CN103310907B - 导电性材料的制造方法及导电性材料 - Google Patents

导电性材料的制造方法及导电性材料 Download PDF

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Publication number
CN103310907B
CN103310907B CN201310079062.1A CN201310079062A CN103310907B CN 103310907 B CN103310907 B CN 103310907B CN 201310079062 A CN201310079062 A CN 201310079062A CN 103310907 B CN103310907 B CN 103310907B
Authority
CN
China
Prior art keywords
conductive material
silver
pattern
silver halide
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201310079062.1A
Other languages
English (en)
Chinese (zh)
Other versions
CN103310907A (zh
Inventor
柴田吉夫
吉城武宣
砂川智英
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Paper Mills Ltd
Original Assignee
Mitsubishi Paper Mills Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Paper Mills Ltd filed Critical Mitsubishi Paper Mills Ltd
Publication of CN103310907A publication Critical patent/CN103310907A/zh
Application granted granted Critical
Publication of CN103310907B publication Critical patent/CN103310907B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/0036Details
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/0026Apparatus for manufacturing conducting or semi-conducting layers, e.g. deposition of metal
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073Shielding materials
    • H05K9/0081Electromagnetic shielding materials, e.g. EMI, RFI shielding

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Human Computer Interaction (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Silver Salt Photography Or Processing Solution Therefor (AREA)
  • Non-Insulated Conductors (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Materials For Photolithography (AREA)
CN201310079062.1A 2012-03-15 2013-03-13 导电性材料的制造方法及导电性材料 Expired - Fee Related CN103310907B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012059254A JP6018389B2 (ja) 2012-03-15 2012-03-15 導電性材料の製造方法
JP2012-059254 2012-03-15

Publications (2)

Publication Number Publication Date
CN103310907A CN103310907A (zh) 2013-09-18
CN103310907B true CN103310907B (zh) 2016-08-03

Family

ID=49136024

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201310079062.1A Expired - Fee Related CN103310907B (zh) 2012-03-15 2013-03-13 导电性材料的制造方法及导电性材料

Country Status (4)

Country Link
JP (1) JP6018389B2 (ja)
KR (1) KR101390088B1 (ja)
CN (1) CN103310907B (ja)
TW (1) TW201345352A (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5858197B2 (ja) * 2013-10-16 2016-02-10 日立化成株式会社 導電性繊維を含む積層体、感光性導電フィルム、導電パターンの製造方法、導電パターン基板、及びタッチパネル

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003295473A (ja) * 2002-03-29 2003-10-15 Mitsubishi Paper Mills Ltd 平版印刷版の処理方法
US20080029476A1 (en) * 2004-03-31 2008-02-07 Tadahiro Ohmi Circuit Board And Manufacturing Method Thereof
JP2007088218A (ja) * 2005-09-22 2007-04-05 Fujifilm Corp 透光性電磁波シールド膜の製造方法、該製造方法により得られた透光性電磁波シールド膜、ディスプレイパネル用フィルム、ディスプレイパネル用光学フィルター及びプラズマディスプレイパネル
JP5166697B2 (ja) 2006-01-11 2013-03-21 三菱製紙株式会社 導電性材料の製造方法
KR20070111078A (ko) * 2006-05-16 2007-11-21 재단법인서울대학교산학협력재단 전자빔 조사를 이용한 나노 물질의 코팅방법
JP5118824B2 (ja) * 2006-06-22 2013-01-16 三菱製紙株式会社 導電性発現方法
JP4943947B2 (ja) 2006-06-27 2012-05-30 三菱製紙株式会社 導電性材料およびその製造方法
JP2009070708A (ja) * 2007-09-13 2009-04-02 Casio Comput Co Ltd 表示装置及び表示装置の製造方法
JP2009188360A (ja) 2008-02-08 2009-08-20 Fujifilm Corp 電子回路およびその製造方法
JP2009241303A (ja) * 2008-03-28 2009-10-22 Mitsubishi Paper Mills Ltd 平版印刷版の処理方法
JP5366502B2 (ja) * 2008-10-31 2013-12-11 富士フイルム株式会社 タッチパネル用導電膜及びその製造方法
JP2011210579A (ja) * 2010-03-30 2011-10-20 Mitsubishi Paper Mills Ltd 透明導電性フィルム

Also Published As

Publication number Publication date
KR101390088B1 (ko) 2014-04-28
TW201345352A (zh) 2013-11-01
CN103310907A (zh) 2013-09-18
TWI561134B (ja) 2016-12-01
KR20130105508A (ko) 2013-09-25
JP6018389B2 (ja) 2016-11-02
JP2013196779A (ja) 2013-09-30

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GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20160803