JP5669518B2 - ウエーハ搬送機構 - Google Patents

ウエーハ搬送機構 Download PDF

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Publication number
JP5669518B2
JP5669518B2 JP2010233938A JP2010233938A JP5669518B2 JP 5669518 B2 JP5669518 B2 JP 5669518B2 JP 2010233938 A JP2010233938 A JP 2010233938A JP 2010233938 A JP2010233938 A JP 2010233938A JP 5669518 B2 JP5669518 B2 JP 5669518B2
Authority
JP
Japan
Prior art keywords
wafer
holding
grinding
suction
pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2010233938A
Other languages
English (en)
Japanese (ja)
Other versions
JP2012089627A (ja
Inventor
溝本　康隆
康隆 溝本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Priority to JP2010233938A priority Critical patent/JP5669518B2/ja
Priority to TW100133630A priority patent/TWI534932B/zh
Priority to KR1020110102716A priority patent/KR101757932B1/ko
Priority to CN201110314510.2A priority patent/CN102456600B/zh
Publication of JP2012089627A publication Critical patent/JP2012089627A/ja
Application granted granted Critical
Publication of JP5669518B2 publication Critical patent/JP5669518B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
    • B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
    • B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
    • B25J15/0683—Details of suction cup structure, e.g. grooves or ridges
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

Landscapes

  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2010233938A 2010-10-18 2010-10-18 ウエーハ搬送機構 Active JP5669518B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2010233938A JP5669518B2 (ja) 2010-10-18 2010-10-18 ウエーハ搬送機構
TW100133630A TWI534932B (zh) 2010-10-18 2011-09-19 Wafer transfer mechanism
KR1020110102716A KR101757932B1 (ko) 2010-10-18 2011-10-07 웨이퍼 반송 기구
CN201110314510.2A CN102456600B (zh) 2010-10-18 2011-10-17 晶片搬送机构

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010233938A JP5669518B2 (ja) 2010-10-18 2010-10-18 ウエーハ搬送機構

Publications (2)

Publication Number Publication Date
JP2012089627A JP2012089627A (ja) 2012-05-10
JP5669518B2 true JP5669518B2 (ja) 2015-02-12

Family

ID=46039631

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010233938A Active JP5669518B2 (ja) 2010-10-18 2010-10-18 ウエーハ搬送機構

Country Status (4)

Country Link
JP (1) JP5669518B2 (zh)
KR (1) KR101757932B1 (zh)
CN (1) CN102456600B (zh)
TW (1) TWI534932B (zh)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5999972B2 (ja) * 2012-05-10 2016-09-28 株式会社ディスコ 保持テーブル
JP5989501B2 (ja) * 2012-10-22 2016-09-07 株式会社ディスコ 搬送方法
JP2014110270A (ja) * 2012-11-30 2014-06-12 Disco Abrasive Syst Ltd 洗浄装置
JP6335672B2 (ja) * 2014-06-17 2018-05-30 株式会社ディスコ 搬送装置
JP7320940B2 (ja) * 2018-12-17 2023-08-04 株式会社東京精密 ウェハ保持装置及びウェハ搬送保持装置
JP7159898B2 (ja) * 2019-02-14 2022-10-25 株式会社Sumco ウェーハ回収装置、研磨システム、および、ウェーハ回収方法
JP7358096B2 (ja) * 2019-07-11 2023-10-10 株式会社ディスコ ウエーハ搬送機構および研削装置
KR20210084058A (ko) 2019-12-27 2021-07-07 삼성전자주식회사 기판 이송 장치 및 이를 이용한 기판 이송 시스템

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3082603B2 (ja) * 1994-11-22 2000-08-28 住友金属工業株式会社 ウエハ搬送装置
JP2000106390A (ja) * 1998-09-29 2000-04-11 Disco Abrasive Syst Ltd ウェーハ搬送装置
JP4634949B2 (ja) * 2006-03-20 2011-02-16 株式会社ディスコ ウエーハの保持パッド
JP2009252877A (ja) * 2008-04-03 2009-10-29 Disco Abrasive Syst Ltd ウエーハの搬送方法および搬送装置
JP5179928B2 (ja) * 2008-04-11 2013-04-10 株式会社ディスコ ウエーハの搬出方法
JP5137747B2 (ja) * 2008-08-28 2013-02-06 株式会社ディスコ ワーク保持機構
JP5318536B2 (ja) * 2008-11-10 2013-10-16 株式会社ディスコ 研削装置
JP5350818B2 (ja) * 2009-01-27 2013-11-27 株式会社ディスコ 研削装置

Also Published As

Publication number Publication date
TW201222705A (en) 2012-06-01
JP2012089627A (ja) 2012-05-10
CN102456600A (zh) 2012-05-16
CN102456600B (zh) 2016-08-17
KR101757932B1 (ko) 2017-07-13
KR20120040104A (ko) 2012-04-26
TWI534932B (zh) 2016-05-21

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