FR2371522A1 - Procede et appareil pour le controle des solutions de depot par deplacement chimique - Google Patents

Procede et appareil pour le controle des solutions de depot par deplacement chimique

Info

Publication number
FR2371522A1
FR2371522A1 FR7734995A FR7734995A FR2371522A1 FR 2371522 A1 FR2371522 A1 FR 2371522A1 FR 7734995 A FR7734995 A FR 7734995A FR 7734995 A FR7734995 A FR 7734995A FR 2371522 A1 FR2371522 A1 FR 2371522A1
Authority
FR
France
Prior art keywords
control
chemical displacement
bath
mixed potential
deposit solutions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7734995A
Other languages
English (en)
Other versions
FR2371522B1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kollmorgen Technologies Corp
Original Assignee
Kollmorgen Technologies Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kollmorgen Technologies Corp filed Critical Kollmorgen Technologies Corp
Publication of FR2371522A1 publication Critical patent/FR2371522A1/fr
Application granted granted Critical
Publication of FR2371522B1 publication Critical patent/FR2371522B1/fr
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1675—Process conditions
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1619—Apparatus for electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1675—Process conditions
    • C23C18/1683—Control of electrolyte composition, e.g. measurement, adjustment

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Chemically Coating (AREA)

Abstract

Procédé et appareil pour utiliser un bain (sous forme d'une solution) en partant du << potentiel mixte >> de ce bain. Le procédé selon l'invention est essentiellement caractérisé en ce qu'il consiste à mesurer le potentiel mixte de ce bain et à ajuster un ou plusieurs autres paramètres de celui-ci pour maintenir ce potentiel mixte entre des limites prédéterminées. Application à la formation de dépôts de cuivre lisses et brillants.
FR7734995A 1976-11-22 1977-11-22 Procede et appareil pour le controle des solutions de depot par deplacement chimique Granted FR2371522A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US74411076A 1976-11-22 1976-11-22

Publications (2)

Publication Number Publication Date
FR2371522A1 true FR2371522A1 (fr) 1978-06-16
FR2371522B1 FR2371522B1 (fr) 1980-02-15

Family

ID=24991471

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7734995A Granted FR2371522A1 (fr) 1976-11-22 1977-11-22 Procede et appareil pour le controle des solutions de depot par deplacement chimique

Country Status (14)

Country Link
JP (1) JPS5365226A (fr)
AT (1) AT354213B (fr)
AU (1) AU512805B2 (fr)
CA (1) CA1112523A (fr)
CH (1) CH637995A5 (fr)
DE (2) DE2759952C2 (fr)
ES (1) ES464266A1 (fr)
FR (1) FR2371522A1 (fr)
GB (1) GB1588758A (fr)
IL (1) IL53298A (fr)
IT (1) IT1116376B (fr)
NL (1) NL7712683A (fr)
SE (1) SE442410B (fr)
ZA (1) ZA775495B (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0144685A1 (fr) * 1983-10-31 1985-06-19 International Business Machines Corporation Procédé de dépôt chimique de cuivre
EP0194530A2 (fr) * 1985-03-08 1986-09-17 International Business Machines Corporation Procédé de contrôle de la vitesse d'un dépôt chimique
US4707377A (en) * 1983-10-31 1987-11-17 International Business Machines Corporation Copper plating
EP0315386A1 (fr) * 1987-11-04 1989-05-10 International Business Machines Corporation Procédé et appareil de dépôt chimique

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5953348B2 (ja) * 1977-12-16 1984-12-24 株式会社日立製作所 化学銅めつき液の主成分自動管理方法並びにその装置
US4276323A (en) * 1979-12-21 1981-06-30 Hitachi, Ltd. Process for controlling of chemical copper plating solution
JPS61110799A (ja) * 1984-10-30 1986-05-29 インタ−ナシヨナル　ビジネス　マシ−ンズ　コ−ポレ−シヨン 金属めつき槽の制御装置
EP0265895B1 (fr) * 1986-10-31 1993-02-10 AMP-AKZO CORPORATION (a Delaware corp.) Procédé de dépôt chimique de cuivre de haute qualité
US4908242A (en) * 1986-10-31 1990-03-13 Kollmorgen Corporation Method of consistently producing a copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures
US4774101A (en) * 1986-12-10 1988-09-27 American Telephone And Telegraph Company, At&T Technologies, Inc. Automated method for the analysis and control of the electroless metal plating solution
JPS63149278U (fr) * 1987-03-19 1988-09-30
DE3718584A1 (de) * 1987-06-03 1988-12-15 Norddeutsche Affinerie Verfahren zur messung der wirksamen inhibitorkonzentration waehrend der metallabscheidung aus waessrigen elektrolyten
AU3304389A (en) * 1988-04-29 1989-11-02 Kollmorgen Corporation Method of consistently producing a copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures
GB2225026A (en) * 1988-11-22 1990-05-23 American Chem & Refining Co Electroless gold plating composition
JP2005206931A (ja) * 2003-12-26 2005-08-04 Sumitomo Electric Ind Ltd 金属粉末の製造方法
JP5116068B2 (ja) * 2004-09-07 2013-01-09 Ｊｘ日鉱日石金属株式会社 無電解金めっき液の安定化方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3375178A (en) * 1964-05-28 1968-03-26 Continental Oil Co Method of confirming the occurrence of plating in electroless nickel-plating
FR1522048A (fr) * 1966-05-06 1968-04-19 Photocircuits Corp Dépôt non galvanique de métaux

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5921386B2 (ja) * 1976-04-13 1984-05-19 株式会社東芝 無電解メツキのメツキ速度自動制御方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3375178A (en) * 1964-05-28 1968-03-26 Continental Oil Co Method of confirming the occurrence of plating in electroless nickel-plating
FR1522048A (fr) * 1966-05-06 1968-04-19 Photocircuits Corp Dépôt non galvanique de métaux

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0144685A1 (fr) * 1983-10-31 1985-06-19 International Business Machines Corporation Procédé de dépôt chimique de cuivre
US4707377A (en) * 1983-10-31 1987-11-17 International Business Machines Corporation Copper plating
EP0194530A2 (fr) * 1985-03-08 1986-09-17 International Business Machines Corporation Procédé de contrôle de la vitesse d'un dépôt chimique
EP0194530A3 (en) * 1985-03-08 1987-03-25 International Business Machines Corporation Method for controlling the plating rate in an electroless plating process
EP0315386A1 (fr) * 1987-11-04 1989-05-10 International Business Machines Corporation Procédé et appareil de dépôt chimique

Also Published As

Publication number Publication date
NL7712683A (nl) 1978-05-24
ZA775495B (en) 1978-07-26
AT354213B (de) 1979-12-27
SE442410B (sv) 1985-12-23
IL53298A0 (en) 1978-01-31
ATA827777A (de) 1979-05-15
IT1116376B (it) 1986-02-10
GB1588758A (en) 1981-04-29
FR2371522B1 (fr) 1980-02-15
JPS5365226A (en) 1978-06-10
ES464266A1 (es) 1978-08-01
DE2759952C2 (de) 1984-03-08
SE7713192L (sv) 1978-05-23
CA1112523A (fr) 1981-11-17
IL53298A (en) 1981-02-27
AU3076077A (en) 1979-05-24
CH637995A5 (en) 1983-08-31
DE2751104A1 (de) 1978-05-24
JPS5753857B2 (fr) 1982-11-15
AU512805B2 (en) 1980-10-30

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