KR101133162B1 - 캐리어박 부착 전해 동박, 캐리어박 부착 전해 동박의 제조 방법, 및 그 캐리어박 부착 전해 동박을 이용해 얻어지는 동박 적층판 - Google Patents
캐리어박 부착 전해 동박, 캐리어박 부착 전해 동박의 제조 방법, 및 그 캐리어박 부착 전해 동박을 이용해 얻어지는 동박 적층판 Download PDFInfo
- Publication number
- KR101133162B1 KR101133162B1 KR1020100026149A KR20100026149A KR101133162B1 KR 101133162 B1 KR101133162 B1 KR 101133162B1 KR 1020100026149 A KR1020100026149 A KR 1020100026149A KR 20100026149 A KR20100026149 A KR 20100026149A KR 101133162 B1 KR101133162 B1 KR 101133162B1
- Authority
- KR
- South Korea
- Prior art keywords
- copper foil
- electrolytic copper
- foil
- layer
- carrier foil
- Prior art date
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/043—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of metal
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/02—Physical, chemical or physicochemical properties
- B32B7/027—Thermal properties
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Electroplating Methods And Accessories (AREA)
- Laminated Bodies (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009072381A JP5379528B2 (ja) | 2009-03-24 | 2009-03-24 | キャリア箔付電解銅箔、キャリア箔付電解銅箔の製造方法及びそのキャリア箔付電解銅箔を用いて得られる銅張積層板 |
JPJP-P-2009-072381 | 2009-03-24 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20100106934A KR20100106934A (ko) | 2010-10-04 |
KR101133162B1 true KR101133162B1 (ko) | 2012-04-06 |
Family
ID=43040160
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020100026149A KR101133162B1 (ko) | 2009-03-24 | 2010-03-24 | 캐리어박 부착 전해 동박, 캐리어박 부착 전해 동박의 제조 방법, 및 그 캐리어박 부착 전해 동박을 이용해 얻어지는 동박 적층판 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP5379528B2 (ja) |
KR (1) | KR101133162B1 (ja) |
TW (1) | TWI452177B (ja) |
Families Citing this family (16)
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JP6219034B2 (ja) * | 2010-10-06 | 2017-10-25 | 古河電気工業株式会社 | 銅箔及びその製造方法、キャリア付き銅箔及びその製造方法、プリント配線板、多層プリント配線板 |
KR101510370B1 (ko) * | 2011-03-30 | 2015-04-07 | 미쓰이금속광업주식회사 | 다층 프린트 배선판의 제조 방법 |
MY163173A (en) * | 2011-03-30 | 2017-08-15 | Mitsui Mining & Smelting Co | Manufacturing method of multilayer printed wiring board |
JP5816230B2 (ja) * | 2012-05-11 | 2015-11-18 | Jx日鉱日石金属株式会社 | 表面処理銅箔及びそれを用いた積層板、銅箔、プリント配線板、電子機器、並びに、プリント配線板の製造方法 |
CN107031143A (zh) * | 2013-03-04 | 2017-08-11 | Jx日矿日石金属株式会社 | 附载体铜箔、使用其的覆铜积层板、印刷配线板、电子机器及印刷配线板的制造方法 |
JP6176948B2 (ja) * | 2013-03-05 | 2017-08-09 | Jx金属株式会社 | キャリア付銅箔、キャリア付銅箔の製造方法、プリント回路板の製造方法、銅張積層板の製造方法、及び、プリント配線板の製造方法 |
JP6140480B2 (ja) * | 2013-03-05 | 2017-05-31 | Jx金属株式会社 | キャリア付銅箔、キャリア付銅箔の製造方法、プリント配線板、プリント回路板、銅張積層板、及び、プリント配線板の製造方法 |
JP6140481B2 (ja) * | 2013-03-05 | 2017-05-31 | Jx金属株式会社 | キャリア付銅箔、キャリア付銅箔の製造方法、プリント配線板、プリント回路板、銅張積層板、及び、プリント配線板の製造方法 |
JP5885790B2 (ja) * | 2013-08-20 | 2016-03-15 | Jx金属株式会社 | 表面処理銅箔及びそれを用いた積層板、キャリア付銅箔、プリント配線板、電子機器、電子機器の製造方法、並びに、プリント配線板の製造方法 |
JP5885791B2 (ja) * | 2013-08-20 | 2016-03-15 | Jx金属株式会社 | 表面処理銅箔及びそれを用いた積層板、キャリア付銅箔、銅箔、プリント配線板、電子機器、電子機器の製造方法、並びに、プリント配線板の製造方法 |
CN105745360B (zh) * | 2013-11-27 | 2017-12-08 | 三井金属矿业株式会社 | 带有载体箔的铜箔、覆铜层压板及印刷线路板 |
JP5842077B1 (ja) * | 2015-07-01 | 2016-01-13 | 三井金属鉱業株式会社 | キャリア付銅箔、銅張積層板及びプリント配線板 |
JP6782561B2 (ja) * | 2015-07-16 | 2020-11-11 | Jx金属株式会社 | キャリア付銅箔、積層体、積層体の製造方法、プリント配線板の製造方法及び電子機器の製造方法 |
JP6432684B2 (ja) * | 2015-07-31 | 2018-12-05 | 住友金属鉱山株式会社 | 導電性基板、導電性基板の製造方法 |
WO2017149810A1 (ja) * | 2016-02-29 | 2017-09-08 | 三井金属鉱業株式会社 | キャリア付銅箔及びその製造方法、並びに配線層付コアレス支持体及びプリント配線板の製造方法 |
US11453823B2 (en) * | 2017-02-20 | 2022-09-27 | InkTee Co., Ltd. | Method for manufacturing transfer film including seed layer, method for manufacturing circuit board by selectively etching seed layer, and etching solution composite |
Citations (2)
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JP2001062955A (ja) | 1999-08-24 | 2001-03-13 | Mitsui Mining & Smelting Co Ltd | キャリア箔付電解銅箔及びその電解銅箔を使用した銅張積層板 |
KR20040015332A (ko) * | 2002-05-14 | 2004-02-18 | 미쓰이 긴조꾸 고교 가부시키가이샤 | 고온내열용 캐리어박 구비 전해동박의 제조방법 및 그제조방법에서 얻을 수 있는 고온내열용 캐리어박 구비전해동박 |
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JP2005288856A (ja) * | 2004-03-31 | 2005-10-20 | Mitsui Mining & Smelting Co Ltd | キャリア箔付電解銅箔及びその製造方法並びにそのキャリア箔付電解銅箔を用いた銅張積層板 |
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2009
- 2009-03-24 JP JP2009072381A patent/JP5379528B2/ja active Active
-
2010
- 2010-02-26 TW TW099105608A patent/TWI452177B/zh active
- 2010-03-24 KR KR1020100026149A patent/KR101133162B1/ko active IP Right Grant
Patent Citations (2)
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JP2001062955A (ja) | 1999-08-24 | 2001-03-13 | Mitsui Mining & Smelting Co Ltd | キャリア箔付電解銅箔及びその電解銅箔を使用した銅張積層板 |
KR20040015332A (ko) * | 2002-05-14 | 2004-02-18 | 미쓰이 긴조꾸 고교 가부시키가이샤 | 고온내열용 캐리어박 구비 전해동박의 제조방법 및 그제조방법에서 얻을 수 있는 고온내열용 캐리어박 구비전해동박 |
Also Published As
Publication number | Publication date |
---|---|
JP5379528B2 (ja) | 2013-12-25 |
TW201035390A (en) | 2010-10-01 |
TWI452177B (zh) | 2014-09-11 |
KR20100106934A (ko) | 2010-10-04 |
JP2010222657A (ja) | 2010-10-07 |
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