CN110719944A - 粘合剂组合物、粘合带和半导体设备的保护方法 - Google Patents

粘合剂组合物、粘合带和半导体设备的保护方法 Download PDF

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Publication number
CN110719944A
CN110719944A CN201880037160.XA CN201880037160A CN110719944A CN 110719944 A CN110719944 A CN 110719944A CN 201880037160 A CN201880037160 A CN 201880037160A CN 110719944 A CN110719944 A CN 110719944A
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CN
China
Prior art keywords
adhesive
adhesive composition
pressure
semiconductor device
polymer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201880037160.XA
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English (en)
Chinese (zh)
Inventor
利根川亨
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sekisui Chemical Co Ltd
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Sekisui Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Publication of CN110719944A publication Critical patent/CN110719944A/zh
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
CN201880037160.XA 2017-08-29 2018-08-22 粘合剂组合物、粘合带和半导体设备的保护方法 Pending CN110719944A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2017-164630 2017-08-29
JP2017164630 2017-08-29
PCT/JP2018/030981 WO2019044623A1 (ja) 2017-08-29 2018-08-22 粘着剤組成物、粘着テープ及び半導体デバイスの保護方法

Publications (1)

Publication Number Publication Date
CN110719944A true CN110719944A (zh) 2020-01-21

Family

ID=65526426

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201880037160.XA Pending CN110719944A (zh) 2017-08-29 2018-08-22 粘合剂组合物、粘合带和半导体设备的保护方法

Country Status (5)

Country Link
JP (1) JP7181087B2 (ja)
KR (1) KR102576890B1 (ja)
CN (1) CN110719944A (ja)
TW (1) TWI797152B (ja)
WO (1) WO2019044623A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023053912A1 (ja) * 2021-09-30 2023-04-06 日東電工株式会社 積層体、光学部材、及び光学装置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200914563A (en) * 2007-09-21 2009-04-01 Sekisui Chemical Co Ltd Pressure sensitive adhesive and pressure sensitive adhesive sheet for surface protection using the same
CN101421312A (zh) * 2006-04-14 2009-04-29 大塚化学株式会社 树脂组合物和耐热性压敏粘合剂
CN102439769A (zh) * 2009-04-03 2012-05-02 东洋油墨Sc控股株式会社 非水系二次电池电极用粘结剂组合物
CN103097485A (zh) * 2010-09-16 2013-05-08 积水化学工业株式会社 粘合剂组合物、粘合带、以及晶片的处理方法
CN105339450A (zh) * 2014-04-22 2016-02-17 迪睿合株式会社 保护带及使用该保护带的半导体装置的制造方法
JP2016141749A (ja) * 2015-02-03 2016-08-08 リンテック株式会社 保護膜形成用シート、及び保護膜形成用複合シート

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU637208B2 (en) * 1990-04-20 1993-05-20 Minnesota Mining And Manufacturing Company Low voltage electron beam radiation cured elastomer-based pressure sensitive adhesive tape
JP2601956B2 (ja) 1991-07-31 1997-04-23 リンテック株式会社 再剥離型粘着性ポリマー
JP2007314584A (ja) * 2006-05-23 2007-12-06 Sekisui Chem Co Ltd 粘着テープ
JP5627961B2 (ja) * 2009-09-07 2014-11-19 リンテック株式会社 保護フィルム及び保護フィルムの製造方法
JP2013077435A (ja) * 2011-09-30 2013-04-25 Oji Holdings Corp 導電性転写シートおよび導電性積層体

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101421312A (zh) * 2006-04-14 2009-04-29 大塚化学株式会社 树脂组合物和耐热性压敏粘合剂
TW200914563A (en) * 2007-09-21 2009-04-01 Sekisui Chemical Co Ltd Pressure sensitive adhesive and pressure sensitive adhesive sheet for surface protection using the same
CN102439769A (zh) * 2009-04-03 2012-05-02 东洋油墨Sc控股株式会社 非水系二次电池电极用粘结剂组合物
CN103097485A (zh) * 2010-09-16 2013-05-08 积水化学工业株式会社 粘合剂组合物、粘合带、以及晶片的处理方法
CN105339450A (zh) * 2014-04-22 2016-02-17 迪睿合株式会社 保护带及使用该保护带的半导体装置的制造方法
JP2016141749A (ja) * 2015-02-03 2016-08-08 リンテック株式会社 保護膜形成用シート、及び保護膜形成用複合シート

Also Published As

Publication number Publication date
WO2019044623A1 (ja) 2019-03-07
TWI797152B (zh) 2023-04-01
TW201917189A (zh) 2019-05-01
KR20200044722A (ko) 2020-04-29
JP7181087B2 (ja) 2022-11-30
JPWO2019044623A1 (ja) 2020-08-13
KR102576890B1 (ko) 2023-09-08

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Application publication date: 20200121