JP6264285B2 - 基板処理装置 - Google Patents

基板処理装置 Download PDF

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Publication number
JP6264285B2
JP6264285B2 JP2014516850A JP2014516850A JP6264285B2 JP 6264285 B2 JP6264285 B2 JP 6264285B2 JP 2014516850 A JP2014516850 A JP 2014516850A JP 2014516850 A JP2014516850 A JP 2014516850A JP 6264285 B2 JP6264285 B2 JP 6264285B2
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Japan
Prior art keywords
substrate
mist
substrate processing
pattern
processing apparatus
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Japanese (ja)
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JPWO2013176222A1 (ja
Inventor
圭 奈良
圭 奈良
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Nikon Corp
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Nikon Corp
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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02518—Deposited layers
    • H01L21/02521—Materials
    • H01L21/02551—Group 12/16 materials
    • H01L21/02554—Oxides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02612—Formation types
    • H01L21/02617—Deposition types
    • H01L21/02623—Liquid deposition
    • H01L21/02628—Liquid deposition using solutions
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02612—Formation types
    • H01L21/02617—Deposition types
    • H01L21/02636—Selective deposition, e.g. simultaneous growth of mono- and non-monocrystalline semiconductor materials
    • H01L21/02639—Preparation of substrate for selective deposition
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/1259—Multistep manufacturing methods

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Nonlinear Science (AREA)
  • Optics & Photonics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Mathematical Physics (AREA)
  • Thin Film Transistor (AREA)
  • Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
  • Spray Control Apparatus (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Nozzles (AREA)
  • Electroluminescent Light Sources (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Special Spraying Apparatus (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Chemically Coating (AREA)
  • Chemical Vapour Deposition (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Formation Of Insulating Films (AREA)
JP2014516850A 2012-05-24 2013-05-23 基板処理装置 Active JP6264285B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2014516850A JP6264285B2 (ja) 2012-05-24 2013-05-23 基板処理装置

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2012118617 2012-05-24
JP2012118617 2012-05-24
PCT/JP2013/064381 WO2013176222A1 (ja) 2012-05-24 2013-05-23 基板処理装置、及びデバイス製造方法
JP2014516850A JP6264285B2 (ja) 2012-05-24 2013-05-23 基板処理装置

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP2017218647A Division JP6424940B2 (ja) 2012-05-24 2017-11-13 ミストによる成膜装置
JP2017218648A Division JP6428896B2 (ja) 2012-05-24 2017-11-13 基板処理方法

Publications (2)

Publication Number Publication Date
JPWO2013176222A1 JPWO2013176222A1 (ja) 2016-01-14
JP6264285B2 true JP6264285B2 (ja) 2018-01-24

Family

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Family Applications (6)

Application Number Title Priority Date Filing Date
JP2014516850A Active JP6264285B2 (ja) 2012-05-24 2013-05-23 基板処理装置
JP2017218647A Active JP6424940B2 (ja) 2012-05-24 2017-11-13 ミストによる成膜装置
JP2017218648A Active JP6428896B2 (ja) 2012-05-24 2017-11-13 基板処理方法
JP2018199988A Active JP6638792B2 (ja) 2012-05-24 2018-10-24 ミストによる成膜方法
JP2019234591A Pending JP2020074411A (ja) 2012-05-24 2019-12-25 ミスト成膜装置
JP2021173267A Active JP7222416B2 (ja) 2012-05-24 2021-10-22 デバイス製造装置

Family Applications After (5)

Application Number Title Priority Date Filing Date
JP2017218647A Active JP6424940B2 (ja) 2012-05-24 2017-11-13 ミストによる成膜装置
JP2017218648A Active JP6428896B2 (ja) 2012-05-24 2017-11-13 基板処理方法
JP2018199988A Active JP6638792B2 (ja) 2012-05-24 2018-10-24 ミストによる成膜方法
JP2019234591A Pending JP2020074411A (ja) 2012-05-24 2019-12-25 ミスト成膜装置
JP2021173267A Active JP7222416B2 (ja) 2012-05-24 2021-10-22 デバイス製造装置

Country Status (4)

Country Link
JP (6) JP6264285B2 (ko)
KR (5) KR102057813B1 (ko)
CN (2) CN104488071B (ko)
WO (1) WO2013176222A1 (ko)

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TWI762439B (zh) * 2015-02-18 2022-05-01 日商尼康股份有限公司 薄膜製造裝置、及薄膜製造方法
KR101653347B1 (ko) * 2015-11-27 2016-09-01 한국기계연구원 유연기판에 코팅용 용액을 코팅하는 장치
JP6666779B2 (ja) * 2016-04-11 2020-03-18 株式会社小森コーポレーション 電子デバイス製造装置
CN109414718A (zh) * 2016-07-11 2019-03-01 东芝三菱电机产业***株式会社 雾滴涂布成膜装置及雾滴涂布成膜方法
CN106827786B (zh) * 2017-02-16 2019-04-05 中国科学技术大学 一种非接触式连续辊动装置
CN111491746B (zh) 2017-12-22 2022-04-29 富士胶片株式会社 成膜方法
WO2019234917A1 (ja) * 2018-06-08 2019-12-12 東芝三菱電機産業システム株式会社 成膜装置
CN112752616B (zh) 2018-08-01 2023-07-14 株式会社尼康 雾发生装置以及雾成膜方法和雾成膜装置
JP7293955B2 (ja) * 2019-08-01 2023-06-20 凸版印刷株式会社 パターン形成方法およびパターン形成装置
CN110588186B (zh) * 2019-08-07 2020-07-10 华中科技大学 一种喷墨打印柔性显示器件制造***及方法
JP7446854B2 (ja) * 2020-03-02 2024-03-11 住友重機械工業株式会社 インク塗布装置、インク塗布装置の制御装置、及びインク塗布方法
JP2023100212A (ja) * 2022-01-05 2023-07-18 信越化学工業株式会社 成膜装置および成膜方法
CN217181402U (zh) * 2022-01-14 2022-08-12 宁德时代新能源科技股份有限公司 一种基材处理的设备
WO2023234118A1 (ja) * 2022-06-03 2023-12-07 東洋紡株式会社 光電変換素子及びその製造方法

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WO2011126132A1 (ja) * 2010-04-09 2011-10-13 株式会社ニコン 基板処理装置
JP5573521B2 (ja) * 2010-09-09 2014-08-20 セイコーエプソン株式会社 液体吐出装置及び液体吐出方法
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Also Published As

Publication number Publication date
KR101967589B1 (ko) 2019-04-09
WO2013176222A1 (ja) 2013-11-28
CN107256824A (zh) 2017-10-17
CN104488071A (zh) 2015-04-01
JP2020074411A (ja) 2020-05-14
CN104488071B (zh) 2017-10-13
JP2019023354A (ja) 2019-02-14
JP6424940B2 (ja) 2018-11-21
KR102314386B1 (ko) 2021-10-19
JP6428896B2 (ja) 2018-11-28
KR101823728B1 (ko) 2018-01-30
KR20190039609A (ko) 2019-04-12
JP2018067717A (ja) 2018-04-26
JP6638792B2 (ja) 2020-01-29
KR20180006489A (ko) 2018-01-17
JP2018076591A (ja) 2018-05-17
KR102057813B1 (ko) 2019-12-19
KR20200105981A (ko) 2020-09-09
KR20150016947A (ko) 2015-02-13
JP7222416B2 (ja) 2023-02-15
JPWO2013176222A1 (ja) 2016-01-14
JP2022020691A (ja) 2022-02-01
KR20190141027A (ko) 2019-12-20

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