IT1116376B - Metodo ed apparecchio per controllare soluzioni di placcatura senza elettricita' - Google Patents

Metodo ed apparecchio per controllare soluzioni di placcatura senza elettricita'

Info

Publication number
IT1116376B
IT1116376B IT51901/77A IT5190177A IT1116376B IT 1116376 B IT1116376 B IT 1116376B IT 51901/77 A IT51901/77 A IT 51901/77A IT 5190177 A IT5190177 A IT 5190177A IT 1116376 B IT1116376 B IT 1116376B
Authority
IT
Italy
Prior art keywords
electricity
plating solutions
control plating
control
solutions
Prior art date
Application number
IT51901/77A
Other languages
English (en)
Italian (it)
Inventor
J Zeblisky Rudolph
P Karas John
R Funk Charles
Original Assignee
Kollmorgen Tech Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kollmorgen Tech Corp filed Critical Kollmorgen Tech Corp
Application granted granted Critical
Publication of IT1116376B publication Critical patent/IT1116376B/it

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1675—Process conditions
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1619—Apparatus for electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1675—Process conditions
    • C23C18/1683—Control of electrolyte composition, e.g. measurement, adjustment

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Chemically Coating (AREA)
IT51901/77A 1976-11-22 1977-11-22 Metodo ed apparecchio per controllare soluzioni di placcatura senza elettricita' IT1116376B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US74411076A 1976-11-22 1976-11-22

Publications (1)

Publication Number Publication Date
IT1116376B true IT1116376B (it) 1986-02-10

Family

ID=24991471

Family Applications (1)

Application Number Title Priority Date Filing Date
IT51901/77A IT1116376B (it) 1976-11-22 1977-11-22 Metodo ed apparecchio per controllare soluzioni di placcatura senza elettricita'

Country Status (14)

Country Link
JP (1) JPS5365226A (de)
AT (1) AT354213B (de)
AU (1) AU512805B2 (de)
CA (1) CA1112523A (de)
CH (1) CH637995A5 (de)
DE (2) DE2759952C2 (de)
ES (1) ES464266A1 (de)
FR (1) FR2371522A1 (de)
GB (1) GB1588758A (de)
IL (1) IL53298A (de)
IT (1) IT1116376B (de)
NL (1) NL7712683A (de)
SE (1) SE442410B (de)
ZA (1) ZA775495B (de)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5953348B2 (ja) * 1977-12-16 1984-12-24 株式会社日立製作所 化学銅めつき液の主成分自動管理方法並びにその装置
US4276323A (en) * 1979-12-21 1981-06-30 Hitachi, Ltd. Process for controlling of chemical copper plating solution
JPS6096767A (ja) * 1983-10-31 1985-05-30 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション 銅めつき方法
US4707377A (en) * 1983-10-31 1987-11-17 International Business Machines Corporation Copper plating
JPS61110799A (ja) * 1984-10-30 1986-05-29 インタ−ナシヨナル　ビジネス　マシ−ンズ　コ−ポレ−シヨン 金属めつき槽の制御装置
US4623554A (en) * 1985-03-08 1986-11-18 International Business Machines Corp. Method for controlling plating rate in an electroless plating system
EP0265895B1 (de) * 1986-10-31 1993-02-10 AMP-AKZO CORPORATION (a Delaware corp.) Verfahren zum stromlosen Abscheiden von hochwertigem Kupfer
US4908242A (en) * 1986-10-31 1990-03-13 Kollmorgen Corporation Method of consistently producing a copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures
US4774101A (en) * 1986-12-10 1988-09-27 American Telephone And Telegraph Company, At&T Technologies, Inc. Automated method for the analysis and control of the electroless metal plating solution
JPS63149278U (de) * 1987-03-19 1988-09-30
DE3718584A1 (de) * 1987-06-03 1988-12-15 Norddeutsche Affinerie Verfahren zur messung der wirksamen inhibitorkonzentration waehrend der metallabscheidung aus waessrigen elektrolyten
US4842886A (en) * 1987-11-04 1989-06-27 International Business Machines Corporation Method for electroless plating
AU3304389A (en) * 1988-04-29 1989-11-02 Kollmorgen Corporation Method of consistently producing a copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures
GB2225026A (en) * 1988-11-22 1990-05-23 American Chem & Refining Co Electroless gold plating composition
JP2005206931A (ja) * 2003-12-26 2005-08-04 Sumitomo Electric Ind Ltd 金属粉末の製造方法
JP5116068B2 (ja) * 2004-09-07 2013-01-09 Ｊｘ日鉱日石金属株式会社 無電解金めっき液の安定化方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3375178A (en) * 1964-05-28 1968-03-26 Continental Oil Co Method of confirming the occurrence of plating in electroless nickel-plating
FR1522048A (fr) * 1966-05-06 1968-04-19 Photocircuits Corp Dépôt non galvanique de métaux
JPS5921386B2 (ja) * 1976-04-13 1984-05-19 株式会社東芝 無電解メツキのメツキ速度自動制御方法

Also Published As

Publication number Publication date
NL7712683A (nl) 1978-05-24
ZA775495B (en) 1978-07-26
AT354213B (de) 1979-12-27
SE442410B (sv) 1985-12-23
IL53298A0 (en) 1978-01-31
ATA827777A (de) 1979-05-15
GB1588758A (en) 1981-04-29
FR2371522B1 (de) 1980-02-15
JPS5365226A (en) 1978-06-10
ES464266A1 (es) 1978-08-01
DE2759952C2 (de) 1984-03-08
SE7713192L (sv) 1978-05-23
FR2371522A1 (fr) 1978-06-16
CA1112523A (en) 1981-11-17
IL53298A (en) 1981-02-27
AU3076077A (en) 1979-05-24
CH637995A5 (en) 1983-08-31
DE2751104A1 (de) 1978-05-24
JPS5753857B2 (de) 1982-11-15
AU512805B2 (en) 1980-10-30

Similar Documents

Publication Publication Date Title
IT1097211B (it) Metodo ed apparecchio per produrre cablaggi elettrici
IT1073070B (it) Metodo e dispositivo per controllare la velocita' di un oggetto
PH17515A (en) Pyridazinone-substituted benzimidazoles and salts thereof
IT1116376B (it) Metodo ed apparecchio per controllare soluzioni di placcatura senza elettricita'
IT1106028B (it) Procedimento ed apparecchio per produrre scaglie metalliche
BE855499A (fr) Moyens et procedes de production d'energie photovoltaique
IT1101268B (it) Metodo e apparato per produrre nerofumo
IT1082155B (it) Metodo ed apparecchio per rivettare
AU3016377A (en) Emollient bath
IT1192656B (it) Contatto elettrico e metodo per realizzare il medesimo
PH12424A (en) Method of treating anxiety in mammals
JPS52153834A (en) Plating method and plating composition
IT1094392B (it) Metodo ed apparato per produrre yogurt
JPS52119432A (en) Continuous electrogalvanizing method
IT1169579B (it) Dispositivo per produrre nastri metallici
IT1105824B (it) Filato voluminoso e metodo per produrre il medesimo
IT1057377B (it) Perfezionamento nelle connessioni elettriche
JPS52156138A (en) Plating method and plating composition
IT1115872B (it) Apparecchio e procedimento per controllare il consumo di energia elettrica
JPS52139961A (en) Wiring structure and method therefor
IT1104936B (it) Sprotello particolarmente idoneo per l'impiego nelle farmacie
BG27742A3 (en) Method of obtaining of 1- sulphonyl- 5 (6)- substituated benzimidazoles
JPS5363226A (en) Electroplating method of palladium
IT1169578B (it) Dispositivo per produrre nastri metallici
JPS5514885A (en) Magnetic absorption device in electrolytic bath