IL53298A0 - Method and apparatus for operating electroless plating solutions - Google Patents

Method and apparatus for operating electroless plating solutions

Info

Publication number: IL53298A0
Authority: IL; Israel
Prior art keywords: operating; electroless plating; plating solutions; solutions; electroless
Prior art date: 1976-11-22

Application number

IL53298A

Other versions

IL53298A (en

Original Assignee

Kollmorgen Tech Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1976-11-22

Filing date

1977-11-03

Publication date

1978-01-31

1977-11-03 Application filed by Kollmorgen Tech Corp filed Critical Kollmorgen Tech Corp

1978-01-31 Publication of IL53298A0 publication Critical patent/IL53298A0/en

1981-02-27 Publication of IL53298A publication Critical patent/IL53298A/en

Links

Classifications

- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1675—Process conditions
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1619—Apparatus for electroless plating
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1675—Process conditions
- C23C18/1683—Control of electrolyte composition, e.g. measurement, adjustment

Landscapes

Chemical & Material Sciences (AREA)
General Chemical & Material Sciences (AREA)
Chemical Kinetics & Catalysis (AREA)
Engineering & Computer Science (AREA)
Materials Engineering (AREA)
Mechanical Engineering (AREA)
Metallurgy (AREA)
Organic Chemistry (AREA)
Electrochemistry (AREA)
Chemically Coating (AREA)

IL53298A 1976-11-22 1977-11-03 Method and apparatus for operating electroless plating bath IL53298A (en)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
US74411076A	1976-11-22	1976-11-22

Publications (2)

Publication Number	Publication Date
IL53298A0 true IL53298A0 (en)	1978-01-31
IL53298A IL53298A (en)	1981-02-27

Family

ID=24991471

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
IL53298A IL53298A (en)	1976-11-22	1977-11-03	Method and apparatus for operating electroless plating bath

Country Status (14)

Country	Link
JP (1)	JPS5365226A (en)
AT (1)	AT354213B (en)
AU (1)	AU512805B2 (en)
CA (1)	CA1112523A (en)
CH (1)	CH637995A5 (en)
DE (2)	DE2759952C2 (en)
ES (1)	ES464266A1 (en)
FR (1)	FR2371522A1 (en)
GB (1)	GB1588758A (en)
IL (1)	IL53298A (en)
IT (1)	IT1116376B (en)
NL (1)	NL7712683A (en)
SE (1)	SE442410B (en)
ZA (1)	ZA775495B (en)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS5953348B2 (en) *	1977-12-16	1984-12-24	株式会社日立製作所	Automatic management method and device for main components of chemical copper plating solution
US4276323A (en) *	1979-12-21	1981-06-30	Hitachi, Ltd.	Process for controlling of chemical copper plating solution
JPS6096767A (en) *	1983-10-31	1985-05-30	インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション	Copper plating process
US4707377A (en) *	1983-10-31	1987-11-17	International Business Machines Corporation	Copper plating
JPS61110799A (en) *	1984-10-30	1986-05-29	インタ−ナシヨナル　ビジネス　マシ−ンズ　コ−ポレ−シヨン	Controller of metal plating cell
US4623554A (en) *	1985-03-08	1986-11-18	International Business Machines Corp.	Method for controlling plating rate in an electroless plating system
EP0265895B1 (en) *	1986-10-31	1993-02-10	AMP-AKZO CORPORATION (a Delaware corp.)	Method for electrolessly depositing high quality copper
US4908242A (en) *	1986-10-31	1990-03-13	Kollmorgen Corporation	Method of consistently producing a copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures
US4774101A (en) *	1986-12-10	1988-09-27	American Telephone And Telegraph Company, At&T Technologies, Inc.	Automated method for the analysis and control of the electroless metal plating solution
JPS63149278U (en) *	1987-03-19	1988-09-30
DE3718584A1 (en) *	1987-06-03	1988-12-15	Norddeutsche Affinerie	METHOD FOR MEASURING THE ACTIVE INHIBITOR CONCENTRATION DURING METAL DEPOSITION FROM AQUEOUS ELECTROLYTE
US4842886A (en) *	1987-11-04	1989-06-27	International Business Machines Corporation	Method for electroless plating
AU3304389A (en) *	1988-04-29	1989-11-02	Kollmorgen Corporation	Method of consistently producing a copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures
GB2225026A (en) *	1988-11-22	1990-05-23	American Chem & Refining Co	Electroless gold plating composition
JP2005206931A (en) *	2003-12-26	2005-08-04	Sumitomo Electric Ind Ltd	Method for producing metal powder
JP5116068B2 (en) *	2004-09-07	2013-01-09	Ｊｘ日鉱日石金属株式会社	Method for stabilizing electroless gold plating solution

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US3375178A (en) *	1964-05-28	1968-03-26	Continental Oil Co	Method of confirming the occurrence of plating in electroless nickel-plating
FR1522048A (en) *	1966-05-06	1968-04-19	Photocircuits Corp	Non-galvanic deposit of metals
JPS5921386B2 (en) *	1976-04-13	1984-05-19	株式会社東芝	Automatic plating speed control method for electroless plating

1977
- 1977-09-13 ZA ZA00775495A patent/ZA775495B/en unknown
- 1977-11-03 IL IL53298A patent/IL53298A/en unknown
- 1977-11-11 DE DE2759952A patent/DE2759952C2/en not_active Expired
- 1977-11-11 DE DE19772751104 patent/DE2751104A1/en not_active Ceased
- 1977-11-17 NL NL7712683A patent/NL7712683A/en not_active Application Discontinuation
- 1977-11-18 CA CA291,214A patent/CA1112523A/en not_active Expired
- 1977-11-18 AT AT827777A patent/AT354213B/en not_active IP Right Cessation
- 1977-11-18 AU AU30760/77A patent/AU512805B2/en not_active Expired
- 1977-11-18 ES ES464266A patent/ES464266A1/en not_active Expired
- 1977-11-21 CH CH1419677A patent/CH637995A5/en not_active IP Right Cessation
- 1977-11-21 GB GB48323/77A patent/GB1588758A/en not_active Expired
- 1977-11-22 JP JP14147477A patent/JPS5365226A/en active Granted
- 1977-11-22 IT IT51901/77A patent/IT1116376B/en active
- 1977-11-22 FR FR7734995A patent/FR2371522A1/en active Granted
- 1977-11-22 SE SE7713192A patent/SE442410B/en not_active IP Right Cessation

Also Published As

Publication number	Publication date
NL7712683A (en)	1978-05-24
ZA775495B (en)	1978-07-26
AT354213B (en)	1979-12-27
SE442410B (en)	1985-12-23
ATA827777A (en)	1979-05-15
IT1116376B (en)	1986-02-10
GB1588758A (en)	1981-04-29
FR2371522B1 (en)	1980-02-15
JPS5365226A (en)	1978-06-10
ES464266A1 (en)	1978-08-01
DE2759952C2 (en)	1984-03-08
SE7713192L (en)	1978-05-23
FR2371522A1 (en)	1978-06-16
CA1112523A (en)	1981-11-17
IL53298A (en)	1981-02-27
AU3076077A (en)	1979-05-24
CH637995A5 (en)	1983-08-31
DE2751104A1 (en)	1978-05-24
JPS5753857B2 (en)	1982-11-15
AU512805B2 (en)	1980-10-30

Publication	Publication Date	Title
IL53298A0 (en)	1978-01-31	Method and apparatus for operating electroless plating solutions
JPS5332188A (en)	1978-03-27	Method and apparatus for diagnosis
JPS52104143A (en)	1977-09-01	Method and apparatus for error modification
DE3070824D1 (en)	1985-08-08	Method and apparatus for evaluating electroless plating
JPS5362737A (en)	1978-06-05	Nonnelectric plating method
JPS53114974A (en)	1978-10-06	Method and apparatus for making nonnwoven structure
JPS5348902A (en)	1978-05-02	Continuous minimg method and apparatus for same
JPS5359083A (en)	1978-05-27	Method and apparatus for treating robster
JPS52122201A (en)	1977-10-14	Process and apparatus for highhtemperature metallurgy
JPS5288230A (en)	1977-07-23	Plating apparatus
JPS5354131A (en)	1978-05-17	Automatic plating treatment apparatus
JPS5345499A (en)	1978-04-24	Purifying method and apparatus for alkalline solution
JPS5363226A (en)	1978-06-06	Electroplating method of palladium
JPS52152282A (en)	1977-12-17	Method and apparatus for coating terminal blood trace
JPS54110937A (en)	1979-08-30	Method and apparatus for fast plating
JPS5310329A (en)	1978-01-30	Oneeside molten plating method and apparatus therefor
JPS53125277A (en)	1978-11-01	Ion plating apparatus and method
JPS5348941A (en)	1978-05-02	High speed silver plating method and apparatus therefor
JPS54157740A (en)	1979-12-12	Method and apparatus for plating
JPS5346443A (en)	1978-04-26	Plating method and plating apparatus
JPS537543A (en)	1978-01-24	Plating method
GB1553585A (en)	1979-09-26	Facing plate and method and apparatus for making same
JPS5326772A (en)	1978-03-13	Method and apparatus for preventing dusttsticking
JPS5337546A (en)	1978-04-06	Plating apparatus for partial plating
JPS5348032A (en)	1978-05-01	Continuous plating apparatus