JP7423537B2 - ゲルタイプ熱界面材料 - Google Patents
ゲルタイプ熱界面材料 Download PDFInfo
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- JP7423537B2 JP7423537B2 JP2020543090A JP2020543090A JP7423537B2 JP 7423537 B2 JP7423537 B2 JP 7423537B2 JP 2020543090 A JP2020543090 A JP 2020543090A JP 2020543090 A JP2020543090 A JP 2020543090A JP 7423537 B2 JP7423537 B2 JP 7423537B2
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- Prior art keywords
- weight
- thermally conductive
- conductive filler
- thermal interface
- molecular weight
- Prior art date
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- 239000000463 material Substances 0.000 title claims description 76
- 229920002545 silicone oil Polymers 0.000 claims description 136
- 239000011231 conductive filler Substances 0.000 claims description 128
- 239000002904 solvent Substances 0.000 claims description 43
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 41
- 229920002554 vinyl polymer Polymers 0.000 claims description 41
- 239000003054 catalyst Substances 0.000 claims description 34
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 33
- 239000003921 oil Substances 0.000 claims description 30
- 239000003112 inhibitor Substances 0.000 claims description 25
- 229910052697 platinum Inorganic materials 0.000 claims description 15
- 238000009835 boiling Methods 0.000 claims description 7
- 239000004971 Cross linker Substances 0.000 claims description 6
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 6
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical group O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 5
- RSKGMYDENCAJEN-UHFFFAOYSA-N hexadecyl(trimethoxy)silane Chemical group CCCCCCCCCCCCCCCC[Si](OC)(OC)OC RSKGMYDENCAJEN-UHFFFAOYSA-N 0.000 claims description 3
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- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000010690 paraffinic oil Substances 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000007790 solid phase Substances 0.000 description 1
- 238000005382 thermal cycling Methods 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- JNRUXZIXAXHXTN-UHFFFAOYSA-N trimethyl(2-methylbut-3-yn-2-yloxy)silane Chemical compound C#CC(C)(C)O[Si](C)(C)C JNRUXZIXAXHXTN-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
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Description
本発明は、電子部品から離れて熱を伝達するのに有用な熱界面材料(TIM)に関する。例示的な一実施形態では、TIMは、少なくとも1つのシリコーン油、少なくとも1つの触媒、比較的大きな表面積を有する少なくとも1つの熱伝導性充填剤、溶媒、少なくとも1つの阻害剤、及び少なくとも1つの架橋剤を含む。少なくとも1つの熱伝導性充填剤は、TIMの油漏れを低減し、溶媒は、当該熱伝導性充填剤によって実現される油漏れの低減を無効にすることなくTIMの流速を増大させる。
1.シリコーン油
a.概要
b.低分子量シリコーン油
1.ビニル官能性シリコーン油
c.高分子量シリコーン油
2.触媒
3.熱伝導性充填剤
4.付加阻害剤
5.カップリング剤
6.架橋剤
7.溶媒
6.熱界面材料の例示的な配合物
7.熱界面材料の例示的な特性
B.熱界面材料の形成方法
C.熱界面材料を利用する用途
表1に提示される配合に従って熱界面材料(実施例1)を調製した。次いで、実施例1の特性を比較例1の特性と比較した(比較例1)。比較例1は、また、Al2O3充填剤を有し、完全には硬化していないシリコーン系TIMである。
本明細書は以下の発明の開示を包含する。
[1]
熱界面材料であって、
50,000ダルトン未満の重量(Mw)平均分子量を有する低分子量シリコーン油と、
1.0m2/gを超える表面積を有する少なくとも1つの熱伝導性充填剤と、
少なくとも60,000ダルトンの重量(Mw)平均分子量を有するビニル官能性シリコーン油を含む高分子量シリコーン油と、
を含む、熱界面材料。
[2]
1500Pa・sを超える粘度を有する、[1]に記載の熱界面材料。
[3]
60℃~220℃の沸点及び0.2cSt~50cStの粘度を有する溶媒を更に含む、[1]に記載の熱界面材料。
[4]
150Pa・s~650Pa・sの粘度を有する、[3]に記載の熱界面材料。
[5]
2重量%~10重量%の前記低分子量シリコーン油と、
50重量%~95重量%の前記少なくとも1つの熱伝導性充填剤と、
0.1重量%~5重量%の前記高分子量シリコーン油と、
0.1重量%~5重量%の溶媒と、
0.1重量%~5重量%のカップリング剤と、
0.1重量%~1重量%の架橋剤と、
0.1重量%~5重量%の阻害剤と、
0.1重量%~5重量%の触媒と、
を含む、[1]に記載の熱界面材料。
[6]
熱界面材料であって、
50,000ダルトン未満の重量(Mw)平均分子量を有する低分子量シリコーン油と、
第1の熱伝導性充填剤、第2の熱伝導性充填剤、及び第3の熱伝導性充填剤であって、前記第1の熱伝導性充填剤が、0.1m2/g~1.0m2/gの表面積を有する金属酸化物であり、前記第2の熱伝導性充填剤が、0.5m2/g~2.0m2/gの表面積を有する金属酸化物であり、前記第3の熱伝導性充填剤が、5.0m2/g~10.0m2/gの表面積を有する金属酸化物である、第1の熱伝導性充填剤、第2の熱伝導性充填剤、及び第3の熱伝導性充填剤と、
少なくとも60,000ダルトンの重量(Mw)平均分子量を有するビニル官能性シリコーン油を含む高分子量シリコーン油と、
60℃~220℃の沸点及び0.2cSt~50cStの粘度を有する溶媒と、を含む、熱界面材料。
[7]
2重量%~10重量%の前記低分子量シリコーン油と、
25重量%~50重量%の、0.1m2/g~1.0m2/gの表面積を有する第1の熱伝導性充填剤と、
25重量%~50重量%の、0.5m2/g~2.0m2/gの表面積を有する第2の熱伝導性充填剤と、
25重量%~50重量%の、5.0m2/g~10.0m2/gの表面積を有する第3の熱伝導性充填剤と、
0.1重量%~5重量%の前記高分子量シリコーン油と、
0.1重量%~5重量%の溶媒と、
0.1重量%~5重量%のカップリング剤と、
0.1重量%~1重量%の架橋剤と、
0.1重量%~5重量%の阻害剤と、
0.1重量%~5重量%の触媒と、
を含む、[6]に記載の熱界面材料。
[8]
前記低分子量シリコーン油が、ビニル官能性シリコーン油を含み、前記高分子量シリコーン油が、2,000,000cStの絶対粘度を有するビニルシリコーン油である、[6]に記載の熱界面材料。
[9]
1mm~5mmの漏出痕跡値と、20g/分~50g/分の流速とを有する、[6]に記載の熱界面材料。
[10]
電子部品であって、
ヒートシンクと、
電子チップと、
前記ヒートシンクと前記電子チップとの間に配置されている熱界面材料であって、
50,000ダルトン未満の重量(Mw)平均分子量を有する低分子量シリコーン油と、
1.0m2/gを超える表面積を有する少なくとも1つの熱伝導性充填剤と、
少なくとも60,000ダルトンの重量(Mw)平均分子量を有するビニル官能性シリコーン油を含む高分子量シリコーン油と、
を含む、熱界面材料と、
を含む、電子部品。
Claims (3)
- 熱界面材料であって、
50,000ダルトン未満の重量(Mw)平均分子量を有し、ビニル官能性シリコーン油を含む低分子量シリコーン油と、
1.0m2/gを超える表面積を有する少なくとも1つの熱伝導性充填剤と、
少なくとも60,000ダルトンの重量(Mw)平均分子量を有し、ビニル官能性シリコーン油を含み、熱界面材料の総重量に基づいて0.1重量%~5重量%の量で含まれる、高分子量シリコーン油と、
ヒドロシリコーン油の形態の0.1重量%~1重量%の架橋剤と、
60℃~220℃の沸点温度を有する溶媒と、
を含み、
25℃及び10s-1の剪断速度で150Pa・s~650Pa・sの粘度を有する、熱界面材料。 - 2重量%~10重量%の前記低分子量シリコーン油と、
50重量%~95重量%の前記少なくとも1つの熱伝導性充填剤と、
0.1重量%~5重量%の前記高分子量シリコーン油と、
0.1重量%~5重量%の前記溶媒と、
0.1重量%~5重量%のシランカップリング剤と、
ヒドロシリコーン油の形態の0.1重量%~1重量%の前記架橋剤と、
0.1重量%~5重量%の阻害剤と、
0.1重量%~5重量%の触媒と、
を含む、請求項1に記載の熱界面材料。 - 前記少なくとも1つの熱伝導性充填剤が酸化アルミニウムであり、溶媒は揮発性溶媒であり、シランカップリング剤がヘキサデシルトリメトキシシランであり、かつ触媒が付加白金触媒である、請求項2に記載の熱界面材料。
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CN111868206A (zh) | 2020-10-30 |
US20190249007A1 (en) | 2019-08-15 |
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US11072706B2 (en) | 2021-07-27 |
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