KR102052799B1 - 기판 처리 장치 및 기판 처리 방법 - Google Patents

기판 처리 장치 및 기판 처리 방법 Download PDF

Info

Publication number
KR102052799B1
KR102052799B1 KR1020170159538A KR20170159538A KR102052799B1 KR 102052799 B1 KR102052799 B1 KR 102052799B1 KR 1020170159538 A KR1020170159538 A KR 1020170159538A KR 20170159538 A KR20170159538 A KR 20170159538A KR 102052799 B1 KR102052799 B1 KR 102052799B1
Authority
KR
South Korea
Prior art keywords
substrate
pattern formation
formation surface
liquid
board
Prior art date
Application number
KR1020170159538A
Other languages
English (en)
Korean (ko)
Other versions
KR20180075380A (ko
Inventor
유타 사사키
요스케 하나와
Original Assignee
가부시키가이샤 스크린 홀딩스
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 스크린 홀딩스 filed Critical 가부시키가이샤 스크린 홀딩스
Publication of KR20180075380A publication Critical patent/KR20180075380A/ko
Application granted granted Critical
Publication of KR102052799B1 publication Critical patent/KR102052799B1/ko

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
KR1020170159538A 2016-12-26 2017-11-27 기판 처리 장치 및 기판 처리 방법 KR102052799B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2016250700 2016-12-26
JPJP-P-2016-250700 2016-12-26
JP2017204294A JP7001423B2 (ja) 2016-12-26 2017-10-23 基板処理装置及び基板処理方法
JPJP-P-2017-204294 2017-10-23

Publications (2)

Publication Number Publication Date
KR20180075380A KR20180075380A (ko) 2018-07-04
KR102052799B1 true KR102052799B1 (ko) 2019-12-05

Family

ID=62785872

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020170159538A KR102052799B1 (ko) 2016-12-26 2017-11-27 기판 처리 장치 및 기판 처리 방법

Country Status (3)

Country Link
JP (1) JP7001423B2 (zh)
KR (1) KR102052799B1 (zh)
TW (1) TWI651295B (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7232583B2 (ja) * 2018-07-25 2023-03-03 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
WO2020039835A1 (ja) * 2018-08-24 2020-02-27 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
JP7300272B2 (ja) * 2018-08-24 2023-06-29 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
JP7122911B2 (ja) * 2018-08-31 2022-08-22 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
JP7163248B2 (ja) * 2019-05-29 2022-10-31 株式会社Ｓｃｒｅｅｎホールディングス 昇華性物質含有液の製造方法、基板乾燥方法、および基板処理装置
TWI756719B (zh) 2019-06-28 2022-03-01 日商斯庫林集團股份有限公司 基板處理液
JP2023020501A (ja) * 2021-07-30 2023-02-09 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法及び基板処理装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005223184A (ja) * 2004-02-06 2005-08-18 Nippon Zeon Co Ltd 洗浄液及びその利用
JP2015050414A (ja) * 2013-09-04 2015-03-16 株式会社Ｓｃｒｅｅｎホールディングス 基板乾燥装置
JP2015142069A (ja) * 2014-01-30 2015-08-03 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
WO2015189697A1 (en) * 2014-06-11 2015-12-17 The Chemours Company Fc, Llc Displacement liquid for semiconductor circuit pattern drying, and drying method

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006041065A (ja) * 2004-07-26 2006-02-09 Nippon Zeon Co Ltd 固体噴霧洗浄方法
JP5647845B2 (ja) * 2010-09-29 2015-01-07 株式会社Ｓｃｒｅｅｎホールディングス 基板乾燥装置及び基板乾燥方法
US9673037B2 (en) * 2011-05-31 2017-06-06 Law Research Corporation Substrate freeze dry apparatus and method
JP2013042094A (ja) * 2011-08-19 2013-02-28 Central Glass Co Ltd ウェハの洗浄方法
JP2016025233A (ja) * 2014-07-22 2016-02-08 株式会社東芝 基板処理装置、及び基板処理方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005223184A (ja) * 2004-02-06 2005-08-18 Nippon Zeon Co Ltd 洗浄液及びその利用
JP2015050414A (ja) * 2013-09-04 2015-03-16 株式会社Ｓｃｒｅｅｎホールディングス 基板乾燥装置
JP2015142069A (ja) * 2014-01-30 2015-08-03 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
WO2015189697A1 (en) * 2014-06-11 2015-12-17 The Chemours Company Fc, Llc Displacement liquid for semiconductor circuit pattern drying, and drying method

Also Published As

Publication number Publication date
TWI651295B (zh) 2019-02-21
KR20180075380A (ko) 2018-07-04
JP2018107426A (ja) 2018-07-05
TW201825447A (zh) 2018-07-16
JP7001423B2 (ja) 2022-01-19

Similar Documents

Publication Publication Date Title
KR102052799B1 (ko) 기판 처리 장치 및 기판 처리 방법
KR102008566B1 (ko) 기판 처리 장치 및 기판 처리 방법
JP6780998B2 (ja) 基板処理装置及び基板処理方法
KR102048154B1 (ko) 기판 처리 방법, 기판 처리액 및 기판 처리 장치
JP7030440B2 (ja) 基板処理方法、基板処理液及び基板処理装置
KR102048152B1 (ko) 기판 처리 방법 및 기판 처리 장치
JP7018792B2 (ja) 基板処理方法及び基板処理装置
US10720342B2 (en) Substrate treating apparatus and substrate treating method
KR102216497B1 (ko) 기판 처리 방법 및 기판 처리 장치
JP6898073B2 (ja) 基板処理装置及び基板処理方法
KR102387875B1 (ko) 기판 처리 방법, 기판 처리액 및 기판 처리 장치
TWI645030B (zh) Substrate processing apparatus and substrate processing method
JP2024047257A (ja) 基板処理方法、基板処理装置及び基板処理液
TW202313950A (zh) 基板乾燥用處理液及基板乾燥方法

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right