JPH0228397A - Adhesive applicator for fixing chip-shaped electronic component - Google Patents

Adhesive applicator for fixing chip-shaped electronic component

Info

Publication number
JPH0228397A
JPH0228397A JP63280719A JP28071988A JPH0228397A JP H0228397 A JPH0228397 A JP H0228397A JP 63280719 A JP63280719 A JP 63280719A JP 28071988 A JP28071988 A JP 28071988A JP H0228397 A JPH0228397 A JP H0228397A
Authority
JP
Japan
Prior art keywords
application
time
electronic component
shaped electronic
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP63280719A
Other languages
Japanese (ja)
Other versions
JPH0416960B2 (en
Inventor
Kazuhiro Hineno
日根野　一弘
Atsushi Kura
倉　惇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd filed Critical Sanyo Electric Co Ltd
Priority to JP63280719A priority Critical patent/JPH0228397A/en
Publication of JPH0228397A publication Critical patent/JPH0228397A/en
Publication of JPH0416960B2 publication Critical patent/JPH0416960B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coating Apparatus (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE:To enable application amounts to be always kept stable by making a timer time up when the time that the application is not done exceeds the specified time, and making a controller control trial application. CONSTITUTION:A second memory 15b which stores data on trial application, a timer which outputs time-up signals in case that the time that the application is not done exceeds the specified time, and a controller 23 which controls it so that the trial application may be done by an XY table and a dispenser device based on the data which are read out from the second memory 15b in case that the time 28 has timed up are provided. Hereby, such a trouble as that the adhesive stuck to the end of an application nozzle of the dispenser device hardens, that the amounts of application gains in quantity, or that moreover it drops, as is apt to occur when the time that the application is not done is long, can be dissolved, and the amounts of application can be stabilized.

Description

【発明の詳細な説明】 ７、補正の内容 明細ｇの第２頁の第２行目と同頁第３行目との間に下記
の文章を挿入する。[Detailed Description of the Invention] 7. Insert the following sentence between the second line and the third line of the second page of the Specification of Contents of Amendment g.

記 ７ｐ、、５＠明の詳細な説明」Record 7p,,5@Detailed explanation of Ming”

Claims (1)

【特許請求の範囲】[Claims] （１）プリント基板を載置するためのＸＹテーブルと、
接着剤を塗布するためのディスペンサー装置と、チップ
状電子部品を前記プリント基板に固定すべき位置を示す
データを記憶した第１のメモリとを備え、該第１のメモ
リから読み出したデータに基づいて、前記ＸＹテーブル
及びディスペンサー装置を駆動し、前記プリント基板上
の前記チップ状電子部品を固定すべき位置に、前記接着
剤を順次塗布するチップ状電子部品固定用接着剤塗布装
置において、試し塗布に関するデータを記憶する第２の
メモリと、塗布動作が行なわれていない時間が所定時間
を越えた場合にタイムアップ信号を出力するタイマーと
、該タイマーがタイムアップした場合に前記第２のメモ
リから読出したデータに基づいて前記ＸＹテーブル及び
ディスペンサー装置により試し塗布するように制御する
制御装置とを設けたことを特徴とするチップ状電子部品
固定用接着剤塗布装置。(1) An XY table for placing the printed circuit board,
A dispenser device for applying an adhesive, and a first memory storing data indicating a position where the chip-shaped electronic component should be fixed to the printed circuit board, and based on the data read from the first memory. , in an adhesive applicator for fixing a chip-shaped electronic component, which drives the XY table and dispenser device and sequentially applies the adhesive to the position where the chip-shaped electronic component is to be fixed on the printed circuit board; a second memory that stores data; a timer that outputs a time-up signal when the time during which no coating operation is performed exceeds a predetermined time; and a timer that outputs a time-up signal when the timer times up; An adhesive coating device for fixing a chip-shaped electronic component, comprising: a control device that controls trial coating by the XY table and the dispenser device based on the data obtained.
JP63280719A 1988-11-07 1988-11-07 Adhesive applicator for fixing chip-shaped electronic component Granted JPH0228397A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63280719A JPH0228397A (en) 1988-11-07 1988-11-07 Adhesive applicator for fixing chip-shaped electronic component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63280719A JPH0228397A (en) 1988-11-07 1988-11-07 Adhesive applicator for fixing chip-shaped electronic component

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2649683A Division JPS59152689A (en) 1983-02-18 1983-02-18 Adhesive coating device for fastening chip-shaped electronicpart

Publications (2)

Publication Number Publication Date
JPH0228397A true JPH0228397A (en) 1990-01-30
JPH0416960B2 JPH0416960B2 (en) 1992-03-25

Family

ID=17628996

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63280719A Granted JPH0228397A (en) 1988-11-07 1988-11-07 Adhesive applicator for fixing chip-shaped electronic component

Country Status (1)

Country Link
JP (1) JPH0228397A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0435761A (en) * 1990-05-31 1992-02-06 Toray Eng Co Ltd Liquid supplying apparatus
JPH04199777A (en) * 1990-11-29 1992-07-20 Sanyo Electric Co Ltd Coating apparatus
JPH04199776A (en) * 1990-11-29 1992-07-20 Sanyo Electric Co Ltd Coating apparatus
JPH04199775A (en) * 1990-11-29 1992-07-20 Sanyo Electric Co Ltd Coating apparatus

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5515270A (en) * 1978-07-19 1980-02-02 Matsushita Electric Ind Co Ltd Method of attaching electronic part
JPS57128560A (en) * 1981-02-03 1982-08-10 Canon Inc Ink jet printer

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5515270A (en) * 1978-07-19 1980-02-02 Matsushita Electric Ind Co Ltd Method of attaching electronic part
JPS57128560A (en) * 1981-02-03 1982-08-10 Canon Inc Ink jet printer

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0435761A (en) * 1990-05-31 1992-02-06 Toray Eng Co Ltd Liquid supplying apparatus
JPH04199777A (en) * 1990-11-29 1992-07-20 Sanyo Electric Co Ltd Coating apparatus
JPH04199776A (en) * 1990-11-29 1992-07-20 Sanyo Electric Co Ltd Coating apparatus
JPH04199775A (en) * 1990-11-29 1992-07-20 Sanyo Electric Co Ltd Coating apparatus

Also Published As

Publication number Publication date
JPH0416960B2 (en) 1992-03-25

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