KR102576890B1 - 점착제 조성물, 점착 테이프 및 반도체 디바이스의 보호 방법 - Google Patents

점착제 조성물, 점착 테이프 및 반도체 디바이스의 보호 방법 Download PDF

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Publication number
KR102576890B1
KR102576890B1 KR1020197030671A KR20197030671A KR102576890B1 KR 102576890 B1 KR102576890 B1 KR 102576890B1 KR 1020197030671 A KR1020197030671 A KR 1020197030671A KR 20197030671 A KR20197030671 A KR 20197030671A KR 102576890 B1 KR102576890 B1 KR 102576890B1
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KR
South Korea
Prior art keywords
adhesive
adhesive composition
weight
polymer
semiconductor device
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KR1020197030671A
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English (en)
Korean (ko)
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KR20200044722A (ko
Inventor
도루 도네가와
Original Assignee
세키스이가가쿠 고교가부시키가이샤
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Publication of KR20200044722A publication Critical patent/KR20200044722A/ko
Application granted granted Critical
Publication of KR102576890B1 publication Critical patent/KR102576890B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
KR1020197030671A 2017-08-29 2018-08-22 점착제 조성물, 점착 테이프 및 반도체 디바이스의 보호 방법 KR102576890B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2017-164630 2017-08-29
JP2017164630 2017-08-29
PCT/JP2018/030981 WO2019044623A1 (ja) 2017-08-29 2018-08-22 粘着剤組成物、粘着テープ及び半導体デバイスの保護方法

Publications (2)

Publication Number Publication Date
KR20200044722A KR20200044722A (ko) 2020-04-29
KR102576890B1 true KR102576890B1 (ko) 2023-09-08

Family

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Family Applications (1)

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KR1020197030671A KR102576890B1 (ko) 2017-08-29 2018-08-22 점착제 조성물, 점착 테이프 및 반도체 디바이스의 보호 방법

Country Status (5)

Country Link
JP (1) JP7181087B2 (ja)
KR (1) KR102576890B1 (ja)
CN (1) CN110719944A (ja)
TW (1) TWI797152B (ja)
WO (1) WO2019044623A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023053912A1 (ja) * 2021-09-30 2023-04-06 日東電工株式会社 積層体、光学部材、及び光学装置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007119884A1 (ja) * 2006-04-14 2007-10-25 Otsuka Chemical Co., Ltd. 樹脂組成物および耐熱性粘着剤
WO2009037990A1 (ja) 2007-09-21 2009-03-26 Sekisui Chemical Co., Ltd. 粘着剤及びこれを用いた表面保護粘着シート
JP2011074380A (ja) * 2009-09-07 2011-04-14 Lintec Corp 保護フィルム及び保護フィルムの製造方法
WO2012036209A1 (ja) * 2010-09-16 2012-03-22 積水化学工業株式会社 粘着剤組成物、粘着テープ、及び、ウエハの処理方法
JP2013077435A (ja) 2011-09-30 2013-04-25 Oji Holdings Corp 導電性転写シートおよび導電性積層体
JP2016141749A (ja) * 2015-02-03 2016-08-08 リンテック株式会社 保護膜形成用シート、及び保護膜形成用複合シート

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU637208B2 (en) * 1990-04-20 1993-05-20 Minnesota Mining And Manufacturing Company Low voltage electron beam radiation cured elastomer-based pressure sensitive adhesive tape
JP2601956B2 (ja) 1991-07-31 1997-04-23 リンテック株式会社 再剥離型粘着性ポリマー
JP2007314584A (ja) * 2006-05-23 2007-12-06 Sekisui Chem Co Ltd 粘着テープ
CN102439769B (zh) * 2009-04-03 2014-10-08 东洋油墨Sc控股株式会社 非水系二次电池电极用粘结剂组合物
JP6347657B2 (ja) * 2014-04-22 2018-06-27 デクセリアルズ株式会社 保護テープ、及びこれを用いた半導体装置の製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007119884A1 (ja) * 2006-04-14 2007-10-25 Otsuka Chemical Co., Ltd. 樹脂組成物および耐熱性粘着剤
WO2009037990A1 (ja) 2007-09-21 2009-03-26 Sekisui Chemical Co., Ltd. 粘着剤及びこれを用いた表面保護粘着シート
JP2011074380A (ja) * 2009-09-07 2011-04-14 Lintec Corp 保護フィルム及び保護フィルムの製造方法
WO2012036209A1 (ja) * 2010-09-16 2012-03-22 積水化学工業株式会社 粘着剤組成物、粘着テープ、及び、ウエハの処理方法
JP2013077435A (ja) 2011-09-30 2013-04-25 Oji Holdings Corp 導電性転写シートおよび導電性積層体
JP2016141749A (ja) * 2015-02-03 2016-08-08 リンテック株式会社 保護膜形成用シート、及び保護膜形成用複合シート

Also Published As

Publication number Publication date
WO2019044623A1 (ja) 2019-03-07
TWI797152B (zh) 2023-04-01
TW201917189A (zh) 2019-05-01
KR20200044722A (ko) 2020-04-29
JP7181087B2 (ja) 2022-11-30
JPWO2019044623A1 (ja) 2020-08-13
CN110719944A (zh) 2020-01-21

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