理（以丄〜4。〇 / 秒升溫—150Χ：±10Χ：、30秒±10秒餘熱區+以1〜4〇c/秒升 溫今峰值溫度235t：±5°C、10秒±1秒焊接區+以pi。/〆秒 冷卻）’所得之電阻值若未滿1Ω視為〇，為1〇以上視為 X ° 又，空孔之有無係以超音波顯微鏡來確認，將不認為 有空孔發生者視為〇，認為有空孔發生者視為χ。 由表1可明顯看出，壓合部之橡膠硬度為40之實施例 1以及橡膠硬度為80之實施例2 ’在初期導通電阻以及連 接可靠度皆良好，也沒有發生空孔。 另一方面，壓合部之橡膠硬度未滿4〇之比較例丨，對 於1C晶片之壓力不充分，在初期電阻與連接可靠度不佳， 橡膠硬度大於8 0之比較例2，對於條帶部之壓力不充分， 於接著劑之黏結樹脂中發生空孔，連接可靠度不佳。 又’異向導電性接著薄膜之黏結樹脂的熔融黏度為^ 〇 xl〇2mPa · s之實施例3以及熔融黏度為1· 〇xi〇5mPa · s之 實施例1，在初期導通電阻以及連接可靠度皆良好，也沒 有發生空孔。 另一方面，使用熔融黏度未滿l〇xl〇2mPa · s之黏結 1296905 樹脂的比較例3，熱壓合時之黏結樹脂的流動性大，會發 生二孔，在初期電阻與連接可靠度不佳，使用熔融黏度大 於1· 0x105mPa · s之黏結樹脂的比較例4，熱壓合時於連 接部分無法排除黏結樹脂，會發生空孔，在初期電阻與連 接可靠度不佳。 另一方面，使用厚度較丨c晶片來得薄之壓合部的比較 例5，無法對於條帶部施加壓力，會發生空孔，在初期電 阻與連接可靠度不佳。
產^業上可利用忡 本發明可利用於下述用途：於製造小型電子儀器之際， 將半V體晶片等之電氣電子元件構裝於印刷配線基板上來 製作電路基板之用途。 【圖式簡單說明】 圖1係顯示本發明之構裝裝置之實施形態的主要部分 以及熱壓合製程之概略構成圖。
圖2係顯示本發明之構裝裝置之實施形態的主要八 以及熱壓人制, 刀 σI私之概略構成圖。 圖3係本發明之其他實施形態之概略構成圖。 【主要元件符號說明】 1 構裝裝置 2 基台 3 加熱器 熱壓合頭 5 熱壓合頭本體 17 1296905 5a 凹部 6 壓合部 6a 壓合面 7 異向導電性接著薄膜（接著劑） 7 a 黏結樹脂 7b 導電粒子 7c 條帶部 10 配線基板
10a 配線圖案 20, 21 1C晶片（電氣元件） 20a 凸塊 20b 頂部
18

Claims (1)

1296905 * . 竹年{月”曰修(更)正本 第93120441¾‘利屮請粜申請專对範濟^本 十、申請專利範圍： 1 · 一種電氣元件之構裝方法，係將電氣元件構裝於配 線基板上之方法，其特徵在於·· 具有使用接著劑將電氣元件熱壓合於配線基板上之製 程； 在進行該熱壓合之際，將該電氣元件之頂部區域對於 該配線基板以既定壓力來抵壓，另外將該電氣元件之側部 區域以相較於該頂部區域之壓力來得小的壓力來抵壓； 將特定之彈性體所構成之壓合部抵壓於該電氣元件之 頂部與側部；做為該熱壓合頭之壓合部，係使用橡膠硬度 -养勢之-^« 〇----------------------- - - — _ — X 2.如申請專利範圍第i項之電氣元件之構裝方法，其 中在進行該熱壓合之際，將該電氣元件側以既定溫度加 熱，且將該配線基板侧以高於該既定溫度的溫度來加熱。 3·如申請專利範圍第丨項之電氣元件之構裝方法，其 中於進仃該熱壓合之際，將該接著劑以熔融黏度成為u xl〇2niPa· s〜；L〇xl〇5mPa· s 的方式來加熱。 4·如申請專利_丨項之電氣元件之構裝方法，》 中’做為該接著劑，係使用在黏結樹脂中分散著導電粒^ 而成之異向導電性接著薄膜。 5·-種構裝裝置’用以將電氣㈣構裳於配線基板上 其特徵在於： 用以將該電氣元件之 來抵壓，另外將該電 具備熱壓合頭，該熱壓合頭具有 頁P區域對於遠配線基板以既定壓力 19 1296905 氣元件之側部區域以相較於該頂部區域之壓力來得小的壓 力來抵壓之由橡膠硬度40〜80之彈性體所構成之壓合部。。 6·如申請專利範圍第5項之構裝裝置，其中，該熱壓 合頭之壓合部的厚度為該電氣元件之厚度的同等以上。 7·如申請專利範圍第5項之構裝裝置，其中，該熱壓 合頭之壓合部的大小，較該配線基板上所配置之電氣元件 之面積來得大。 8·如申請專利範圍第5項之構裝裝置，其中，該熱壓 合頭之壓合部的大小，較配置複數電氣元件之區域的面穑 來得大。 ^ v m x支持该配線基板之基台，並於該基台設置加熱器。 十一、圖式： 如次頁 20 1296905 七、指定代表圈： (一） 本案指定代表圖為：第（1 )圖。 (二) 本代表圖之元件符號簡單說明： 1 構裝裝置 2 基台 3 加熱器 4 熱壓合頭 5 熱壓合頭本體 5a 凹部 6 壓合部 6a 壓合面 7 異向導電性接著薄膜（接著劑） 7 a 黏結樹脂 7b 導電粒子 10 配線基板 10a 配線圖案 20 IC晶片 20a 凸塊 20b 頂部 八、本案若有化學式時，請揭示最能顢示發明特徵的化學式:
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CN100459080C (zh) 2009-02-04
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CN101350324B (zh) 2010-09-01
EP1646081A1 (en) 2006-04-12
EP1646081A4 (en) 2010-06-16
CN1823409A (zh) 2006-08-23
CN101350324A (zh) 2009-01-21
TW200505299A (en) 2005-02-01
HK1125226A1 (en) 2009-07-31
US7556190B2 (en) 2009-07-07
US7703657B2 (en) 2010-04-27
EP1646081B1 (en) 2018-09-05
JP2005032952A (ja) 2005-02-03

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