JPS55151340A - Fabricating apparatus for hybrid integrated circuit - Google Patents

Fabricating apparatus for hybrid integrated circuit

Info

Publication number
JPS55151340A
JPS55151340A JP5991479A JP5991479A JPS55151340A JP S55151340 A JPS55151340 A JP S55151340A JP 5991479 A JP5991479 A JP 5991479A JP 5991479 A JP5991479 A JP 5991479A JP S55151340 A JPS55151340 A JP S55151340A
Authority
JP
Japan
Prior art keywords
parts
disposing
hybrid integrated
magazine
template
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5991479A
Other languages
Japanese (ja)
Other versions
JPH0682953B2 (en
Inventor
Mitsuo Osawa
Teruyoshi Noda
Iwao Ichikawa
Katsumi Yamamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP54059914A priority Critical patent/JPH0682953B2/en
Priority to US06/135,670 priority patent/US4345371A/en
Priority to CA000348985A priority patent/CA1137651A/en
Publication of JPS55151340A publication Critical patent/JPS55151340A/en
Publication of JPH0682953B2 publication Critical patent/JPH0682953B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10583—Cylindrically shaped component; Fixing means therefore
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0173—Template for holding a PCB having mounted components thereon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3415—Surface mounted components on both sides of the substrate or combined with lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

PURPOSE:To enhance the productivity of an apparatus for fabricating hybrid integrated circuir and to easily improve the disposing accuracy of the apparatus by disposing chip-like parts fed out of a hopper once on a template and then adhering them onto a circuit substrate. CONSTITUTION:Chip-like parts 1 such as capacitor or the like are contained at random in a hopper container 2. The parts 1 are intermittently supplied via a shutter unit 3 through a part feeding pipe 4 into a disposing magazine 5. The parts 1 thus introduced by the magazine 5 to predetermined position are introduced further to a disposing plate 6 and rolled laterally in vertical attitude of the parts via a laterally rolling mechanism 12. When the shutter under the plate is opened, the parts 1 are contained in the part containing recess of the template 7. The parts are adhered as shown to the printed board 10 coated with the adhesive resin 9 thereon and connected thereto via dipped solder.
JP54059914A 1979-03-14 1979-05-16 Method for manufacturing hybrid integrated circuit Expired - Lifetime JPH0682953B2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP54059914A JPH0682953B2 (en) 1979-05-16 1979-05-16 Method for manufacturing hybrid integrated circuit
US06/135,670 US4345371A (en) 1979-03-14 1980-03-31 Method and apparatus for manufacturing hybrid integrated circuits
CA000348985A CA1137651A (en) 1979-05-14 1980-04-01 Method and apparatus of manufacturing hybrid integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP54059914A JPH0682953B2 (en) 1979-05-16 1979-05-16 Method for manufacturing hybrid integrated circuit

Publications (2)

Publication Number Publication Date
JPS55151340A true JPS55151340A (en) 1980-11-25
JPH0682953B2 JPH0682953B2 (en) 1994-10-19

Family

ID=13126866

Family Applications (1)

Application Number Title Priority Date Filing Date
JP54059914A Expired - Lifetime JPH0682953B2 (en) 1979-03-14 1979-05-16 Method for manufacturing hybrid integrated circuit

Country Status (1)

Country Link
JP (1) JPH0682953B2 (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57100797A (en) * 1980-12-15 1982-06-23 Alps Electric Co Ltd Device for mounting chip part
JPS57100798A (en) * 1980-12-15 1982-06-23 Alps Electric Co Ltd Device for mounting chip part
JPS57100799A (en) * 1980-12-15 1982-06-23 Alps Electric Co Ltd Device for mounting chip part
JPS57168273U (en) * 1981-04-17 1982-10-23
JPH0229599U (en) * 1988-04-25 1990-02-26
JPH03250798A (en) * 1990-02-28 1991-11-08 Taiyo Yuden Co Ltd Chip electronic component feeder
JPH04117494U (en) * 1991-03-30 1992-10-21 太陽誘電株式会社 Chip-shaped circuit component mounting device
JPH0652194U (en) * 1992-12-19 1994-07-15 太陽誘電株式会社 Electronic component supply device

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4517377Y1 (en) * 1966-05-30 1970-07-17
JPS5216086U (en) * 1975-07-24 1977-02-04
JPS5433677A (en) * 1977-08-22 1979-03-12 Hitachi Ltd Peliet supplying unit
JPS558018A (en) * 1978-06-30 1980-01-21 Taiyo Yuden Kk Method of attaching electronic part

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4517377Y1 (en) * 1966-05-30 1970-07-17
JPS5216086U (en) * 1975-07-24 1977-02-04
JPS5433677A (en) * 1977-08-22 1979-03-12 Hitachi Ltd Peliet supplying unit
JPS558018A (en) * 1978-06-30 1980-01-21 Taiyo Yuden Kk Method of attaching electronic part

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57100797A (en) * 1980-12-15 1982-06-23 Alps Electric Co Ltd Device for mounting chip part
JPS57100798A (en) * 1980-12-15 1982-06-23 Alps Electric Co Ltd Device for mounting chip part
JPS57100799A (en) * 1980-12-15 1982-06-23 Alps Electric Co Ltd Device for mounting chip part
JPH0340520B2 (en) * 1980-12-15 1991-06-19
JPS57168273U (en) * 1981-04-17 1982-10-23
JPH0229599U (en) * 1988-04-25 1990-02-26
JPH03250798A (en) * 1990-02-28 1991-11-08 Taiyo Yuden Co Ltd Chip electronic component feeder
JPH04117494U (en) * 1991-03-30 1992-10-21 太陽誘電株式会社 Chip-shaped circuit component mounting device
JP2514459Y2 (en) * 1991-03-30 1996-10-16 太陽誘電株式会社 Chip circuit component mounting device
JPH0652194U (en) * 1992-12-19 1994-07-15 太陽誘電株式会社 Electronic component supply device

Also Published As

Publication number Publication date
JPH0682953B2 (en) 1994-10-19

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