TW201222705A - Wafer transfer mechanism - Google Patents

Wafer transfer mechanism Download PDF

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Publication number
TW201222705A
TW201222705A TW100133630A TW100133630A TW201222705A TW 201222705 A TW201222705 A TW 201222705A TW 100133630 A TW100133630 A TW 100133630A TW 100133630 A TW100133630 A TW 100133630A TW 201222705 A TW201222705 A TW 201222705A
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TW
Taiwan
Prior art keywords
wafer
holding
transfer mechanism
polishing
wafer transfer
Prior art date
Application number
TW100133630A
Other languages
Chinese (zh)
Other versions
TWI534932B (en
Inventor
Yasutaka Mizomoto
Original Assignee
Disco Corp
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Application filed by Disco Corp filed Critical Disco Corp
Publication of TW201222705A publication Critical patent/TW201222705A/en
Application granted granted Critical
Publication of TWI534932B publication Critical patent/TWI534932B/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
    • B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
    • B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
    • B25J15/0683—Details of suction cup structure, e.g. grooves or ridges
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

Landscapes

  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

The present invention provides a wafer transfer mechanism capable of preventing stained dirt, such as polishing bits, from attaching to the polishing surface. The wafer transfer mechanism is provided to hold and transfer wafers, which is characterized in comprising an arm part and a holding pad supported on the front end of the arm part through an elastic supporting means for receiving and holding a wafer. The holding pad includes a ring-shape receiving and holding part for receiving and holding the periphery of the wafer; a recess part surrounded by the ring-shape receiving and holding part for defining a space with respect to the received and hold wafer; a liquid supply part for supplying liquid to the recess part; and an exhausting part formed on the ring-shape receiving and holding part for exhausting liquid from the recess part.

Description

201222705 六、發明說明： 【韻' 明戶斤屬之_技_彳椅領域^ 發明領域 本發明係有關一種保持半導體晶圓等之晶圓且將其搬 送之晶圓搬送機構。 t ί 發明背景 在半導體裝置製程中，半導體晶圓之表面在藉由被稱 為切割線之複數分割預定線而劃分的各領域形成有半導體 裝置。半導體晶圓藉由研磨裝置研磨裏面而加工成預定厚 度之後，藉由切割裝置沿著切割線切削藉以分割成各個裝 置，以製造1C、LSI等半導體裝置。 研磨裝置係大概由保持晶圓之夾頭台、研磨保持於爽 頭台之晶圓的研磨機構、從失頭台搬出研磨後晶圓之晶圓 搬送機構、清洗搬出後之晶圓的研磨面之旋轉清洗單元所 形成’可將晶圓加工到所希望的厚度（例如參照特開 2003-300155號公報）。 研磨晶圓裏面之研磨裝置將晶圓研磨的較薄且要求研 磨後晶圓之研磨面不附著微細的研磨屑。又，以研磨裝置 研磨晶圓的裏面’之後，有晶圓的裏面形成次裝置(再配線 層）的情況’在如此之情況必須使附著於晶圓裏面之研磨屑 等之沾汙低於基準值。 以往，一般來說，將研磨完之晶圓從夾頭台搬出之際， 利用安裝於可旋動臂之前端的真空吸引式吸附墊來吸引晶 201222705 圓，並從夾頭台搬送到清洗單元。 【先行技術文獻】 【專利文獻】 【專利文獻1】特開2003-300155號公報 C 明内】 發明概要 但是，在使用吸附墊之晶圓搬送裝置中，剛研磨後之 晶圓為了清洗研磨面而搬送至清洗單元，然而有著所謂起 因於晶圓搬送機構之吸附墊的吸引，且晶圓之裏面乾燥， 超過基準值之沾汙附著於晶圓的裏面，即使以清洗單元清 洗也無法去除研磨屑等沾汙的困難之問題。 本發明係鑑於如此之點而完成者，其目的在於提供一 種不/于染研磨後之晶圓的研磨面且研㈣不附著於研磨面 之晶圓搬送機構。 【用以解決課題之手段】 依據本發明，提供一種晶圓搬送機構，係保持並搬送 晶圓者，其特徵在於具備有：臂部；及保持墊，係透過彈 性支持手段支持於該臂部之前端，並則保持晶圓者，該 保持塾包含有吸引保持晶圓之外周的環狀吸引保持部、被 該環狀吸㈣持部圍繞且在與被吸5丨保持之晶圓之間形成 空間的凹部、將㈣供給職凹部之㈣供給部、及自該 凹部排出液體且形成於該環狀吸引保持部之排出部。 【發明之效果] 依據本發明之晶圓搬送機構，由於 田於利用環狀之吸引保 201222705 持部保持研磨後之晶圓的外周部，因此，接觸於晶圓研磨 面的部分較少之外，由於一面經常以水之層填滿晶圓研磨 面，一面從夾頭台搬送晶圓到清洗單元，所以研磨面不乾 燥，而可防止超過基準值之沾汙附著。 圖式簡單說明 第1圖係半導體晶圓之表面側立體圖。 第2圖係表面貼附保護膠帶狀態之半導體晶圓的裏面 側立體圖。 第3圖係具備本發明之晶圓搬送機構之研磨裝置的立 體圖。 第4圖係本發明實施形態之晶圓搬送機構的立體圖。 第5圖係晶圓搬送機構之主要部分斷面圖。 第6圖係保持墊之裏面側立體圖。 第7圖係顯示水從排出部排出之狀態的保持墊部分之 立體圖。 I：實施方式3 較佳實施例之詳細說明 以下，一面參照圖示一面詳細說明本發明實施形態之 晶圓搬送機構。第1圖係加工至預定厚度前之半導體晶圓11 的立體圖。第1圖所示之半導體晶圓11例如係由厚度為700 μ m之矽晶圓11構成，且於表面11a複數切割線（分割預定 線）13形成格子狀，並且藉由該複數切割線13所劃分之複數 領域形成有1C、LSI等裝置15。 如此構成之半導體晶圓11係具有形成有裝置15之裝置201222705 VI. Description of the Invention: The present invention relates to a wafer transfer mechanism for holding and transporting a wafer of a semiconductor wafer or the like. BACKGROUND OF THE INVENTION In the semiconductor device process, a surface of a semiconductor wafer is formed with semiconductor devices in various fields divided by a plurality of predetermined dividing lines called cut lines. The semiconductor wafer is processed into a predetermined thickness by polishing the inside of the wafer, and then cut into individual devices by cutting along the dicing line to manufacture a semiconductor device such as 1C or LSI. The polishing apparatus is mainly a polishing apparatus that holds a wafer chuck, a polishing mechanism that polishes and holds the wafer on the cool stage, a wafer transfer mechanism that removes the polished wafer from the lost stage, and a polished surface of the wafer after cleaning and carrying out The rotary cleaning unit is formed to process the wafer to a desired thickness (for example, see JP-A-2003-300155). The polishing device inside the wafer is used to polish the wafer and the abrasive surface of the wafer to be polished does not adhere to fine abrasive particles. In addition, when the inside of the wafer is polished by the polishing device, the secondary device (rewiring layer) is formed in the inside of the wafer. In such a case, it is necessary to make the contamination of the polishing chips attached to the wafer less than the reference. value. Conventionally, when the polished wafer is carried out from the chuck table, a vacuum suction type adsorption pad attached to the front end of the rotatable arm is used to attract the 201222705 circle and is transported from the chuck table to the cleaning unit. [Patent Document] [Patent Document 1] Japanese Laid-Open Patent Publication No. 2003-300155 (Expression of the Invention) However, in the wafer transfer apparatus using the adsorption pad, the wafer immediately after polishing is used to clean the polished surface. However, it is transported to the cleaning unit. However, there is a so-called suction due to the adsorption pad of the wafer transfer mechanism, and the inside of the wafer is dried. The contamination exceeding the reference value adheres to the inside of the wafer, and the polishing cannot be removed even if it is cleaned by the cleaning unit. Difficulties in contamination such as shavings. The present invention has been made in view of such circumstances, and an object thereof is to provide a wafer transfer mechanism that does not adhere to a polished surface of a polished wafer and that does not adhere to the polished surface. [Means for Solving the Problem] According to the present invention, a wafer transfer mechanism for holding and transporting a wafer is provided, comprising: an arm portion; and a holding pad supported by the elastic support means to the arm portion At the front end, and maintaining the wafer, the holding 塾 includes an annular suction holding portion that attracts the outer circumference of the wafer, is surrounded by the annular suction (four) holding portion, and is between the wafer held by the suctioned 丨The concave portion forming the space, the (four) supply portion for supplying the fourth recess portion, and the discharge portion for discharging the liquid from the concave portion and formed in the annular suction holding portion. [Effects of the Invention] According to the wafer transfer mechanism of the present invention, since the outer peripheral portion of the wafer after polishing is held by the loop-shaped suction holding portion 201222705, the portion that is in contact with the wafer polishing surface is small. Since the wafer polishing surface is often filled with a layer of water and the wafer is transferred from the chuck table to the cleaning unit, the polishing surface is not dried, and contamination adhering beyond the reference value can be prevented. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view of a surface side of a semiconductor wafer. Fig. 2 is a perspective view of the inside of a semiconductor wafer to which a surface of a protective tape is attached. Fig. 3 is a perspective view of a polishing apparatus including the wafer transfer mechanism of the present invention. Fig. 4 is a perspective view showing a wafer transfer mechanism according to an embodiment of the present invention. Fig. 5 is a cross-sectional view showing the main part of the wafer transfer mechanism. Figure 6 is a perspective view of the inside side of the retaining pad. Fig. 7 is a perspective view showing a portion of the holding mat in a state where water is discharged from the discharge portion. I. EMBODIMENT 3 DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a wafer transfer mechanism according to an embodiment of the present invention will be described in detail with reference to the drawings. Fig. 1 is a perspective view of the semiconductor wafer 11 before being processed to a predetermined thickness. The semiconductor wafer 11 shown in FIG. 1 is formed, for example, of a silicon wafer 11 having a thickness of 700 μm, and is formed in a lattice shape on a plurality of cutting lines (divided lines) 13 on the surface 11a, and by the plurality of cutting lines 13 The device 15 such as 1C or LSI is formed in the divided plural field. The semiconductor wafer 11 thus constructed has a device in which the device 15 is formed

S 5 201222705 領域17、及圍繞裝置領域17之外周剩餘領域19。又，半導 體SB圓17之外周形成有作為顯示石夕晶圓之結晶方位之標示 的切口 21。 在研磨半導體晶圓1丨裏面llb前，半導體晶圓U表面 11a藉由保護膠帶貼附步驟而貼附有保護膠帶23。因此，半 導體晶圓11表面lla藉由保護膠帶23保護，而如第2圖所示 般成為裏面露出的形態。也可使用具剛性之玻璃等保護構 件替代保護膠帶23。 其次，參照第3圖，就有關採用本發明實施形態之晶圓 搬送機構的研磨襄置進行說明。4是研磨裝置2之基座，基 座的後方垂直地g立設置有二個柱部&、仙。柱部&固定 有於上下方向延伸之一對導轨（只圖示一根)8。 / 口著該對導軌8於上下方向可移動地裝設有粗研磨 單凡10。粗研磨單^1()安裝在其殼體如會沿著一對導細而 於上下方向移動之移動基台12上。 粗研磨單元10包含有殼體、可旋轉地收容於殼體20 未圖不的、軸、旋轉驅動心轴之飼服馬違22、及具有 固定於心軸㈣之複數粗研磨用之研祕以的研磨輪 24 ° 粗研磨早元1〇具有由沿著一對導轨S將粗研磨單元 t上下方向移動之滾珠螺桿14與脈衝馬達16構成之粗研磨 :凡移動機構18。脈衝驅動脈衝馬達“時，滾珠螺柄旋 轉’移動基台12沿上下方向移動。 之一對導轨（僅 另一柱部补也固定有朝上下方向延伸 201222705 圖示根）19。沿著該一對導執19裝設有可朝上下方向移動 的修整研磨單元28。 修整研磨單元28係安裝於其殼體36會沿著一對導軌19 而朝上下方向移動之未圖示的移動基台。修整研磨單元28 包含有殼體36、可旋轉地收容於殼體36中之未圖示的心 轴、狄轉驅動^^之伺服馬達38、及具有©定於心軸前端 之修整研磨用的研磨紙石Μ之研磨輪4〇。 修整研磨單元2 8具有由沿著一對導軌19將修整研磨單 元28於上下方向移動之滾珠螺桿30與脈衝馬達32構成之修 整所磨單元移動機構34。驅動脈衝馬達32時，滾珠螺桿3〇 旋轉，修整研磨單元28沿上下方向移動。 研磨裝置2具備有於柱部6a、6b側配設成與基座4之上 面大略呈無¥又差的轉動台44。轉動台44形成比較上大直徑 的圓盤狀’且藉由未圖示之旋轉驅動機構而朝箭頭45所示 方向旋轉。 3個相互地於圓周方向離開1200的夾頭台46係在水平 面内可奴轉地配置於轉動台44上。夾頭台46具有藉由多孔 陶瓷材而形成圓盤狀之吸附部，並藉由作動真空吸引手段 而吸引保持載置在吸附部之保持面上的晶圓。 配設於轉動台44之3個夾頭台46藉由適宜旋轉轉動台 44，而依序移動到晶圓搬入搬出領域a、粗研磨加工領域 B、修整研磨加工領域C及晶圓搬入搬出領域a。 基座4之前側部分配設有第！晶圓匣5 〇、第2晶圓匣6 6、 具有連桿機構51及手部52之晶圓搬送機器人54、具有複數 201222705 疋位銷58之定位台56、晶圓搬入機構(加载臂）6〇、晶圓搬出 機構(卸載臂）62及旋轉清洗單元64。 旋轉清洗單元6 4具有吸引保持並旋轉晶圓之旋轉台 68。70係旋轉清洗單元64之外罩。晶圓搬出機構62構成本 發明實施形態之晶圓搬送機構。 研磨後之晶圓11為了清洗研磨面而搬送至旋轉清洗單 元64 ’然而利用吸附墊吸附晶圓之研磨面而搬送時，由於 吸附塾接觸晶圓之研磨面而擔心會汙染研磨面。 再者，晶圓搬送時會發生所謂起因於吸附墊的吸引且 晶圓之裏面乾燥，研磨屑固著於晶圓之研磨面，即使在旋 轉清洗單元64清洗也不會掉落的問題。參照第4圖至第7圖 詳細說明解決該問題之本發明實施形態之晶圓搬送機構 62 ° 晶圓搬送機構62如第4圖所示，包含有可朝上下方向移 動之柱部72、可旋動地裝設於柱部72之前端部的臂部74、 及安裝於臂部74之前端部的保持墊(吸附墊)76。 如第5圖所示，臂部74之前端部形成有***孔乃，保持 塾76之支持部78***到該***孔75中，藉由在保持塾顺 臂部74之間夾設螺旋彈簧80 ’而使保持部76彈性地支持於 臂部74之前端。 、 如第6圖所最佳顯示般，保持塾76具有n及引保持晶圓^ 外周的環狀之吸引保持部82、及被環狀吸引保持独圍繞 且在與晶圓11之間形成空間的圓形凹部84。且，吸引保持 部82與圓形凹部84之階差h形成為丨〜2111111左右。 、' 201222705 環狀之吸引保持部82上形成有複數吸引孔86，如第5圖 所示，該等吸引孔86透過環狀吸引路88及吸引口 90而連接 於吸引源92。環狀之吸引保持部82上更形成有複數(本實施 形態為4個）排出部94。 圓形凹部84形成有將水供給到圓形凹部84之複數（本 實施形態為4個）供給孔96，該等供給孔96透過配設於保持 墊76表面之可撓性配管98，如第5圖所示，而連接於水源 100。 以下，就有關如上述構成之本發明實施形態之晶圓搬 送機構(晶圓搬出機構)62的作用，進行說明。粗研磨單元10 所產生之粗研磨及修整研磨單元28所產生之修整研磨完成 後之晶圓U係旋轉轉動台44而固定位置於晶圓搬入搬 域A。 其次，旋動晶圓搬送機構之臂部74，而使保持塾則 定位置於保持在夾頭台46的晶圓11之上，並使㈣72下降 而使保持墊76抵接於晶圓u的裏面(研磨面)iib。 ㈣、_台46的吸引保持之後，以 環狀吸引保持部82吸引保持練1之外周部。因此，曰圓 ：；：：：^ 曰曰圓在其外周部藉由保持墊76而被保持吸引。 内：二於二之供給孔%供給到圓形凹部84 ^011之_凹糊財填滿，如第7圖所 ^排水⑽從形成於環狀之則丨保持部_排出部94排S 5 201222705 Field 17, and the remaining area 19 around the peripheral field of the device field 17. Further, a slit 21 as a mark indicating the crystal orientation of the Shih-ray wafer is formed on the outer circumference of the semiconductor body SB circle 17. The protective film tape 23 is attached to the semiconductor wafer U surface 11a by a protective tape attaching step before the semiconductor wafer 1 inside 11b is polished. Therefore, the surface 11a of the semiconductor wafer 11 is protected by the protective tape 23, and as shown in Fig. 2, the inside is exposed. It is also possible to replace the protective tape 23 with a protective member such as a rigid glass. Next, a polishing apparatus using a wafer transfer mechanism according to an embodiment of the present invention will be described with reference to Fig. 3. 4 is a base of the polishing apparatus 2, and two column portions & The column portion & is fixed with a pair of guide rails (only one shown) 8 extending in the vertical direction. / The pair of guide rails 8 are movably mounted in the up and down direction with a coarse grinding 10 . The rough grinding unit ^1() is mounted on the moving base 12 whose casing moves along the pair of guides in the up and down direction. The rough grinding unit 10 includes a housing, a housing that is rotatably accommodated in the housing 20, a shaft, a rotary drive spindle, and a plurality of coarse grinding tools that are fixed to the spindle (4). The grinding wheel 24° is roughly ground and has a coarse grinding of the ball screw 14 and the pulse motor 16 which move the coarse grinding unit t up and down along the pair of guide rails S: the moving mechanism 18. When the pulse drive pulse motor is "when the ball screw rotates", the moving base 12 moves in the up and down direction. One of the pair of guide rails (only the other column portion is fixed and fixed in the vertical direction 201222705 shows the root) 19 along the guide rail. The pair of guides 19 are provided with a dressing and polishing unit 28 that is movable in the vertical direction. The dressing and polishing unit 28 is attached to a moving base (not shown) in which the casing 36 moves in the vertical direction along the pair of guide rails 19. The dressing and polishing unit 28 includes a housing 36, a spindle (not shown) rotatably accommodated in the housing 36, a servo motor 38 that is driven by a slewing drive, and a dressing for fixing the spindle at the tip end of the spindle. The grinding wheel of the abrasive paper sarcophagus is 〇. The dressing and polishing unit 28 has a dressing unit moving mechanism 34 composed of a ball screw 30 and a pulse motor 32 that move the dressing and polishing unit 28 in the up and down direction along a pair of guide rails 19. When the pulse motor 32 is driven, the ball screw 3 is rotated, and the dressing and polishing unit 28 is moved in the vertical direction. The polishing device 2 is provided on the column portions 6a and 6b side so as to be substantially smaller than the upper surface of the susceptor 4. Turning table 44. Rotating 44 is formed in a disk shape of a relatively large diameter and is rotated in a direction indicated by an arrow 45 by a rotation driving mechanism (not shown). Three collet tables 46 that are mutually spaced apart from each other in the circumferential direction are in a horizontal plane. The grounding table is disposed on the rotating table 44. The chuck table 46 has a disk-shaped adsorption portion formed by a porous ceramic material, and sucks and holds the wafer placed on the holding surface of the adsorption portion by a vacuum suction means The three chuck stages 46 disposed on the rotating table 44 are sequentially moved to the wafer loading/unloading area a, the rough grinding processing area B, the finishing polishing processing field C, and the wafer loading and unloading by appropriately rotating the rotating table 44. Field a. The front side of the susceptor 4 is provided with a first wafer 匣5 〇, a second wafer 匣6 6 , a wafer transfer robot 54 having a link mechanism 51 and a hand 52, and a plurality of 201222705 销 pins A positioning table 56 of 58, a wafer loading mechanism (loading arm) 6A, a wafer unloading mechanism (unloading arm) 62, and a rotary cleaning unit 64. The rotary cleaning unit 64 has a rotary table 68 that sucks and holds the wafer. Rotating the cleaning unit 64 to cover the outer cover. The mechanism 62 constitutes a wafer transfer mechanism according to an embodiment of the present invention. The polished wafer 11 is transported to the rotary cleaning unit 64 for cleaning the polishing surface. However, when the polishing surface is adsorbed by the adsorption pad, the contact lens is adsorbed. In the case of a round polished surface, it is feared that the polished surface will be contaminated. Further, during the wafer transfer, the so-called suction due to the adsorption pad causes the inside of the wafer to be dried, and the polishing particles are fixed on the polished surface of the wafer even in the rotary cleaning unit. 64. The problem that the cleaning will not fall. The wafer transfer mechanism 62 of the embodiment of the present invention for solving the problem will be described in detail with reference to FIGS. 4 to 7. The wafer transfer mechanism 62 as shown in FIG. 4 includes The column portion 72 that moves in the vertical direction, the arm portion 74 that is rotatably attached to the end portion of the column portion 72, and the holding pad (adsorption pad) 76 that is attached to the front end portion of the arm portion 74. As shown in Fig. 5, the front end portion of the arm portion 74 is formed with an insertion hole into which the support portion 78 of the retaining jaw 76 is inserted, by interposing the coil spring 80 between the retaining arm portions 74. 'The retaining portion 76 is elastically supported at the front end of the arm portion 74. As best shown in FIG. 6, the holding cymbal 76 has n and an annular suction holding portion 82 for holding the outer periphery of the wafer, and is held by the annular suction to form a space around the wafer 11 Circular recess 84. Further, the step h of the suction holding portion 82 and the circular concave portion 84 is formed to be about 111 2111111. In 201222705, the plurality of suction holes 86 are formed in the annular suction holding portion 82. As shown in Fig. 5, the suction holes 86 are connected to the suction source 92 through the annular suction path 88 and the suction port 90. Further, in the annular suction holding portion 82, a plurality of (four in the present embodiment) discharge portions 94 are formed. The circular recessed portion 84 is formed with a plurality of (four in the present embodiment) supply holes 96 for supplying water to the circular recessed portion 84, and the supply holes 96 pass through the flexible piping 98 disposed on the surface of the holding mat 76, as described in 5 is connected to the water source 100. Hereinafter, the operation of the wafer transfer mechanism (wafer carry-out mechanism) 62 according to the embodiment of the present invention configured as described above will be described. The wafer U is rotated by the rough polishing and trimming polishing unit 28, and the wafer U is rotated by the rotary table 44 to be fixed at the wafer loading/removing area A. Next, the arm portion 74 of the wafer transfer mechanism is rotated, and the holding tab is placed on the wafer 11 held by the chuck table 46, and the (four) 72 is lowered to bring the holding pad 76 into contact with the inside of the wafer u. (grinding surface) iib. (4) After the suction of the table 46 is held, the annular suction holding portion 82 sucks and holds the outer peripheral portion of the training 1 . Therefore, the round circle :;:::^ The round circle is kept attracted at the outer peripheral portion by the holding pad 76. Inside: the supply hole % of the second to the second is supplied to the circular recess 84 ^ 011. The concave paste is filled, as shown in Fig. 7 . The drainage (10) is formed from the ring-shaped retaining portion_discharge portion 94.

9 S 201222705 在該狀態下’將柱部72朝預定距離上方移 頭台46使晶圓U上升，再萨 從夾 錯由％動U74而在以保持墊％ 吸引保持晶圓11的狀態下搬送晶_直到旋轉清洗單元64 之旋轉台68’且解除保持墊76之環狀吸引保持和的吸引。 在旋轉清洗單元64巾，利錢射68吸引保持晶圓 11，一面將旋轉台68旋轉—面清洗晶圓11。晶圓U之清洗 完成時，利用旋轉清洗單元μ旋轉乾燥晶_之後，以晶 圓搬送機ϋ人54之手部52吸引保持晶圓u，將晶_收容 於第2晶圓匣62的預定處所。 依據上述實施形態之晶圓搬送機構62，由於一面利用 環狀之吸引保持部82保持研磨後之晶圓u的外周部一面進 行搬送，因此接觸於晶圓研磨面的部分較少之外，由於一 面在晶圓11之研磨面經常形成水之層一面進行搬送，因此 晶圓11之研磨面不會乾燥，且徹底防止研磨屑等所產生之 沾污的晶圓研磨面之汙染，而可從夾頭台46到清洗單元64 搬送晶圓。9 S 201222705 In this state, the column portion 72 is moved upward by a predetermined distance from the column portion 72 to raise the wafer U, and the carrier is transferred from the state in which the wafer 11 is held by the holding pad % by the movable U74. The crystal_untils the rotating table 68' of the cleaning unit 64 and releases the attraction of the annular suction holding of the holding pad 76. At the rotary cleaning unit 64, the profit shot 68 attracts the holding wafer 11, and the rotary table 68 is rotated to clean the wafer 11. When the cleaning of the wafer U is completed, the spin-drying crystal is rotated by the spin cleaning unit μ, and then the wafer u is sucked by the hand 52 of the wafer transferer 54 to hold the wafer u, and the crystal is stored in the second wafer cassette 62. Premises. According to the wafer transfer mechanism 62 of the above-described embodiment, the outer peripheral portion of the wafer u after polishing is held by the annular suction holding portion 82, so that the portion that is in contact with the wafer polishing surface is small, Since the polishing surface of the wafer 11 is often formed by transporting a layer of water, the polished surface of the wafer 11 is not dried, and the contamination of the polished surface of the wafer by the grinding debris or the like is completely prevented. The chuck table 46 to the cleaning unit 64 transports the wafer.

【圖式簡單説明：J 苐1圖係半導體晶圓之表面侧立體圖。 第2圖係表面貼附保護膠帶狀態之半導體晶圓的裏面 側立體圖。 第3圖係具備本發明之晶圓搬送機構之研磨裝置的立 體圖。 第4圖係本發明實施形態之晶圓搬送機構的立體圖。 第5圖係晶圓搬送機構之主要部分斷面圖。 10 201222705 第6圖係保持墊之裏面側立體圖。 第7圖係顯示水從排出部排出之狀態的保持墊部分之 立體圖。 【主要元件符號說明】 2...研磨裝置 23...保護膠帶 4...基座 24...研磨輪 6a...柱部 26...研磨紙石 6b...柱部 28...修整研磨單元 8…導軌 30...滾珠螺桿 10...粗研磨單元 32...脈衝馬達 11...半導體晶圓 34...修整研磨單元移動機構 11a...表面 36...殼體 lib...裏面 38...伺服馬達 12...移動基台 40...研磨輪 13...切割線 42…研磨砥石 14...滾珠螺桿 44...轉動台 15…裝置 45...箭頭 16...脈衝馬達 46...炎頭台 17...裝置領域 50...第1晶圓匣 18...粗研磨單元移動機構 51...連桿機構 19...外周剩餘領域 52...手部 20...殼體 54...晶圓搬送機器人 21...伺服馬達 56...定位台 22…伺服馬達 58...定位銷 S 11 201222705 60...晶圓搬入機構 86...吸引孔 62...晶圓搬送機構 88...吸引路 64...旋轉清洗單元 90...吸引口 66...第2晶圓匣 92...吸引源 68...旋轉台 94...排出部 70...外罩 96...供給孔 72...柱部 98...可撓性配管 74…臂部 100...水源 75...***孔 102...排水 76...保持部 A...搬出領域 78...支持部 B...粗研磨加工領域 80...螺旋彈簧 C...修整研磨加工領域 82...吸引保持部 84...凹部 12[Simple diagram: J 苐 1 is a surface side perspective view of a semiconductor wafer. Fig. 2 is a perspective view of the inside of a semiconductor wafer to which a surface of a protective tape is attached. Fig. 3 is a perspective view of a polishing apparatus including the wafer transfer mechanism of the present invention. Fig. 4 is a perspective view showing a wafer transfer mechanism according to an embodiment of the present invention. Fig. 5 is a cross-sectional view showing the main part of the wafer transfer mechanism. 10 201222705 Figure 6 is a perspective view of the inside side of the retaining pad. Fig. 7 is a perspective view showing a portion of the holding mat in a state where water is discharged from the discharge portion. [Description of main component symbols] 2: Grinding device 23: Protective tape 4: Base 24: Grinding wheel 6a: Column 26: Grinding paper 6b... Column 28 ...trimming grinding unit 8...rail 30...ball screw 10...coarse grinding unit 32...pulse motor 11...semiconductor wafer 34...trimming grinding unit moving mechanism 11a...surface 36 ...shell lib...inside 38...servo motor 12...moving base 40...grinding wheel 13...cutting line 42...grinding vermiculite 14...ball screw 44...rotating Table 15...device 45...arrow 16...pulse motor 46...flame head table 17...device area 50...first wafer cassette 18...coarse grinding unit moving mechanism 51... Linkage mechanism 19... outer peripheral remaining area 52... hand 20... housing 54... wafer transfer robot 21... servo motor 56... positioning stage 22... servo motor 58... Locating pin S 11 201222705 60... wafer loading mechanism 86... suction hole 62... wafer transfer mechanism 88... suction path 64... rotary cleaning unit 90... suction port 66... Second wafer cassette 92... suction source 68... rotary table 94... discharge unit 70... outer cover 96... supply hole 72... column portion 98...flexibility Piping 74...arm 100...water source 75...insertion hole 102...drain 76...holding unit A...loading area 78...supporting part B...rough grinding processing field 80.. .Curve spring C...shaping and grinding processing field 82...suction holding portion 84...recess 12

Claims (1)

201222705 七、申請專利範圍： 1. 一種晶圓搬送機構，係保持並搬送晶圓者，其特徵在於 具備有： 臂部；及 保持墊，係透過彈性支持手段支持於該臂部之前 端’並吸引保持晶圓者’ 該保持墊包含有吸引保持晶圓之外周的環狀吸引保 持部、被該環狀吸引保持部圍繞且在與被吸引保持之晶 圓之間形成空間的凹部、將液體供給到該凹部之液體供 給部、及自該凹部排出液體且形成於該環狀吸引保持部 之排出部。 S 13201222705 VII. Patent application scope: 1. A wafer transfer mechanism for holding and transporting a wafer, characterized in that: an arm portion; and a holding pad are supported by the elastic support means at the front end of the arm portion and The holding pad holder includes a ring-shaped suction holding portion that attracts the outer circumference of the wafer, a recess portion surrounded by the annular suction holding portion, and a space formed between the wafer to be held and held, and a liquid a liquid supply unit that is supplied to the recess, and a discharge unit that discharges the liquid from the recess and is formed in the annular suction holding unit. S 13
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