JPS5753857B2 - - Google Patents

Info

Publication number: JPS5753857B2
Authority: JP; Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired

Application number

JP52141474A

Other languages

Japanese (ja)

Other versions

JPS5365226A (en

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1976-11-22

Filing date

1977-11-22

Publication date

1982-11-15

1977-11-22 Application filed filed Critical

1978-06-10 Publication of JPS5365226A publication Critical patent/JPS5365226A/ja

1982-11-15 Publication of JPS5753857B2 publication Critical patent/JPS5753857B2/ja

Status Granted legal-status Critical Current

Links

Classifications

- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1675—Process conditions
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1619—Apparatus for electroless plating
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1675—Process conditions
- C23C18/1683—Control of electrolyte composition, e.g. measurement, adjustment

Landscapes

Chemical & Material Sciences (AREA)
General Chemical & Material Sciences (AREA)
Chemical Kinetics & Catalysis (AREA)
Engineering & Computer Science (AREA)
Materials Engineering (AREA)
Mechanical Engineering (AREA)
Metallurgy (AREA)
Organic Chemistry (AREA)
Electrochemistry (AREA)
Chemically Coating (AREA)

JP14147477A 1976-11-22 1977-11-22 Method for controlling nonnelectrolytic plating solution Granted JPS5365226A (en)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
US74411076A	1976-11-22	1976-11-22

Publications (2)

Publication Number	Publication Date
JPS5365226A JPS5365226A (en)	1978-06-10
JPS5753857B2 true JPS5753857B2 (de)	1982-11-15

Family

ID=24991471

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP14147477A Granted JPS5365226A (en)	1976-11-22	1977-11-22	Method for controlling nonnelectrolytic plating solution

Country Status (14)

Country	Link
JP (1)	JPS5365226A (de)
AT (1)	AT354213B (de)
AU (1)	AU512805B2 (de)
CA (1)	CA1112523A (de)
CH (1)	CH637995A5 (de)
DE (2)	DE2759952C2 (de)
ES (1)	ES464266A1 (de)
FR (1)	FR2371522A1 (de)
GB (1)	GB1588758A (de)
IL (1)	IL53298A (de)
IT (1)	IT1116376B (de)
NL (1)	NL7712683A (de)
SE (1)	SE442410B (de)
ZA (1)	ZA775495B (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS63149278U (de) *	1987-03-19	1988-09-30

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS5953348B2 (ja) *	1977-12-16	1984-12-24	株式会社日立製作所	化学銅めつき液の主成分自動管理方法並びにその装置
US4276323A (en) *	1979-12-21	1981-06-30	Hitachi, Ltd.	Process for controlling of chemical copper plating solution
JPS6096767A (ja) *	1983-10-31	1985-05-30	インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション	銅めつき方法
US4707377A (en) *	1983-10-31	1987-11-17	International Business Machines Corporation	Copper plating
JPS61110799A (ja) *	1984-10-30	1986-05-29	インタ−ナシヨナル　ビジネス　マシ−ンズ　コ−ポレ−シヨン	金属めつき槽の制御装置
US4623554A (en) *	1985-03-08	1986-11-18	International Business Machines Corp.	Method for controlling plating rate in an electroless plating system
EP0265895B1 (de) *	1986-10-31	1993-02-10	AMP-AKZO CORPORATION (a Delaware corp.)	Verfahren zum stromlosen Abscheiden von hochwertigem Kupfer
US4908242A (en) *	1986-10-31	1990-03-13	Kollmorgen Corporation	Method of consistently producing a copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures
US4774101A (en) *	1986-12-10	1988-09-27	American Telephone And Telegraph Company, At&T Technologies, Inc.	Automated method for the analysis and control of the electroless metal plating solution
DE3718584A1 (de) *	1987-06-03	1988-12-15	Norddeutsche Affinerie	Verfahren zur messung der wirksamen inhibitorkonzentration waehrend der metallabscheidung aus waessrigen elektrolyten
US4842886A (en) *	1987-11-04	1989-06-27	International Business Machines Corporation	Method for electroless plating
AU3304389A (en) *	1988-04-29	1989-11-02	Kollmorgen Corporation	Method of consistently producing a copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures
GB2225026A (en) *	1988-11-22	1990-05-23	American Chem & Refining Co	Electroless gold plating composition
JP2005206931A (ja) *	2003-12-26	2005-08-04	Sumitomo Electric Ind Ltd	金属粉末の製造方法
JP5116068B2 (ja) *	2004-09-07	2013-01-09	Ｊｘ日鉱日石金属株式会社	無電解金めっき液の安定化方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS52124429A (en) *	1976-04-13	1977-10-19	Tokyo Shibaura Electric Co	Method of automatically controlling plating speed in nonnelectrolytic plating

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US3375178A (en) *	1964-05-28	1968-03-26	Continental Oil Co	Method of confirming the occurrence of plating in electroless nickel-plating
FR1522048A (fr) *	1966-05-06	1968-04-19	Photocircuits Corp	Dépôt non galvanique de métaux

1977
- 1977-09-13 ZA ZA00775495A patent/ZA775495B/xx unknown
- 1977-11-03 IL IL53298A patent/IL53298A/xx unknown
- 1977-11-11 DE DE2759952A patent/DE2759952C2/de not_active Expired
- 1977-11-11 DE DE19772751104 patent/DE2751104A1/de not_active Ceased
- 1977-11-17 NL NL7712683A patent/NL7712683A/xx not_active Application Discontinuation
- 1977-11-18 CA CA291,214A patent/CA1112523A/en not_active Expired
- 1977-11-18 AT AT827777A patent/AT354213B/de not_active IP Right Cessation
- 1977-11-18 AU AU30760/77A patent/AU512805B2/en not_active Expired
- 1977-11-18 ES ES464266A patent/ES464266A1/es not_active Expired
- 1977-11-21 CH CH1419677A patent/CH637995A5/de not_active IP Right Cessation
- 1977-11-21 GB GB48323/77A patent/GB1588758A/en not_active Expired
- 1977-11-22 JP JP14147477A patent/JPS5365226A/ja active Granted
- 1977-11-22 IT IT51901/77A patent/IT1116376B/it active
- 1977-11-22 FR FR7734995A patent/FR2371522A1/fr active Granted
- 1977-11-22 SE SE7713192A patent/SE442410B/sv not_active IP Right Cessation

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS52124429A (en) *	1976-04-13	1977-10-19	Tokyo Shibaura Electric Co	Method of automatically controlling plating speed in nonnelectrolytic plating

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS63149278U (de) *	1987-03-19	1988-09-30

Also Published As

Publication number	Publication date
NL7712683A (nl)	1978-05-24
ZA775495B (en)	1978-07-26
AT354213B (de)	1979-12-27
SE442410B (sv)	1985-12-23
IL53298A0 (en)	1978-01-31
ATA827777A (de)	1979-05-15
IT1116376B (it)	1986-02-10
GB1588758A (en)	1981-04-29
FR2371522B1 (de)	1980-02-15
JPS5365226A (en)	1978-06-10
ES464266A1 (es)	1978-08-01
DE2759952C2 (de)	1984-03-08
SE7713192L (sv)	1978-05-23
FR2371522A1 (fr)	1978-06-16
CA1112523A (en)	1981-11-17
IL53298A (en)	1981-02-27
AU3076077A (en)	1979-05-24
CH637995A5 (en)	1983-08-31
DE2751104A1 (de)	1978-05-24
AU512805B2 (en)	1980-10-30

Publication	Publication Date	Title
JPS5753857B2 (de)	1982-11-15
FR2347894B1 (de)	1982-01-15
JPS57274B2 (de)	1982-01-06
JPS561159B2 (de)	1981-01-12
JPS5394837U (de)	1978-08-02
JPS52163773U (de)	1977-12-12
JPS52117541U (de)	1977-09-06
JPS5626422Y2 (de)	1981-06-23
JPS5422712Y2 (de)	1979-08-07
JPS53232U (de)	1978-01-05
JPS52165334U (de)	1977-12-14
JPS5294168U (de)	1977-07-14
JPS52106231U (de)	1977-08-12
JPS535811U (de)	1978-01-19
JPS5368036U (de)	1978-06-08
CS178350B1 (de)	1977-08-31
CS177793B1 (de)	1977-08-31
CH609548A5 (de)	1979-03-15
DD124238A5 (de)	1977-02-09
CH612286A5 (de)	1979-07-13
CH610387A5 (de)	1979-04-12
CH609750A5 (de)	1979-03-15
DD126158A1 (de)	1977-06-22
CH612727A5 (de)	1979-08-15
CH608755A5 (de)	1979-01-31

JPS5753857B2 - - Google Patents

Info

Links

Classifications

Landscapes

Applications Claiming Priority (1)

Publications (2)

Family

ID=24991471

Family Applications (1)

Country Status (14)

Cited By (1)

Families Citing this family (15)

Citations (1)

Family Cites Families (2)

Patent Citations (1)

Cited By (1)

Also Published As

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