JP5938111B2 - 感圧センサ - Google Patents
感圧センサ Download PDFInfo
- Publication number
- JP5938111B2 JP5938111B2 JP2014559737A JP2014559737A JP5938111B2 JP 5938111 B2 JP5938111 B2 JP 5938111B2 JP 2014559737 A JP2014559737 A JP 2014559737A JP 2014559737 A JP2014559737 A JP 2014559737A JP 5938111 B2 JP5938111 B2 JP 5938111B2
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- JP
- Japan
- Prior art keywords
- electrode
- electrode layer
- substrate
- pressure
- spacer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
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Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/20—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
- G01L1/22—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges
- G01L1/2287—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges constructional details of the strain gauges
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/0042—Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms
- G01L9/0044—Constructional details of non-semiconductive diaphragms
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/0051—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance
- G01L9/0052—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Force Measurement Appropriate To Specific Purposes (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013019176 | 2013-02-04 | ||
JP2013019176 | 2013-02-04 | ||
PCT/JP2014/052083 WO2014119658A1 (ja) | 2013-02-04 | 2014-01-30 | 感圧センサ |
Publications (2)
Publication Number | Publication Date |
---|---|
JP5938111B2 true JP5938111B2 (ja) | 2016-06-22 |
JPWO2014119658A1 JPWO2014119658A1 (ja) | 2017-01-26 |
Family
ID=51262369
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014559737A Active JP5938111B2 (ja) | 2013-02-04 | 2014-01-30 | 感圧センサ |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5938111B2 (zh) |
CN (1) | CN104884920B (zh) |
TW (1) | TWI586946B (zh) |
WO (1) | WO2014119658A1 (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6316371B2 (ja) * | 2016-10-13 | 2018-04-25 | Nissha株式会社 | 圧力センサ |
WO2019200463A1 (en) | 2018-04-16 | 2019-10-24 | Orpyx Medical Technologies Inc. | High-resistance sensor and method for using same |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4978775U (zh) * | 1972-10-26 | 1974-07-08 | ||
JP2001165788A (ja) * | 1999-12-06 | 2001-06-22 | Alps Electric Co Ltd | 感圧装置 |
JP2002131155A (ja) * | 2000-10-30 | 2002-05-09 | Denso Corp | 感圧抵抗センサ |
JP2008175570A (ja) * | 2007-01-16 | 2008-07-31 | Fujikura Ltd | 感圧メンブレンセンサ |
WO2009075403A1 (en) * | 2007-12-10 | 2009-06-18 | Korea Research Institute Of Standards And Science | High-temperature tactile sensor and method of manufacturing the same |
WO2011024902A1 (ja) * | 2009-08-28 | 2011-03-03 | 日本写真印刷株式会社 | 圧力検出ユニット及び圧力検出装置 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3771425B2 (ja) * | 2000-07-04 | 2006-04-26 | 株式会社山武 | 容量式圧力センサおよびその製造方法 |
JP3980300B2 (ja) * | 2000-09-07 | 2007-09-26 | 株式会社フジクラ | 膜状感圧抵抗体および感圧センサ |
JP4216525B2 (ja) * | 2002-05-13 | 2009-01-28 | 株式会社ワコー | 加速度センサおよびその製造方法 |
JP2004028883A (ja) * | 2002-06-27 | 2004-01-29 | Denso Corp | 感圧センサ |
JP2004205377A (ja) * | 2002-12-25 | 2004-07-22 | Kyocera Corp | 圧力検出装置用パッケージ |
CN100346143C (zh) * | 2004-12-17 | 2007-10-31 | 电子科技大学 | 一种复合封装的箔式锰铜超高压力传感器 |
CN101079342B (zh) * | 2007-05-28 | 2010-09-08 | 上海神沃电子有限公司 | 表面贴装型高分子esd保护元件及其制备方法 |
-
2014
- 2014-01-29 TW TW103103434A patent/TWI586946B/zh not_active IP Right Cessation
- 2014-01-30 WO PCT/JP2014/052083 patent/WO2014119658A1/ja active Application Filing
- 2014-01-30 JP JP2014559737A patent/JP5938111B2/ja active Active
- 2014-01-30 CN CN201480003666.0A patent/CN104884920B/zh not_active Expired - Fee Related
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4978775U (zh) * | 1972-10-26 | 1974-07-08 | ||
JP2001165788A (ja) * | 1999-12-06 | 2001-06-22 | Alps Electric Co Ltd | 感圧装置 |
JP2002131155A (ja) * | 2000-10-30 | 2002-05-09 | Denso Corp | 感圧抵抗センサ |
JP2008175570A (ja) * | 2007-01-16 | 2008-07-31 | Fujikura Ltd | 感圧メンブレンセンサ |
WO2009075403A1 (en) * | 2007-12-10 | 2009-06-18 | Korea Research Institute Of Standards And Science | High-temperature tactile sensor and method of manufacturing the same |
WO2011024902A1 (ja) * | 2009-08-28 | 2011-03-03 | 日本写真印刷株式会社 | 圧力検出ユニット及び圧力検出装置 |
Also Published As
Publication number | Publication date |
---|---|
JPWO2014119658A1 (ja) | 2017-01-26 |
CN104884920A (zh) | 2015-09-02 |
CN104884920B (zh) | 2017-03-15 |
TWI586946B (zh) | 2017-06-11 |
WO2014119658A1 (ja) | 2014-08-07 |
TW201447249A (zh) | 2014-12-16 |
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