JP2017183665A - 基板搬送装置、基板処理装置及び基板処理方法 - Google Patents
基板搬送装置、基板処理装置及び基板処理方法 Download PDFInfo
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Abstract
Description
第1の実施形態について図1から図12を参照して説明する。
図1に示すように、第1の実施形態に係る基板処理装置10は、複数の開閉ユニット(収納部)11と、第1の搬送ロボット(基板搬送装置)12と、バッファユニット(収納部)13と、第2の搬送ロボット(基板搬送装置)14と、複数の基板処理部15と、装置付帯ユニット16とを備えている。
次に、前述の第2の搬送ロボット14について図2から図6を参照して説明する。なお、図3では、第2の搬送ロボット14の把持機構が見えるように示されている。
次に、第1のアームユニット14aについて詳しく説明する。
次に、前述の基板処理装置10が行う基板処理の流れについて説明する。なお、基板Wに対して2種類の処理を行う場合には、図1において、上下に延びる第2のロボット搬送路を挟んで左側の4つの処理室15a(以下、第1の処理室15aとすることがある)と、右側の4つの処理室15a(以下、第2の処理室15aとすることがある)が異なる処理を行うように設定されている。異なる処理を行う場合、第1の処理室は、第1の処理が行われる処理室であり、第2の処理室は、第1の処理の次の処理(第2の処理)が行われる処理室である。
次いで、前述の基板処理工程において、第2の搬送ロボット14が行う基板搬送の流れについて図7から図12を参照して詳しく説明する。まず、第2の搬送ロボット14とバッファユニット13との基板Wの受け渡しについて説明する。
第2の実施形態について図13から図19を参照して説明する。なお、第2の実施形態では、第1の実施形態との相違点(基板昇降部)について説明し、その他の説明を省略する。
次に、第2の搬送ロボット14と処理室15aとの基板Wの受け渡しについて図14から図19を参照して説明する。
前述の各実施形態においては、上下のアームユニット14a、14bの両方に上下爪(第1の爪部21b及び第2の爪部22b)を適用することを例示したが、これに限るものではなく、例えば、上のアームユニット14aの片方だけに適用することも可能である。また、第1の爪部21b及び第2の爪部22bを同じ構造することも可能であり、第2の搬送ロボット14の構造を第1の搬送ロボット12に適用することも可能である。上下爪(第1の爪部21b及び第2の爪部22b)は二つ以上であればよく、その数は特に限定されるものではない。
11 開閉ユニット
12 第1の搬送ロボット
13 バッファユニット
14 第2の搬送ロボット
14d 昇降回転部
15 基板処理部
16b 制御ユニット
21 第1の把持板
21b 第1の爪部
22 第2の把持板
22b 第2の爪部
23 把持部
33 基板昇降部
21b1 上爪
21b2 下爪
M1a 当接面
M1b 当接面
M2a 当接面
M2b 当接面
W 基板
Claims (6)
- 第1の把持板と、
前記第1の把持板により支持され、基板の外周面に当接する当接面を前記第1の把持板の表面に対して上下に有する第1の爪部と、
前記第1の把持板に重なるように設けられた第2の把持板と、
前記第2の把持板により支持され、前記基板の外周面に当接する当接面を前記第1の把持板の表面に対して上下に有する第2の爪部と、
前記第1の爪部及び前記第2の爪部が前記基板の外周面に交わる方向に接離するように、前記第1の把持板及び前記第2の把持板を相対移動させる把持部と、
を備えることを特徴とする基板搬送装置。 - 前記第1の爪部は、
前記第1の把持板の上面に設けられ、前記当接面を有する上爪と、
前記第1の把持板の下面に設けられ、前記当接面を有する下爪と、
を有することを特徴とする請求項1に記載の基板搬送装置。 - 前記把持部を昇降させる昇降部と、
所定間隔で積層された複数の基板のうち第1の基板を把持する第1の高さ位置から、前記第1の基板の上又は下に位置する第2の基板を把持する第2の高さ位置に前記第1の爪部及び前記第2の爪部を位置付けるよう、前記昇降部に前記把持部の上昇又は下降を実行させ、前記把持部に前記第1の把持板及び前記第2の把持板の相対移動を実行させる制御部と、
をさらに備えることを特徴とする請求項1又は請求項2に記載の基板搬送装置。 - 複数の基板を所定間隔で積層して収納する収納部と、
請求項1から請求項3のいずれか一項に記載の基板搬送装置と、
前記基板を処理する基板処理部と、
を備えることを特徴とする基板処理装置。 - 前記基板処理部は、前記基板を昇降させる基板昇降部を有することを特徴とする請求項4に記載の基板処理装置。
- 複数の基板を所定間隔で積層して収納する収納部から、請求項1から請求項3のいずれか一項に記載の基板搬送装置を用いて第1の基板を取り出す工程と、
前記収納部から取り出された前記第1の基板に処理を行う工程と、
前記処理が行われた前記第1の基板を、前記基板搬送装置を用いて前記収納部に収納する工程と、
前記収納部に収納された前記第1の基板の上又は下に位置する第2の基板を、前記基板搬送装置を用いて前記収納部から取り出す工程と、
前記収納部から取り出された前記第2の基板に処理を行う工程と、
前記処理が行われた前記第2の基板を、前記基板搬送装置を用いて前記収納部に収納する工程と、
を有することを特徴とする基板処理方法。
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