JP7121573B2 - クリープフィード研削方法 - Google Patents

クリープフィード研削方法 Download PDF

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Publication number
JP7121573B2
JP7121573B2 JP2018138461A JP2018138461A JP7121573B2 JP 7121573 B2 JP7121573 B2 JP 7121573B2 JP 2018138461 A JP2018138461 A JP 2018138461A JP 2018138461 A JP2018138461 A JP 2018138461A JP 7121573 B2 JP7121573 B2 JP 7121573B2
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JP
Japan
Prior art keywords
grinding
plate
grinding wheel
axis direction
work
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2018138461A
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English (en)
Japanese (ja)
Other versions
JP2020015117A (ja
Inventor
聡 山中
弘樹 宮本
裕樹 阿部
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Priority to JP2018138461A priority Critical patent/JP7121573B2/ja
Priority to KR1020190080137A priority patent/KR102688369B1/ko
Priority to CN201910613284.4A priority patent/CN110788753B/zh
Priority to TW108125925A priority patent/TWI810334B/zh
Publication of JP2020015117A publication Critical patent/JP2020015117A/ja
Application granted granted Critical
Publication of JP7121573B2 publication Critical patent/JP7121573B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
    • B24B49/05—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation including the measurement of a first workpiece already machined and of another workpiece being machined and to be matched with the first one
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00—Drives or gearings; Equipment therefor
    • B24B47/20—Drives or gearings; Equipment therefor relating to feed movement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B24B41/068—Table-like supports for panels, sheets or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/06—Devices or means for dressing or conditioning abrasive surfaces of profiled abrasive wheels
    • B24B53/07—Devices or means for dressing or conditioning abrasive surfaces of profiled abrasive wheels by means of forming tools having a shape complementary to that to be produced, e.g. blocks, profile rolls

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Disintegrating Or Milling (AREA)
  • Crushing And Grinding (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
JP2018138461A 2018-07-24 2018-07-24 クリープフィード研削方法 Active JP7121573B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2018138461A JP7121573B2 (ja) 2018-07-24 2018-07-24 クリープフィード研削方法
KR1020190080137A KR102688369B1 (ko) 2018-07-24 2019-07-03 크리프 피드 연삭 방법
CN201910613284.4A CN110788753B (zh) 2018-07-24 2019-07-09 缓进给磨削方法
TW108125925A TWI810334B (zh) 2018-07-24 2019-07-23 深切緩進磨削方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018138461A JP7121573B2 (ja) 2018-07-24 2018-07-24 クリープフィード研削方法

Publications (2)

Publication Number Publication Date
JP2020015117A JP2020015117A (ja) 2020-01-30
JP7121573B2 true JP7121573B2 (ja) 2022-08-18

Family

ID=69426910

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018138461A Active JP7121573B2 (ja) 2018-07-24 2018-07-24 クリープフィード研削方法

Country Status (3)

Country Link
JP (1) JP7121573B2 (zh)
CN (1) CN110788753B (zh)
TW (1) TWI810334B (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7078681B2 (ja) * 2020-08-27 2022-05-31 株式会社ディスコ クリープフィード研削方法及び研削装置
CN113386050A (zh) * 2021-07-01 2021-09-14 西北工业大学 一种难加工镍基高温合金ic10的缓进给磨削方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009233809A (ja) 2008-03-27 2009-10-15 Tokyo Seimitsu Co Ltd ウェーハの研削方法並びにウェーハ研削装置
JP2016002598A (ja) 2014-06-13 2016-01-12 株式会社ディスコ 研削方法
JP2016010838A (ja) 2014-06-30 2016-01-21 株式会社ディスコ 研削方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3945153A (en) * 1970-08-28 1976-03-23 C.E.S. (Grinding Machines) Limited Grinding machine with tilted conveyor and conveyor clearing means
US4833831A (en) * 1986-12-29 1989-05-30 Armstrong Bros. Tool Co. Apparatus and method for sizing and finishing fixed jaw openings of open-ended wrenches
JPH02153528A (ja) * 1988-12-05 1990-06-13 Nec Corp ウェーハ表面研削機
US5498198A (en) * 1993-07-27 1996-03-12 Seiko Seiki Kabushiki Kaisha Grinding machine
JPH07186018A (ja) * 1993-12-28 1995-07-25 Hitachi Seiko Ltd 環状工作物の研削方法
JPH09150355A (ja) * 1995-11-30 1997-06-10 Thk Kk 研削盤
JP3292835B2 (ja) * 1998-05-06 2002-06-17 信越半導体株式会社 薄板ワークの平面研削方法およびその研削装置
KR100395440B1 (en) * 2002-03-23 2003-08-21 Fineacetechnology Co Ltd Polishing machine tool
CN2681852Y (zh) * 2004-03-15 2005-03-02 陈永闵 五轴向工具磨床
JP2009246240A (ja) * 2008-03-31 2009-10-22 Tokyo Seimitsu Co Ltd 半導体ウェーハ裏面の研削方法及びそれに用いる半導体ウェーハ裏面研削装置
CN102350658B (zh) * 2011-09-28 2013-08-07 大连理工大学 核主泵用流体静压密封环圆锥面超精密加工方法
JP6441056B2 (ja) * 2014-12-10 2018-12-19 株式会社ディスコ 研削装置
JP6774244B2 (ja) * 2016-07-22 2020-10-21 株式会社ディスコ 研削装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009233809A (ja) 2008-03-27 2009-10-15 Tokyo Seimitsu Co Ltd ウェーハの研削方法並びにウェーハ研削装置
JP2016002598A (ja) 2014-06-13 2016-01-12 株式会社ディスコ 研削方法
JP2016010838A (ja) 2014-06-30 2016-01-21 株式会社ディスコ 研削方法

Also Published As

Publication number Publication date
TWI810334B (zh) 2023-08-01
KR20200011355A (ko) 2020-02-03
JP2020015117A (ja) 2020-01-30
CN110788753A (zh) 2020-02-14
TW202007470A (zh) 2020-02-16
CN110788753B (zh) 2023-03-14

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