KR101390088B1 - 도전성 재료의 제조 방법 및 도전성 재료 - Google Patents

도전성 재료의 제조 방법 및 도전성 재료 Download PDF

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Publication number
KR101390088B1
KR101390088B1 KR1020130027206A KR20130027206A KR101390088B1 KR 101390088 B1 KR101390088 B1 KR 101390088B1 KR 1020130027206 A KR1020130027206 A KR 1020130027206A KR 20130027206 A KR20130027206 A KR 20130027206A KR 101390088 B1 KR101390088 B1 KR 101390088B1
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KR
South Korea
Prior art keywords
silver
conductive material
pattern
layer
silver halide
Prior art date
Application number
KR1020130027206A
Other languages
English (en)
Korean (ko)
Other versions
KR20130105508A (ko
Inventor
요시오 시바타
다케노부 요시키
도모히데 스나가와
Original Assignee
미쓰비시 세이시 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 미쓰비시 세이시 가부시키가이샤 filed Critical 미쓰비시 세이시 가부시키가이샤
Publication of KR20130105508A publication Critical patent/KR20130105508A/ko
Application granted granted Critical
Publication of KR101390088B1 publication Critical patent/KR101390088B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/0036—Details
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/0026—Apparatus for manufacturing conducting or semi-conducting layers, e.g. deposition of metal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Human Computer Interaction (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Silver Salt Photography Or Processing Solution Therefor (AREA)
  • Non-Insulated Conductors (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Materials For Photolithography (AREA)
KR1020130027206A 2012-03-15 2013-03-14 도전성 재료의 제조 방법 및 도전성 재료 KR101390088B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2012-059254 2012-03-15
JP2012059254A JP6018389B2 (ja) 2012-03-15 2012-03-15 導電性材料の製造方法

Publications (2)

Publication Number Publication Date
KR20130105508A KR20130105508A (ko) 2013-09-25
KR101390088B1 true KR101390088B1 (ko) 2014-04-28

Family

ID=49136024

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020130027206A KR101390088B1 (ko) 2012-03-15 2013-03-14 도전성 재료의 제조 방법 및 도전성 재료

Country Status (4)

Country Link
JP (1) JP6018389B2 (ja)
KR (1) KR101390088B1 (ja)
CN (1) CN103310907B (ja)
TW (1) TW201345352A (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5858197B2 (ja) * 2013-10-16 2016-02-10 日立化成株式会社 導電性繊維を含む積層体、感光性導電フィルム、導電パターンの製造方法、導電パターン基板、及びタッチパネル

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007188655A (ja) 2006-01-11 2007-07-26 Mitsubishi Paper Mills Ltd 導電性材料の製造方法
KR20070111078A (ko) * 2006-05-16 2007-11-21 재단법인서울대학교산학협력재단 전자빔 조사를 이용한 나노 물질의 코팅방법
JP2008034366A (ja) 2006-06-27 2008-02-14 Mitsubishi Paper Mills Ltd 導電性材料およびその製造方法
JP2009188360A (ja) 2008-02-08 2009-08-20 Fujifilm Corp 電子回路およびその製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003295473A (ja) * 2002-03-29 2003-10-15 Mitsubishi Paper Mills Ltd 平版印刷版の処理方法
US20080029476A1 (en) * 2004-03-31 2008-02-07 Tadahiro Ohmi Circuit Board And Manufacturing Method Thereof
JP2007088218A (ja) * 2005-09-22 2007-04-05 Fujifilm Corp 透光性電磁波シールド膜の製造方法、該製造方法により得られた透光性電磁波シールド膜、ディスプレイパネル用フィルム、ディスプレイパネル用光学フィルター及びプラズマディスプレイパネル
JP5118824B2 (ja) * 2006-06-22 2013-01-16 三菱製紙株式会社 導電性発現方法
JP2009070708A (ja) * 2007-09-13 2009-04-02 Casio Comput Co Ltd 表示装置及び表示装置の製造方法
JP2009241303A (ja) * 2008-03-28 2009-10-22 Mitsubishi Paper Mills Ltd 平版印刷版の処理方法
JP5366502B2 (ja) * 2008-10-31 2013-12-11 富士フイルム株式会社 タッチパネル用導電膜及びその製造方法
JP2011210579A (ja) * 2010-03-30 2011-10-20 Mitsubishi Paper Mills Ltd 透明導電性フィルム

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007188655A (ja) 2006-01-11 2007-07-26 Mitsubishi Paper Mills Ltd 導電性材料の製造方法
KR20070111078A (ko) * 2006-05-16 2007-11-21 재단법인서울대학교산학협력재단 전자빔 조사를 이용한 나노 물질의 코팅방법
JP2008034366A (ja) 2006-06-27 2008-02-14 Mitsubishi Paper Mills Ltd 導電性材料およびその製造方法
JP2009188360A (ja) 2008-02-08 2009-08-20 Fujifilm Corp 電子回路およびその製造方法

Also Published As

Publication number Publication date
CN103310907B (zh) 2016-08-03
TW201345352A (zh) 2013-11-01
CN103310907A (zh) 2013-09-18
TWI561134B (ja) 2016-12-01
KR20130105508A (ko) 2013-09-25
JP6018389B2 (ja) 2016-11-02
JP2013196779A (ja) 2013-09-30

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