JP6091867B2 - 搬送機構 - Google Patents

搬送機構 Download PDF

Info

Publication number: JP6091867B2
Authority: JP; Japan
Prior art keywords: plate; workpiece; holding; guide pin; moving
Prior art date: 2012-12-04
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Active

Application number

JP2012264917A

Other languages

English (en)

Japanese (ja)

Other versions

JP2014110364A (ja

Inventor

山田　智広

智広山田

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Disco Corp

Original Assignee

Disco Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2012-12-04

Filing date

2012-12-04

Publication date

2017-03-08

2012-12-04 Application filed by Disco Corp filed Critical Disco Corp

2012-12-04 Priority to JP2012264917A priority Critical patent/JP6091867B2/ja

2013-11-22 Priority to CN201310596891.7A priority patent/CN103855064B/zh

2014-06-12 Publication of JP2014110364A publication Critical patent/JP2014110364A/ja

2017-03-08 Application granted granted Critical

2017-03-08 Publication of JP6091867B2 publication Critical patent/JP6091867B2/ja

Status Active legal-status Critical Current

2032-12-04 Anticipated expiration legal-status Critical

Links

230000007723 transport mechanism Effects 0.000 title claims description 37
210000000078 claw Anatomy 0.000 claims description 100
230000002093 peripheral effect Effects 0.000 claims description 40
230000007246 mechanism Effects 0.000 claims description 29
230000033001 locomotion Effects 0.000 claims description 14
230000008602 contraction Effects 0.000 claims description 6
230000032258 transport Effects 0.000 description 10
238000009434 installation Methods 0.000 description 6
238000012423 maintenance Methods 0.000 description 3
NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 3
230000003111 delayed effect Effects 0.000 description 2
238000010586 diagram Methods 0.000 description 2
230000000694 effects Effects 0.000 description 2
JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
229910001218 Gallium arsenide Inorganic materials 0.000 description 1
239000000919 ceramic Substances 0.000 description 1
229910010293 ceramic material Inorganic materials 0.000 description 1
238000004140 cleaning Methods 0.000 description 1
238000012937 correction Methods 0.000 description 1
238000013461 design Methods 0.000 description 1
239000011521 glass Substances 0.000 description 1
229910010272 inorganic material Inorganic materials 0.000 description 1
239000011147 inorganic material Substances 0.000 description 1
238000012986 modification Methods 0.000 description 1
230000004048 modification Effects 0.000 description 1
TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
238000012545 processing Methods 0.000 description 1
239000004065 semiconductor Substances 0.000 description 1
229910052710 silicon Inorganic materials 0.000 description 1
239000010703 silicon Substances 0.000 description 1
239000000758 substrate Substances 0.000 description 1
238000012546 transfer Methods 0.000 description 1

Images

Classifications

- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Landscapes

Engineering & Computer Science (AREA)
Physics & Mathematics (AREA)
Condensed Matter Physics & Semiconductors (AREA)
General Physics & Mathematics (AREA)
Manufacturing & Machinery (AREA)
Computer Hardware Design (AREA)
Microelectronics & Electronic Packaging (AREA)
Power Engineering (AREA)
Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Manipulator (AREA)

JP2012264917A 2012-12-04 2012-12-04 搬送機構 Active JP6091867B2 (ja)

Priority Applications (2)

Application Number	Priority Date	Filing Date	Title
JP2012264917A JP6091867B2 (ja)	2012-12-04	2012-12-04	搬送機構
CN201310596891.7A CN103855064B (zh)	2012-12-04	2013-11-22	搬送机构

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP2012264917A JP6091867B2 (ja)	2012-12-04	2012-12-04	搬送機構

Publications (2)

Publication Number	Publication Date
JP2014110364A JP2014110364A (ja)	2014-06-12
JP6091867B2 true JP6091867B2 (ja)	2017-03-08

Family

ID=50862551

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP2012264917A Active JP6091867B2 (ja)	2012-12-04	2012-12-04	搬送機構

Country Status (2)

Country	Link
JP (1)	JP6091867B2 (zh)
CN (1)	CN103855064B (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP2017183665A (ja) *	2016-03-31	2017-10-05	芝浦メカトロニクス株式会社	基板搬送装置、基板処理装置及び基板処理方法
JP6811951B2 (ja) *	2017-02-03	2021-01-13	株式会社ディスコ	搬送機構
JP6975056B2 (ja) *	2018-01-29	2021-12-01	株式会社ディスコ	搬送機構
CN117878044B (zh) *	2024-03-12	2024-06-04	四川富美达微电子股份有限公司	一种引线框架转移***

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH075991Y2 (ja) *	1988-05-31	1995-02-15	株式会社明電舎	搬送ハンド
JP4147358B2 (ja) *	1998-12-07	2008-09-10	澁谷工業株式会社	ワーク把持装置
JP2002043393A (ja) *	2000-07-25	2002-02-08	Assist Japan Kk	ノッチ合わせ装置
JP2004083180A (ja) *	2002-08-26	2004-03-18	Sharp Corp	シート状基板の搬送装置及び搬送方法
JP4614455B2 (ja) *	2006-04-19	2011-01-19	東京エレクトロン株式会社	基板搬送処理装置

2012
- 2012-12-04 JP JP2012264917A patent/JP6091867B2/ja active Active
2013
- 2013-11-22 CN CN201310596891.7A patent/CN103855064B/zh active Active

Also Published As

Publication number	Publication date
CN103855064A (zh)	2014-06-11
JP2014110364A (ja)	2014-06-12
CN103855064B (zh)	2018-04-17

Legal Events

Date	Code	Title	Description
2015-10-20	A621	Written request for application examination	Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20151020
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2016-09-13	A131	Notification of reasons for refusal	Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20160913
2016-11-11	A521	Request for written amendment filed	Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20161111
2016-12-26	TRDD	Decision of grant or rejection written
2017-01-10	A01	Written decision to grant a patent or to grant a registration (utility model)	Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20170110
2017-02-16	A61	First payment of annual fees (during grant procedure)	Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20170208
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