KR101757932B1 - 웨이퍼 반송 기구 - Google Patents

웨이퍼 반송 기구 Download PDF

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Publication number
KR101757932B1
KR101757932B1 KR1020110102716A KR20110102716A KR101757932B1 KR 101757932 B1 KR101757932 B1 KR 101757932B1 KR 1020110102716 A KR1020110102716 A KR 1020110102716A KR 20110102716 A KR20110102716 A KR 20110102716A KR 101757932 B1 KR101757932 B1 KR 101757932B1
Authority
KR
South Korea
Prior art keywords
wafer
grinding
holding
suction
pad
Prior art date
Application number
KR1020110102716A
Other languages
English (en)
Korean (ko)
Other versions
KR20120040104A (ko
Inventor
야스타카 미조모토
Original Assignee
가부시기가이샤 디스코
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시기가이샤 디스코 filed Critical 가부시기가이샤 디스코
Publication of KR20120040104A publication Critical patent/KR20120040104A/ko
Application granted granted Critical
Publication of KR101757932B1 publication Critical patent/KR101757932B1/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
    • B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
    • B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
    • B25J15/0683—Details of suction cup structure, e.g. grooves or ridges
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

Landscapes

  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
KR1020110102716A 2010-10-18 2011-10-07 웨이퍼 반송 기구 KR101757932B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2010-233938 2010-10-18
JP2010233938A JP5669518B2 (ja) 2010-10-18 2010-10-18 ウエーハ搬送機構

Publications (2)

Publication Number Publication Date
KR20120040104A KR20120040104A (ko) 2012-04-26
KR101757932B1 true KR101757932B1 (ko) 2017-07-13

Family

ID=46039631

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020110102716A KR101757932B1 (ko) 2010-10-18 2011-10-07 웨이퍼 반송 기구

Country Status (4)

Country Link
JP (1) JP5669518B2 (zh)
KR (1) KR101757932B1 (zh)
CN (1) CN102456600B (zh)
TW (1) TWI534932B (zh)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5999972B2 (ja) * 2012-05-10 2016-09-28 株式会社ディスコ 保持テーブル
JP5989501B2 (ja) * 2012-10-22 2016-09-07 株式会社ディスコ 搬送方法
JP2014110270A (ja) * 2012-11-30 2014-06-12 Disco Abrasive Syst Ltd 洗浄装置
JP6335672B2 (ja) * 2014-06-17 2018-05-30 株式会社ディスコ 搬送装置
JP7320940B2 (ja) * 2018-12-17 2023-08-04 株式会社東京精密 ウェハ保持装置及びウェハ搬送保持装置
JP7159898B2 (ja) * 2019-02-14 2022-10-25 株式会社Sumco ウェーハ回収装置、研磨システム、および、ウェーハ回収方法
JP7358096B2 (ja) * 2019-07-11 2023-10-10 株式会社ディスコ ウエーハ搬送機構および研削装置
KR20210084058A (ko) 2019-12-27 2021-07-07 삼성전자주식회사 기판 이송 장치 및 이를 이용한 기판 이송 시스템

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007258206A (ja) * 2006-03-20 2007-10-04 Disco Abrasive Syst Ltd ウエーハの保持パッド

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3082603B2 (ja) * 1994-11-22 2000-08-28 住友金属工業株式会社 ウエハ搬送装置
JP2000106390A (ja) * 1998-09-29 2000-04-11 Disco Abrasive Syst Ltd ウェーハ搬送装置
JP2009252877A (ja) * 2008-04-03 2009-10-29 Disco Abrasive Syst Ltd ウエーハの搬送方法および搬送装置
JP5179928B2 (ja) * 2008-04-11 2013-04-10 株式会社ディスコ ウエーハの搬出方法
JP5137747B2 (ja) * 2008-08-28 2013-02-06 株式会社ディスコ ワーク保持機構
JP5318536B2 (ja) * 2008-11-10 2013-10-16 株式会社ディスコ 研削装置
JP5350818B2 (ja) * 2009-01-27 2013-11-27 株式会社ディスコ 研削装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007258206A (ja) * 2006-03-20 2007-10-04 Disco Abrasive Syst Ltd ウエーハの保持パッド

Also Published As

Publication number Publication date
TW201222705A (en) 2012-06-01
JP2012089627A (ja) 2012-05-10
JP5669518B2 (ja) 2015-02-12
CN102456600A (zh) 2012-05-16
CN102456600B (zh) 2016-08-17
KR20120040104A (ko) 2012-04-26
TWI534932B (zh) 2016-05-21

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