JPS5365226A - Method for controlling nonnelectrolytic plating solution - Google Patents

Method for controlling nonnelectrolytic plating solution

Info

Publication number
JPS5365226A
JPS5365226A JP14147477A JP14147477A JPS5365226A JP S5365226 A JPS5365226 A JP S5365226A JP 14147477 A JP14147477 A JP 14147477A JP 14147477 A JP14147477 A JP 14147477A JP S5365226 A JPS5365226 A JP S5365226A
Authority
JP
Japan
Prior art keywords
nonnelectrolytic
controlling
plating solution
plating
solution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14147477A
Other languages
Japanese (ja)
Other versions
JPS5753857B2 (en
Inventor
Jiei Zeburisukii Rudorufu
Pii Karasu Jiyon
Rourando Fuanku Chiyaaruzu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kollmorgen Technologies Corp
Original Assignee
Kollmorgen Technologies Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kollmorgen Technologies Corp filed Critical Kollmorgen Technologies Corp
Publication of JPS5365226A publication Critical patent/JPS5365226A/en
Publication of JPS5753857B2 publication Critical patent/JPS5753857B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1675—Process conditions
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1619—Apparatus for electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1675—Process conditions
    • C23C18/1683—Control of electrolyte composition, e.g. measurement, adjustment

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Chemically Coating (AREA)
JP14147477A 1976-11-22 1977-11-22 Method for controlling nonnelectrolytic plating solution Granted JPS5365226A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US74411076A 1976-11-22 1976-11-22

Publications (2)

Publication Number Publication Date
JPS5365226A true JPS5365226A (en) 1978-06-10
JPS5753857B2 JPS5753857B2 (en) 1982-11-15

Family

ID=24991471

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14147477A Granted JPS5365226A (en) 1976-11-22 1977-11-22 Method for controlling nonnelectrolytic plating solution

Country Status (14)

Country Link
JP (1) JPS5365226A (en)
AT (1) AT354213B (en)
AU (1) AU512805B2 (en)
CA (1) CA1112523A (en)
CH (1) CH637995A5 (en)
DE (2) DE2759952C2 (en)
ES (1) ES464266A1 (en)
FR (1) FR2371522A1 (en)
GB (1) GB1588758A (en)
IL (1) IL53298A (en)
IT (1) IT1116376B (en)
NL (1) NL7712683A (en)
SE (1) SE442410B (en)
ZA (1) ZA775495B (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5483635A (en) * 1977-12-16 1979-07-03 Hitachi Ltd Method and equipment for automatically controlling principal component of chemical copper plating solution
WO2005065868A1 (en) * 2003-12-26 2005-07-21 Sumitomo Electric Industries, Ltd. Method for producing metal powder
JP2006077270A (en) * 2004-09-07 2006-03-23 Nikko Materials Co Ltd Method for stabilizing electroless gold plating liquid

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4276323A (en) * 1979-12-21 1981-06-30 Hitachi, Ltd. Process for controlling of chemical copper plating solution
JPS6096767A (en) * 1983-10-31 1985-05-30 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション Copper plating process
US4707377A (en) * 1983-10-31 1987-11-17 International Business Machines Corporation Copper plating
JPS61110799A (en) * 1984-10-30 1986-05-29 インタ−ナシヨナル　ビジネス　マシ−ンズ　コ−ポレ−シヨン Controller of metal plating cell
US4623554A (en) * 1985-03-08 1986-11-18 International Business Machines Corp. Method for controlling plating rate in an electroless plating system
EP0265895B1 (en) * 1986-10-31 1993-02-10 AMP-AKZO CORPORATION (a Delaware corp.) Method for electrolessly depositing high quality copper
US4908242A (en) * 1986-10-31 1990-03-13 Kollmorgen Corporation Method of consistently producing a copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures
US4774101A (en) * 1986-12-10 1988-09-27 American Telephone And Telegraph Company, At&T Technologies, Inc. Automated method for the analysis and control of the electroless metal plating solution
JPS63149278U (en) * 1987-03-19 1988-09-30
DE3718584A1 (en) * 1987-06-03 1988-12-15 Norddeutsche Affinerie METHOD FOR MEASURING THE ACTIVE INHIBITOR CONCENTRATION DURING METAL DEPOSITION FROM AQUEOUS ELECTROLYTE
US4842886A (en) * 1987-11-04 1989-06-27 International Business Machines Corporation Method for electroless plating
AU3304389A (en) * 1988-04-29 1989-11-02 Kollmorgen Corporation Method of consistently producing a copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures
GB2225026A (en) * 1988-11-22 1990-05-23 American Chem & Refining Co Electroless gold plating composition

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52124429A (en) * 1976-04-13 1977-10-19 Tokyo Shibaura Electric Co Method of automatically controlling plating speed in nonnelectrolytic plating

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3375178A (en) * 1964-05-28 1968-03-26 Continental Oil Co Method of confirming the occurrence of plating in electroless nickel-plating
FR1522048A (en) * 1966-05-06 1968-04-19 Photocircuits Corp Non-galvanic deposit of metals

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52124429A (en) * 1976-04-13 1977-10-19 Tokyo Shibaura Electric Co Method of automatically controlling plating speed in nonnelectrolytic plating

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5483635A (en) * 1977-12-16 1979-07-03 Hitachi Ltd Method and equipment for automatically controlling principal component of chemical copper plating solution
JPS5953348B2 (en) * 1977-12-16 1984-12-24 株式会社日立製作所 Automatic management method and device for main components of chemical copper plating solution
WO2005065868A1 (en) * 2003-12-26 2005-07-21 Sumitomo Electric Industries, Ltd. Method for producing metal powder
US7510592B2 (en) 2003-12-26 2009-03-31 Sumitomo Electric Industries, Ltd. Method of producing metal powder
KR101164693B1 (en) 2003-12-26 2012-07-13 스미토모덴키고교가부시키가이샤 Method for producing metal powder
JP2006077270A (en) * 2004-09-07 2006-03-23 Nikko Materials Co Ltd Method for stabilizing electroless gold plating liquid

Also Published As

Publication number Publication date
NL7712683A (en) 1978-05-24
ZA775495B (en) 1978-07-26
AT354213B (en) 1979-12-27
SE442410B (en) 1985-12-23
IL53298A0 (en) 1978-01-31
ATA827777A (en) 1979-05-15
IT1116376B (en) 1986-02-10
GB1588758A (en) 1981-04-29
FR2371522B1 (en) 1980-02-15
ES464266A1 (en) 1978-08-01
DE2759952C2 (en) 1984-03-08
SE7713192L (en) 1978-05-23
FR2371522A1 (en) 1978-06-16
CA1112523A (en) 1981-11-17
IL53298A (en) 1981-02-27
AU3076077A (en) 1979-05-24
CH637995A5 (en) 1983-08-31
DE2751104A1 (en) 1978-05-24
JPS5753857B2 (en) 1982-11-15
AU512805B2 (en) 1980-10-30

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