JP6091867B2 - 搬送機構 - Google Patents
搬送機構 Download PDFInfo
- Publication number
- JP6091867B2 JP6091867B2 JP2012264917A JP2012264917A JP6091867B2 JP 6091867 B2 JP6091867 B2 JP 6091867B2 JP 2012264917 A JP2012264917 A JP 2012264917A JP 2012264917 A JP2012264917 A JP 2012264917A JP 6091867 B2 JP6091867 B2 JP 6091867B2
- Authority
- JP
- Japan
- Prior art keywords
- plate
- workpiece
- holding
- guide pin
- moving
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 230000007723 transport mechanism Effects 0.000 title claims description 37
- 210000000078 claw Anatomy 0.000 claims description 100
- 230000002093 peripheral effect Effects 0.000 claims description 40
- 230000007246 mechanism Effects 0.000 claims description 29
- 230000033001 locomotion Effects 0.000 claims description 14
- 230000008602 contraction Effects 0.000 claims description 6
- 230000032258 transport Effects 0.000 description 10
- 238000009434 installation Methods 0.000 description 6
- 238000012423 maintenance Methods 0.000 description 3
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 3
- 230000003111 delayed effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Manipulator (AREA)
Description
2 保持テーブル
4 保持部
21 保持面
41 保持爪ベース
42 ピンベース
43 引張りバネ
44 移動部
46 保持爪
47 ガイドピン
52 下側スライダー(第2のスライダー)
55 上側スライダー(第1のスライダー)
64 規制突起
W 板状ワーク
Claims (1)
- 円形の板状ワークの下面を保持する保持面を有する保持テーブルに、板状ワークの外周部を保持する保持部で保持して板状ワークを搬送させる搬送機構であって、
該保持部は、板状ワークの外周部における側面および下面に接触させる保持爪と、該保持爪に併設され板状ワークの側面に接触させるガイドピンと、該ガイドピンを板状ワークの径方向で中心に向かってバネ力を付与する引張りバネと、該引張りバネによって移動する該ガイドピンを方向付ける第1のスライダーと、で構成され、
該保持部の移動を板状ワークの径方向に方向付ける第2のスライダーと、該保持部を径方向に移動させる移動部と、を備え、
該ガイドピンは内部バネによって上下方向に伸縮代が設けられており、
板状ワークを保持する時は、該移動部の作動で少なくとも3つの該保持部が板状ワークの径方向で中心に向かって移動する事によって、該ガイドピンが板状ワークの側面に接触すると共に、該保持爪が板状ワークの外周部における側面および下面に接触して板状ワークを保持して、
板状ワークを開放する時は、該移動部の作動で少なくとも3つの該保持部が板状ワークの径方向で外側に向かって移動する事によって、該ガイドピンを残して該保持爪を板状ワークの外側に移動させ、板状ワークの外周部から該保持爪を離間させるが、該引張りバネのバネ力によって該ガイドピンを板状ワーク側面に接触し続け、該搬送機構が保持する板状ワークを該保持面に対して平行な方向の位置を維持して該保持テーブルに板状ワークを搬送させた後、該移動部の作動で少なくとも3つの該保持部が板状ワークの径方向で外側に向かって移動する事によって、該保持爪と一体に該ガイドピンを板状ワークの外側に移動させ、板状ワークの外周部から該ガイドピンを離間させる事を特徴とする搬送機構。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012264917A JP6091867B2 (ja) | 2012-12-04 | 2012-12-04 | 搬送機構 |
CN201310596891.7A CN103855064B (zh) | 2012-12-04 | 2013-11-22 | 搬送机构 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012264917A JP6091867B2 (ja) | 2012-12-04 | 2012-12-04 | 搬送機構 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014110364A JP2014110364A (ja) | 2014-06-12 |
JP6091867B2 true JP6091867B2 (ja) | 2017-03-08 |
Family
ID=50862551
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012264917A Active JP6091867B2 (ja) | 2012-12-04 | 2012-12-04 | 搬送機構 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP6091867B2 (ja) |
CN (1) | CN103855064B (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017183665A (ja) * | 2016-03-31 | 2017-10-05 | 芝浦メカトロニクス株式会社 | 基板搬送装置、基板処理装置及び基板処理方法 |
JP6811951B2 (ja) * | 2017-02-03 | 2021-01-13 | 株式会社ディスコ | 搬送機構 |
JP6975056B2 (ja) * | 2018-01-29 | 2021-12-01 | 株式会社ディスコ | 搬送機構 |
CN117878044B (zh) * | 2024-03-12 | 2024-06-04 | 四川富美达微电子股份有限公司 | 一种引线框架转移*** |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH075991Y2 (ja) * | 1988-05-31 | 1995-02-15 | 株式会社明電舎 | 搬送ハンド |
JP4147358B2 (ja) * | 1998-12-07 | 2008-09-10 | 澁谷工業株式会社 | ワーク把持装置 |
JP2002043393A (ja) * | 2000-07-25 | 2002-02-08 | Assist Japan Kk | ノッチ合わせ装置 |
JP2004083180A (ja) * | 2002-08-26 | 2004-03-18 | Sharp Corp | シート状基板の搬送装置及び搬送方法 |
JP4614455B2 (ja) * | 2006-04-19 | 2011-01-19 | 東京エレクトロン株式会社 | 基板搬送処理装置 |
-
2012
- 2012-12-04 JP JP2012264917A patent/JP6091867B2/ja active Active
-
2013
- 2013-11-22 CN CN201310596891.7A patent/CN103855064B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
JP2014110364A (ja) | 2014-06-12 |
CN103855064A (zh) | 2014-06-11 |
CN103855064B (zh) | 2018-04-17 |
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